Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints

2013 ◽  
Vol 114 (15) ◽  
pp. 153509 ◽  
Author(s):  
Jian-Qiang Chen ◽  
Jing-Dong Guo ◽  
Kai-Lang Liu ◽  
Jian-Ku Shang
Keyword(s):  
Grain Orientation ◽  
Solder Joints ◽  
Sn Grain Orientation

Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint

2014 ◽  
Vol 95 ◽  
pp. 166-171 ◽  
Author(s):  
Jie-Shi Chen ◽  
Meng-Jia Xu ◽  
Yu-Jing Jin ◽  
Kai-Yun Wang ◽  
Yu Chun ◽  
...  
Keyword(s):  
Solder Joint ◽  
Electric Field ◽  
Grain Orientation ◽  
Sn Grain Orientation

scholarly journals The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

Materials ◽  
2021 ◽  
Vol 15 (1) ◽  
pp. 108
Author(s):  
Kexin Xu ◽  
Xing Fu ◽  
Xinjie Wang ◽  
Zhiwei Fu ◽  
Xiaofeng Yang ◽  
...  
Keyword(s):  
Electric Current ◽  
Grain Orientation ◽  
Solder Joints ◽  
Metal Dissolution ◽  
Wind Force ◽  
Electron Backscattered Diffraction ◽  
Combined Action ◽  
Free Solder ◽  
Electron Wind ◽  
A Current

The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 104 A/cm2 at 125 °C to study the electromigration behaviors. The grain orientation was characterized by scanning electron microscopy (SEM) equipped with electron backscattered diffraction (EBSD) detector. Metal dissolution and voids formation in the cathode as well as massive intermetallic compounds(IMC) accumulation in the anode were observed after electromigration. Closer examination of solder joints revealed that the Sn grain whose c-axis perpendicular to electric current may have retarded Cu diffusion to anode and IMC accumulation. In addition, the newly formed Cu6Sn5 exhibited preferred orientation related to the electric current direction.

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