Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations

2015 ◽  
Vol 55 (11) ◽  
pp. 2382-2390 ◽  
Author(s):  
R. Schöngrundner ◽  
M.J. Cordill ◽  
G.A. Maier ◽  
H.-P. Gänser
Keyword(s):  
Finite Element ◽  
Printed Circuit Board ◽  
Adhesion Energy ◽  
Finite Element Simulations ◽  
Circuit Board ◽  
Printed Circuit ◽  
Four Point Bending

Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test

2009 ◽  
Vol 419-420 ◽  
pp. 37-40
Author(s):  
Shiuh Chuan Her ◽  
Shien Chin Lan ◽  
Chun Yen Liu ◽  
Bo Ren Yao
Keyword(s):  
Finite Element ◽  
Experimental Measurement ◽  
Test Specimen ◽  
Printed Circuit Board ◽  
Drop Impact ◽  
Simulation Technique ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Impact

Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-DYNA is applied to compute the impact acceleration and dynamic strain on the test specimen during the drop impact. The finite element results are compared to the experimental measurement of acceleration with good correlation between simulation and drop testing. With the accurate simulation technique, one is capable of predicting the impact response and characterizing the failure mode prior to real reliability test.

scholarly journals Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 833 ◽  
Author(s):  
Thomas Glatzl ◽  
Roman Beigelbeck ◽  
Samir Cerimovic ◽  
Harald Steiner ◽  
Albert Treytl
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Printed Circuit Board ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Fem Simulations ◽  
Printed Circuit ◽  
Thermal Flow Sensor ◽  
Element Method

We present finite element method (FEM) simulations of a thermal flow sensor as well as a comparison to measurement results. The thermal sensor is purely based on printed circuit board (PCB) technology, designed for heating, ventilation, and air conditioning (HVAC) systems. Design and readout method of the sensor enables the possibility to measure the flow velocity in various fluids. 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulations enable a fast and easy way to evaluate the sensor’s behaviour in different fluids. The results of the FEM simulations are compared to measurements in a real environment, proving the credibility of the model.

scholarly journals Analisis Karakteristik Elektrik Bentuk Geometri Jalur PCB Menggunakan Pendekatan Finite Element

2018 ◽  
Vol 10 (1) ◽  
pp. 11-17
Author(s):  
Putut Son Maria ◽  
Elva Susianti
Keyword(s):  
Finite Element ◽  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Scientific Literature ◽  
Circuit Board ◽  
Electrical Characteristics ◽  
The Finite Element Method ◽  
Printed Circuit ◽  
The Right ◽  
Aided Design

Some Electronics Computer Aided Design (ECAD) softwares have provided several track shapes to design a Printed Circuit Board (PCB), such as right angle, rounded and trapezoidal. However, it is quite difficult to find scientific literature that can be used as a guide which explains and compiles directly about each character of the geometry. This study aims to analyze and to observe the electrical characteristics of the geometry shape on the Printed Circuit Board (PCB) path by using the finite element method. Each PCB path shape is modeled according to its geometry and physical properties, then calculated for its electrical quantity and be observed for its performance at given current. Simulation and numerical calculations showed that the shape of trapezoidal and rounded geometry have lower resistance and planar inductance of 6.8% and 7.39% respectively than the right angle shape.

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