sn grain orientation Latest Research Papers

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Materials Letters ◽

10.1016/j.matlet.2018.10.112 ◽

2019 ◽

Vol 236 ◽

pp. 190-193 ◽

Cited By ~ 11

Author(s):

Yu-An Shen ◽

Fan-Yi Ouyang ◽

Chih Chen

Keyword(s):

Intermetallic Compounds ◽

Grain Orientation ◽

Sn Grain Orientation

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Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation

Journal of Electronic Materials ◽

10.1007/s11664-018-6621-y ◽

2018 ◽

Vol 48 (1) ◽

pp. 32-43 ◽

Cited By ~ 4

Author(s):

André M. Delhaise ◽

Zhangqi Chen ◽

Doug D. Perovic

Keyword(s):

Solid State ◽

Grain Orientation ◽

Solid State Diffusion ◽

State Diffusion ◽

Sn Grain Orientation

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Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046676 ◽

2017 ◽

Author(s):

Hongyu Sun ◽

Mingliang Huang

Keyword(s):

Failure Mechanism ◽

Grain Orientation ◽

Flip Chip ◽

Dominant Effect ◽

Solder Interconnects ◽

Sn Grain Orientation

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Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046675 ◽

2017 ◽

Author(s):

XingBo Liu ◽

Mingliang Huang

Keyword(s):

Intermetallic Compounds ◽

Grain Orientation ◽

Ni Substrate ◽

Substrate Dissolution ◽

Sn Grain Orientation

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Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests

Electronic Materials Letters ◽

10.1007/s13391-017-7041-5 ◽

2017 ◽

Vol 13 (6) ◽

pp. 457-462 ◽

Cited By ~ 6

Author(s):

Yi-Cheng Chu ◽

Chih Chen ◽

Nicholas Kao ◽

Don Son Jiang

Keyword(s):

Thermal Cycling ◽

Strain Distribution ◽

Grain Orientation ◽

Crack Formation ◽

Sn Grain Orientation

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Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration

Scripta Materialia ◽

10.1016/j.scriptamat.2016.09.028 ◽

2017 ◽

Vol 128 ◽

pp. 6-9 ◽

Cited By ~ 33

Author(s):

Yu-An Shen ◽

Chih Chen

Keyword(s):

Intermetallic Compounds ◽

Grain Orientation ◽

Sn Grain Orientation

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Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing

Journal of Electronic Materials ◽

10.1007/s11664-016-5154-5 ◽

2016 ◽

Vol 46 (4) ◽

pp. 2179-2184 ◽

Cited By ~ 2

Author(s):

Ming-Yao Chen ◽

Han-wen Lin ◽

Chih Chen

Keyword(s):

Intermetallic Compound ◽

Grain Orientation ◽

Current Stressing ◽

Sn Grain Orientation

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Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800040 ◽

2016 ◽

Author(s):

Yu-An Shen ◽

Chih Chen

Keyword(s):

Intermetallic Compounds ◽

Grain Orientation ◽

Sn Grain Orientation

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The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints

Computational Materials Science ◽

10.1016/j.commatsci.2015.05.029 ◽

2015 ◽

Vol 108 ◽

pp. 1-7 ◽

Cited By ~ 3

Author(s):

Jie-Shi Chen ◽

Cheng-Hui Ye ◽

Chun Yu ◽

Hao Lu

Keyword(s):

Grain Orientation ◽

Solder Joints ◽

Substrate Consumption ◽

Sn Grain Orientation

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Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236812 ◽

2015 ◽

Author(s):

Jianfei Zhao ◽

Mingliang Huang ◽

Ning Zhao ◽

Zhijie Zhang

Keyword(s):

Grain Orientation ◽

Snagcu Solder ◽

Solder Interconnect ◽

Sn Grain Orientation

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sn grain orientation
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation

Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects

Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration

Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests

Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration

Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing

Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration

The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints

Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration

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sn grain orientationRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation

Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnects

Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration

Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests

Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration

Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing

Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration

The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints

Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration

sn grain orientation
Recently Published Documents