Low resistivity of graphene nanoribbons with zigzag-dominated edge fabricated by hydrogen plasma etching combined with Zn/HCl pretreatment

2017 ◽  
Vol 111 (20) ◽  
pp. 203102 ◽  
Author(s):  
Fengkui Liu ◽  
Qi Li ◽  
Rubing Wang ◽  
Jianbao Xu ◽  
Junxiong Hu ◽  
...  
2002 ◽  
Vol 722 ◽  
Author(s):  
Maria Losurdo ◽  
MariaMichela Giangregorio ◽  
Pio Capezzuto ◽  
Giovanni Bruno ◽  
Gon Namkoong ◽  
...  

AbstractThe use of dry hydrogen plasma etching is evaluated for determination of GaN polarity and critically compared to wet etching in NaOH. It is shown that hydrogen plasma etching is effective in revealing inversion domains (IDs) and some types of dislocations. This is because the surface morphology is unchanged by the hydrogen treatment, and, hence, the surface reactivity is not masked.


2000 ◽  
Vol 88 (10) ◽  
pp. 5597-5604 ◽  
Author(s):  
P. Reinke ◽  
P. Oelhafen ◽  
H. Feldermann ◽  
C. Ronning ◽  
H. Hofsäss

2018 ◽  
Vol 455 ◽  
pp. 1179-1184 ◽  
Author(s):  
Leonardo M. Leidens ◽  
Ângela E. Crespi ◽  
Carla D. Boeira ◽  
Fernando G. Echeverrigaray ◽  
Carlos A. Figueroa

2019 ◽  
Vol 123 (36) ◽  
pp. 22665-22673 ◽  
Author(s):  
Tomohiro Matsui ◽  
Hideki Sato ◽  
Kazuma Kita ◽  
André E. B. Amend ◽  
Hiroshi Fukuyama

1991 ◽  
Vol 219 ◽  
Author(s):  
Y. S. Tsuo ◽  
Y. Xu ◽  
D. W. Baker ◽  
S.K Deb

ABSTRACTWe have studied wet-chemical and dry etching properties of doped and undoped hydrogenated amorphous silicon (a-Si:H) films with bonded hydrogen content varying from 0 to 20 at.%. Etching processes studied include (1) wet-chemical etching using solutions of KOH, isopropyl alcohol (IPA), and H2O, (2) hydrogen plasma etching, and (3) XeF2 vapor etching.


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