scholarly journals Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 833 ◽  
Author(s):  
Thomas Glatzl ◽  
Roman Beigelbeck ◽  
Samir Cerimovic ◽  
Harald Steiner ◽  
Albert Treytl
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Printed Circuit Board ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Fem Simulations ◽  
Printed Circuit ◽  
Thermal Flow Sensor ◽  
Element Method

We present finite element method (FEM) simulations of a thermal flow sensor as well as a comparison to measurement results. The thermal sensor is purely based on printed circuit board (PCB) technology, designed for heating, ventilation, and air conditioning (HVAC) systems. Design and readout method of the sensor enables the possibility to measure the flow velocity in various fluids. 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulations enable a fast and easy way to evaluate the sensor’s behaviour in different fluids. The results of the FEM simulations are compared to measurements in a real environment, proving the credibility of the model.

scholarly journals A Thermal Flow Sensor Based on Printed Circuit Technology in Constant Temperature Mode for Various Fluids

Sensors ◽  
2019 ◽  
Vol 19 (5) ◽  
pp. 1065 ◽  
Author(s):  
Thomas Glatzl ◽  
Roman Beigelbeck ◽  
Samir Cerimovic ◽  
Harald Steiner ◽  
Florian Wenig ◽  
...  
Keyword(s):  
Constant Temperature ◽  
Volume Flow Rate ◽  
Form Factors ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Fem Simulations ◽  
Printed Circuit ◽  
Thermal Flow Sensor ◽  
Temperature Mode

We present a thermal flow sensor designed for measuring air as well as water flow velocities in heating, ventilation, and air conditioning (HVAC) systems. The sensor is designed to integrate the flow along the entire diameter of the pipe also quantifying the volume flow rate of the streaming fluid where the calorimetric principle in constant temperature operation is utilized as a readout method. In the constant temperature mode, a controller keeps a specific excess temperature between sensing elements at a constant level resulting in a flow dependent heater voltage. To achieve cost-effective sensors, the fabrication of the transducer is fully based on printed circuit board technology allowing low-cost mass production with different form factors. In addition, 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulation enables a fast and easy way to evaluate the sensor’s behaviour in different fluids. The results of the FEM simulations are compared to measurements in real environments, proving the credibility of the model.

Monolithic Integration of a Flexible Micro Thermal Flow Sensor

2015 ◽  
Vol 748 ◽  
pp. 89-92
Author(s):  
Shuai Zhao ◽  
Rong Zhu
Keyword(s):  
Power Consumption ◽  
System Integration ◽  
Printed Circuit Board ◽  
Performance Test ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Temperature Drift ◽  
Printed Circuit ◽  
Thermal Flow Sensor

In this paper, a novel monolithically integrated flexible thermal flow sensor combining four resistors in a Wheatstone bridge including hot-film resistor, temperature-compensating resistor and two other balancing resistors on one chip is proposed in order to improve the system integration level and sensor performances, such as signal to noise ratio (SNR), power consumption and temperature compensation. Fabricating the sensor directly on a flexible polyimide printed circuit board (PCB) by incorporating printed circuit technique with micromachining sputter technique is adopted. A complete performance test on the flow sensor demonstrates its superiorities on power consumption, SNR and temperature drift, the error of which is eliminated from 43% to 8% over a range of ambient temperature (35–75°C).

Analysis on the Drop of PCB Packaged by Cushion Material Based on Finite Element Method

2013 ◽  
Vol 288 ◽  
pp. 303-307
Author(s):  
Gai Mei Zhang ◽  
Heng Yi Guo ◽  
Yue Lou ◽  
Qi Lu Tao ◽  
Wei Yuan ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Elastic Modulus ◽  
Printed Circuit Board ◽  
Impact Force ◽  
Circuit Board ◽  
Drop Height ◽  
Printed Circuit ◽  
Finite Element Software ◽  
The Impact

This paper analyzes the stress of the printed circuit board (PCB) packaged by cushion materials after drop and investigates the stress of PCB under the different drop height, different cushion materials and different drop ground using ANSYS finite element software. The stress of PCB is analyzed quantitatively and qualitatively after drop, the results show: (1) The stress of the product is effected by drop height and the performance of dropping ground in a large extent; (2) The protect performance varies with the ways of cushioning packaging; (3) Within a certain range, the cushion material with smaller elastic modulus is better due to absorb the impact more energy and can bear the impact force is greater.

Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test

2009 ◽  
Vol 419-420 ◽  
pp. 37-40
Author(s):  
Shiuh Chuan Her ◽  
Shien Chin Lan ◽  
Chun Yen Liu ◽  
Bo Ren Yao
Keyword(s):  
Finite Element ◽  
Experimental Measurement ◽  
Test Specimen ◽  
Printed Circuit Board ◽  
Drop Impact ◽  
Simulation Technique ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Impact

Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-DYNA is applied to compute the impact acceleration and dynamic strain on the test specimen during the drop impact. The finite element results are compared to the experimental measurement of acceleration with good correlation between simulation and drop testing. With the accurate simulation technique, one is capable of predicting the impact response and characterizing the failure mode prior to real reliability test.

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