scholarly journals Research on dynamic model of printed circuit board based on finite element method

2017 ◽  
Author(s):  
Hui Wei ◽  
Liangjun Xu
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Dynamic Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Element Method

scholarly journals Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 833 ◽  
Author(s):  
Thomas Glatzl ◽  
Roman Beigelbeck ◽  
Samir Cerimovic ◽  
Harald Steiner ◽  
Albert Treytl
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Printed Circuit Board ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Fem Simulations ◽  
Printed Circuit ◽  
Thermal Flow Sensor ◽  
Element Method

We present finite element method (FEM) simulations of a thermal flow sensor as well as a comparison to measurement results. The thermal sensor is purely based on printed circuit board (PCB) technology, designed for heating, ventilation, and air conditioning (HVAC) systems. Design and readout method of the sensor enables the possibility to measure the flow velocity in various fluids. 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulations enable a fast and easy way to evaluate the sensor’s behaviour in different fluids. The results of the FEM simulations are compared to measurements in a real environment, proving the credibility of the model.

Analysis on the Drop of PCB Packaged by Cushion Material Based on Finite Element Method

2013 ◽  
Vol 288 ◽  
pp. 303-307
Author(s):  
Gai Mei Zhang ◽  
Heng Yi Guo ◽  
Yue Lou ◽  
Qi Lu Tao ◽  
Wei Yuan ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Elastic Modulus ◽  
Printed Circuit Board ◽  
Impact Force ◽  
Circuit Board ◽  
Drop Height ◽  
Printed Circuit ◽  
Finite Element Software ◽  
The Impact

This paper analyzes the stress of the printed circuit board (PCB) packaged by cushion materials after drop and investigates the stress of PCB under the different drop height, different cushion materials and different drop ground using ANSYS finite element software. The stress of PCB is analyzed quantitatively and qualitatively after drop, the results show: (1) The stress of the product is effected by drop height and the performance of dropping ground in a large extent; (2) The protect performance varies with the ways of cushioning packaging; (3) Within a certain range, the cushion material with smaller elastic modulus is better due to absorb the impact more energy and can bear the impact force is greater.

Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test

2009 ◽  
Vol 419-420 ◽  
pp. 37-40
Author(s):  
Shiuh Chuan Her ◽  
Shien Chin Lan ◽  
Chun Yen Liu ◽  
Bo Ren Yao
Keyword(s):  
Finite Element ◽  
Experimental Measurement ◽  
Test Specimen ◽  
Printed Circuit Board ◽  
Drop Impact ◽  
Simulation Technique ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Impact

Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-DYNA is applied to compute the impact acceleration and dynamic strain on the test specimen during the drop impact. The finite element results are compared to the experimental measurement of acceleration with good correlation between simulation and drop testing. With the accurate simulation technique, one is capable of predicting the impact response and characterizing the failure mode prior to real reliability test.

An impact crushing dynamic model of waste printed circuit board particles

2012 ◽  
Vol 39 (8) ◽  
pp. 3611-3630 ◽  
Author(s):  
Shibing Hou ◽  
Yunxia He ◽  
Deming Yang ◽  
Zhenming Xu
Keyword(s):  
Dynamic Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Waste Printed Circuit Board ◽  
Impact Crushing

scholarly journals Dynamic Model for the EV’s Charging Infrastructure Planning Through Finite Element Method

IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 102399-102408
Author(s):  
Morris Brenna ◽  
George Cristian Lazaroiu ◽  
Mariacristina Roscia ◽  
Soheil Saadatmandi
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Dynamic Model ◽  
Infrastructure Planning ◽  
Charging Infrastructure ◽  
Element Method
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