Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

1999 ◽  
Vol 86 (5) ◽  
pp. 2516-2525 ◽  
Author(s):  
J. M. E. Harper ◽  
C. Cabral ◽  
P. C. Andricacos ◽  
L. Gignac ◽  
I. C. Noyan ◽  
...  
Keyword(s):  
Thin Films ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
Electroplated Copper

Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

1999 ◽  
Vol 562 ◽  
Author(s):  
J. M. E. Harper ◽  
C. Cabral ◽  
P. C. Andricacos ◽  
L. Gignac ◽  
I. C. Noyan ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Grain Boundary ◽  
Electron Scattering ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
Tensile Direction ◽  
Transient Period ◽  
Grain Boundary Pinning ◽  
Electroplated Copper

ABSTRACTWe present a model which accounts for the dramatic evolution in the microstructure of electroplated copper thin films near room temperature. Microstructure evolution occurs during a transient period of hours following deposition, and includes an increase in grain size, changes in preferred crystallographic texture, and decreases in resistivity, hardness and compressive stress. As the grain size increases from the as-deposited value of 0.05–0.1 μm up to several μm, the decreasing grain boundary contribution to electron scattering lowers the resistivity by tens of percent to near-bulk values. Concurrently, as the volume of grain boundaries decreases, the stress is shown to change in the tensile direction by tens of MPa. The as-deposited grain size is also shown to be consistent with grain boundary pinning.

Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

1999 ◽  
Vol 564 ◽  
Author(s):  
J. M. E. Harper ◽  
C. Cabral ◽  
P. C. Andricacos ◽  
L. Gignac ◽  
I. C. Noyan ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Grain Boundary ◽  
Electron Scattering ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
Tensile Direction ◽  
Transient Period ◽  
Grain Boundary Pinning ◽  
Electroplated Copper

AbstractWe present a model which accounts for the dramatic evolution in the microstructure of electroplated copper thin films near room temperature. Microstructure evolution occurs during a transient period of hours following deposition, and includes an increase in grain size, changes in preferred crystallographic texture, and decreases in resistivity, hardness and compressive stress. As the grain size increases from the as-deposited value of 0.05–0.1 μm up to several μm, the decreasing grain boundary contribution to electron scattering lowers the resistivity by tens of percent to near-bulk values. Concurrently, as the volume of grain boundaries decreases, the stress is shown to change in the tensile direction by tens of MPa. The as-deposited grain size is also shown to be consistent with grain boundary pinning.

Room temperature grain growth in electroplated copper thin films

2000 ◽  
Vol 40 (8-10) ◽  
pp. 1301-1304 ◽  
Author(s):  
H. Wendrock ◽  
W. Brückner ◽  
M. Hecker ◽  
T.G. Koetter ◽  
H. Schloerb
Keyword(s):  
Thin Films ◽  
Grain Growth ◽  
Room Temperature ◽  
Electroplated Copper

scholarly journals Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling

Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 3926
Author(s):  
Eunmi Park ◽  
Marietta Seifert ◽  
Gayatri K. Rane ◽  
Siegfried B. Menzel ◽  
Thomas Gemming ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
In Situ Stress ◽  
Intrinsic Stress ◽  
Plastic Behavior ◽  
Cover Layer ◽  
Si Substrates ◽  
Stress Behavior

The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO2 cover layer on thermally oxidized Si substrates. The samples were subjected to thermal cycling up to 900 °C in ultrahigh vacuum; meanwhile, the in-situ stress behavior was monitored by a laser based Multi-beam Optical Sensor (MOS) system. After preannealing at 900 °C for 24 h, the uncovered films showed a high residual stress at room temperature and a plastic behavior at high temperatures, while the covered Mo films showed an almost entirely elastic deformation during the thermal cycling between room temperature and 900 °C with hardly any plastic deformation, and a constant stress value during isothermal annealing without a notable creep. Furthermore, after thermal cycling, the Mo films without as well as with a cover layer showed low electrical resistivity (≤10 μΩ·cm).

Studies on Water in the Hydration Chamber of a Modified Electron Microscope

1970 ◽  
Vol 28 ◽  
pp. 544-545
Author(s):  
R. C. Moretz ◽  
G. G. Hausner ◽  
D. F. Parsons
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electron Microscope ◽  
Steady State ◽  
Room Temperature ◽  
Small Mass ◽  
Equilibrium Pressure ◽  
Biological Objects ◽  
Mechanical Pump ◽  
Differential Pumping

Use of the electron microscope to examine wet objects is possible due to the small mass thickness of the equilibrium pressure of water vapor at room temperature. Previous attempts to examine hydrated biological objects and water itself used a chamber consisting of two small apertures sealed by two thin films. Extensive work in our laboratory showed that such films have an 80% failure rate when wet. Using the principle of differential pumping of the microscope column, we can use open apertures in place of thin film windows.Fig. 1 shows the modified Siemens la specimen chamber with the connections to the water supply and the auxiliary pumping station. A mechanical pump is connected to the vapor supply via a 100μ aperture to maintain steady-state conditions.

Interactions Between Al and Cr Thin Films

1976 ◽  
Vol 34 ◽  
pp. 638-639
Author(s):  
R. M. Anderson ◽  
T. M. Reith ◽  
M. J. Sullivan ◽  
E. K. Brandis
Keyword(s):  
Thin Films ◽  
Room Temperature ◽  
Vacuum System ◽  
Processing Temperature ◽  
Diffusion Couples ◽  
Electronic Circuits ◽  
Intermetallic Formation ◽  
Si Substrates ◽  
Aluminum Silicon

Thin films of aluminum or aluminum-silicon can be used in conjunction with thin films of chromium in integrated electronic circuits. For some applications, these films exhibit undesirable reactions; in particular, intermetallic formation below 500 C must be inhibited or prevented. The Al films, being the principal current carriers in interconnective metal applications, are usually much thicker than the Cr; so one might expect Al-rich intermetallics to form when the processing temperature goes out of control. Unfortunately, the JCPDS and the literature do not contain enough data on the Al-rich phases CrAl7 and Cr2Al11, and the determination of these data was a secondary aim of this work.To define a matrix of Cr-Al diffusion couples, Cr-Al films were deposited with two sets of variables: Al or Al-Si, and broken vacuum or single pumpdown. All films were deposited on 2-1/4-inch thermally oxidized Si substrates. A 500-Å layer of Cr was deposited at 120 Å/min on substrates at room temperature, in a vacuum system that had been pumped to 2 x 10-6 Torr. Then, with or without vacuum break, a 1000-Å layer of Al or Al-Si was deposited at 35 Å/s, with the substrates still at room temperature.

Investigation of ultra-thin films of YBa2Cu3O7−δ grown on MgO

1990 ◽  
Vol 48 (4) ◽  
pp. 6-7
Author(s):  
S.K. Streiffer ◽  
C.B. Eom ◽  
J.C. Bravman ◽  
T.H. Geballet
Keyword(s):  
Thin Films ◽  
Room Temperature ◽  
Deposition Process ◽  
Nucleation And Growth ◽  
Multilayer Structures ◽  
Rf Power ◽  
Oxygen Loss ◽  
Transmission Electron ◽  
Single Target ◽  
Mtorr Argon

The study of very thin (<15 nm) YBa2Cu3O7−δ (YBCO) films is necessary both for investigating the nucleation and growth of films of this material and for achieving a better understanding of multilayer structures incorporating such thin YBCO regions. We have used transmission electron microscopy to examine ultra-thin films grown on MgO substrates by single-target, off-axis magnetron sputtering; details of the deposition process have been reported elsewhere. Briefly, polished MgO substrates were attached to a block placed at 90° to the sputtering target and heated to 650 °C. The sputtering was performed in 10 mtorr oxygen and 40 mtorr argon with an rf power of 125 watts. After deposition, the chamber was vented to 500 torr oxygen and allowed to cool to room temperature. Because of YBCO’s susceptibility to environmental degradation and oxygen loss, the technique of Xi, et al. was followed and a protective overlayer of amorphous YBCO was deposited on the just-grown films.

TEM sample preparation of wear-tested room-temperature pulsed-laser-deposited thin films of MoS2 by ultramicrotomy

1993 ◽  
Vol 51 ◽  
pp. 1118-1119
Author(s):  
Pamela F. Lloyd ◽  
Scott D. Walck
Keyword(s):  
Thin Films ◽  
Sample Preparation ◽  
Room Temperature ◽  
High Vacuum ◽  
Pulsed Laser ◽  
Ultra High Vacuum ◽  
Wear Testing ◽  
Preparation Technique ◽  
Cross Sectional ◽  
Aerospace Applications

Pulsed laser deposition (PLD) is a novel technique for the deposition of tribological thin films. MoS2 is the archetypical solid lubricant material for aerospace applications. It provides a low coefficient of friction from cryogenic temperatures to about 350°C and can be used in ultra high vacuum environments. The TEM is ideally suited for studying the microstructural and tribo-chemical changes that occur during wear. The normal cross sectional TEM sample preparation method does not work well because the material’s lubricity causes the sandwich to separate. Walck et al. deposited MoS2 through a mesh mask which gave suitable results for as-deposited films, but the discontinuous nature of the film is unsuitable for wear-testing. To investigate wear-tested, room temperature (RT) PLD MoS2 films, the sample preparation technique of Heuer and Howitt was adapted.Two 300 run thick films were deposited on single crystal NaCl substrates. One was wear-tested on a ball-on-disk tribometer using a 30 gm load at 150 rpm for one minute, and subsequently coated with a heavy layer of evaporated gold.

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