scholarly journals Three-dimensional measurements of plasma parameters in an inductively coupled plasma processing chamber

2019 ◽  
Vol 26 (10) ◽  
pp. 103503 ◽  
Author(s):  
Jia Han ◽  
Patrick Pribyl ◽  
Walter Gekelman ◽  
Alex Paterson ◽  
Steven J. Lanham ◽  
...  
Keyword(s):  
Inductively Coupled Plasma ◽  
Three Dimensional ◽  
Plasma Processing ◽  
Plasma Parameters ◽  
Inductively Coupled ◽  
Dimensional Measurements

Three-Dimensional Discharge Simulation of Inductively Coupled Plasma Etcher

2007 ◽  
Author(s):  
Jia Cheng ◽  
Yu Zhu ◽  
Guanghong Duan ◽  
Yangying Chen
Keyword(s):  
Electron Temperature ◽  
Inductively Coupled Plasma ◽  
Three Dimensional ◽  
Argon Plasma ◽  
Plasma Parameters ◽  
Inductively Coupled ◽  
Parameters Selection ◽  
Dimensional Distribution ◽  
Discharge Model ◽  
Discharge Simulation

Based on the commercial software, CFD-ACE+, a three-dimensional discharge model of an inductively coupled plasma (ICP) etcher was built. The spatial distributions of the electron temperature and the electron number density (END) of the argon plasma were simulated at 10 mTorr, 200 W and 200 sccm. One-dimensional distribution profiles of the plasma parameters above the wafer’s surface at different pressures and powers were compared. These results demonstrate that the END increases with both pressure and power. And the electron temperature decreases with pressure. The methods and conclusions can be used to provide some reference for the configurations of the chamber and the coil of the ICP equipment design and improvement and process parameters selection.

A REVERSIBLE OPTICAL SENSOR BASED ON CHITOSAN FILM FOR THE SELECTIVE DETECTION OF COPPER IONS

2012 ◽  
Vol 24 (05) ◽  
pp. 453-459 ◽  
Author(s):  
Shenhsiung Lin ◽  
Chia-Chen Chang ◽  
Chii-Wann Lin
Keyword(s):  
Functional Groups ◽  
Inductively Coupled Plasma ◽  
Copper Ions ◽  
Three Dimensional ◽  
Copper Ion ◽  
Chitosan Film ◽  
Detection Limits ◽  
Dimensional Structure ◽  
Optical Detectors ◽  
Inductively Coupled

Heavy metals greatly influence animal physiology, even at small doses. Among these metals, the copper ion is of great concern due to its effects on humans and wide applications in industry. Compared to atomic absorption spectroscopy and inductively coupled plasma-mass spectrometry, which destroy the samples that are analyzed, optical techniques do not decompose the analyte and have become a popular field of recent research. In this paper, we combined a novel optical detector that did not require sample-labeling, called surface plasmon resonance (SPR), with chitosan to detect copper ions by modifying the functional groups of chitosan through pH modification. Compared to other optical detectors, the SPR system was relatively fast and involved fewer experimental confounding factors. The three-dimensional structure of chitosan was used to obtain lower detection limits. Moreover, modification of the chitosan functional groups resulted in efficient regeneration by controlling the pH. A detection limit of 0.1 μM was obtained (linear range: 0.5–10 μM, R2 = 0.976), and the specificity was certified by comparing the copper ion with six other ions. Additionally, we successfully regenerated the SPR chips by modifying the functional groups. In conclusion, the chitosan–SPR system detected copper ions with improved detection limits using a quick and simple regeneration method.

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