Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

Scripta Materialia ◽

10.1016/j.scriptamat.2014.02.010 ◽

2014 ◽

Vol 80 ◽

pp. 37-40 ◽

Cited By ~ 45

Author(s):

T.C. Huang ◽

T.L. Yang ◽

J.H. Ke ◽

C.H. Hsueh ◽

C.R. Kao

Keyword(s):

Grain Orientation ◽

Solder Joints ◽

Electron Current ◽

Current Stressing ◽

Substrate Dissolution ◽

Sn Grain Orientation

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Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints

Journal of Applied Physics ◽

10.1063/1.4825323 ◽

2013 ◽

Vol 114 (15) ◽

pp. 153509 ◽

Cited By ~ 27

Author(s):

Jian-Qiang Chen ◽

Jing-Dong Guo ◽

Kai-Lang Liu ◽

Jian-Ku Shang

Keyword(s):

Grain Orientation ◽

Solder Joints ◽

Sn Grain Orientation

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The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints

Computational Materials Science ◽

10.1016/j.commatsci.2015.05.029 ◽

2015 ◽

Vol 108 ◽

pp. 1-7 ◽

Cited By ~ 3

Author(s):

Jie-Shi Chen ◽

Cheng-Hui Ye ◽

Chun Yu ◽

Hao Lu

Keyword(s):

Grain Orientation ◽

Solder Joints ◽

Substrate Consumption ◽

Sn Grain Orientation

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Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing

Journal of Electronic Materials ◽

10.1007/s11664-016-5154-5 ◽

2016 ◽

Vol 46 (4) ◽

pp. 2179-2184 ◽

Cited By ~ 2

Author(s):

Ming-Yao Chen ◽

Han-wen Lin ◽

Chih Chen

Keyword(s):

Intermetallic Compound ◽

Grain Orientation ◽

Current Stressing ◽

Sn Grain Orientation

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Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing

Acta Materialia ◽

10.1016/j.actamat.2010.12.048 ◽

2011 ◽

Vol 59 (6) ◽

pp. 2462-2468 ◽

Cited By ~ 41

Author(s):

J.H. Ke ◽

T.L. Yang ◽

Y.S. Lai ◽

C.R. Kao

Keyword(s):

Experimental Verification ◽

Solder Joints ◽

Degradation Mechanisms ◽

Electron Current ◽

Current Stressing

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Correlation between Ag content and Cu pad consumption in lead-free solder joints under electron current stressing

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066962 ◽

2011 ◽

Author(s):

C. N. Chen ◽

B. Z. Chen ◽

W. H. Wu ◽

C. E. Ho

Keyword(s):

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Electron Current ◽

Current Stressing ◽

Free Solder

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Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046675 ◽

2017 ◽

Author(s):

XingBo Liu ◽

Mingliang Huang

Keyword(s):

Intermetallic Compounds ◽

Grain Orientation ◽

Ni Substrate ◽

Substrate Dissolution ◽

Sn Grain Orientation

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Abnormal depletion of Cu metallization pads in line–bump–line solder joints under electron current stressing

Thin Solid Films ◽

10.1016/j.tsf.2015.06.062 ◽

2015 ◽

Vol 596 ◽

pp. 216-221 ◽

Cited By ~ 5

Author(s):

C.E. Ho ◽

C.H. Yang ◽

C.T. Chen ◽

B.Z. Chen

Keyword(s):

Solder Joints ◽

Electron Current ◽

Cu Metallization ◽

Current Stressing

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Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing

Metallurgical and Materials Transactions A ◽

10.1007/s11661-012-1276-4 ◽

2012 ◽

Vol 43 (8) ◽

pp. 2571-2573 ◽

Cited By ~ 20

Author(s):

Chih-Fan Lin ◽

Shang-Hua Lee ◽

Chih-Ming Chen

Keyword(s):

Grain Orientation ◽

Current Stressing ◽

Sn Grain Orientation

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Effect of Sn grain orientation on polarity effect in Sn-Ag-Cu solder joints during electromigration

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756609 ◽

2013 ◽

Author(s):

Jian-Qiang Chen ◽

Jing-Dong Guo

Keyword(s):

Grain Orientation ◽

Solder Joints ◽

Polarity Effect ◽

Sn Grain Orientation

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Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints

Journal of Material Science and Technology ◽

10.1016/s1005-0302(10)60116-8 ◽

2010 ◽

Vol 26 (8) ◽

pp. 737-742 ◽

Cited By ~ 11

Author(s):

X.J. Wang ◽

Q.L. Zeng ◽

Q.S. Zhu ◽

Z.G. Wang ◽

J.K. Shang

Keyword(s):

Solder Joints ◽

Shear Properties ◽

Current Stressing

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