Strain relaxation and its effect on radiation‐induced interface traps in thin rapid thermally grown high‐temperature oxides

1991 ◽  
Vol 69 (2) ◽  
pp. 1113-1115 ◽  
Author(s):  
U. Schwalke ◽  
M. Kerber ◽  
C. Mazure ◽  
B. Breithaupt
Keyword(s):  
High Temperature ◽  
Strain Relaxation ◽  
Interface Traps ◽  
Radiation Induced ◽  
Thermally Grown

Gamma Irradiation Effects on 4H-SiC MOS Capacitors and MOSFETs

2006 ◽  
Vol 527-529 ◽  
pp. 1063-1066 ◽  
Author(s):  
Ayayi Claude Ahyi ◽  
S.R. Wang ◽  
John R. Williams
Keyword(s):  
Field Effect ◽  
Gamma Dose ◽  
Interface Traps ◽  
Valence Band Edge ◽  
Field Effect Mobility ◽  
Irradiation Effects ◽  
Mos Capacitors ◽  
Channel Mobility ◽  
Radiation Induced ◽  
Radiation Tolerant

The effects of gamma radiation on field effect mobility and threshold voltage have been studied for lateral n-channel 4H-SiC MOSFETs passivated with nitric oxide. MOS capacitors (n and p) and n-channel lateral MOSFETs were irradiated unbiased (floating contacts) for a total gamma dose of 6.8Mrad (Si). The MOS capacitors were used to study the radiation-induced interface traps and fixed oxide charge that affect the performance of the MOSFETs. Radiationinduced interface traps were observed near the SiC valence band edge and just above mid-gap, and field effect channel mobility was reduced by 18-20% following irradiation. Even so, 4HMOSFETs appear to be more radiation tolerant than Si devices.

Dependence of radiation‐induced interface traps on silicide gate stoichiometry in silicide/SiO2/Si devices

1987 ◽  
Vol 50 (5) ◽  
pp. 242-244
Author(s):  
S. Buchner ◽  
M. Natan ◽  
K. Kang ◽  
D. Gill
Keyword(s):  
Interface Traps ◽  
Radiation Induced

Passivation and Generation of States at P-Implanted Thermally Grown and Deposited N-Type 4H-SiC/SiO2 Interfaces

2016 ◽  
Vol 858 ◽  
pp. 697-700 ◽  
Author(s):  
Tomasz Sledziewski ◽  
Heiko B. Weber ◽  
Michael Krieger
Keyword(s):  
Electrical Properties ◽  
Response Time ◽  
Side Effect ◽  
Oxide Semiconductor ◽  
Epitaxial Layers ◽  
Interface Traps ◽  
Semiconductor Interface ◽  
Mos Capacitors ◽  
Thermally Grown Oxides ◽  
Thermally Grown

In this work the effect of phosphorus on the electrical properties of n-type 4H-SiC MOS capacitors is studied. Phosphorus ions are implanted into the epitaxial layers prior to the deposition of SiO2 by PECVD, in shallow depths and at concentrations at the oxide-semiconductor interface in the range of (5 x 1017…1 x 1019) cm-3. Those samples are compared with 31P-implanted 4H-SiC MOS capacitors with thermally grown oxides, which were primarily investigated in the previous work of the authors. It is shown that independently of the oxide technology phosphorus may lead to decrease of the density of interface traps, whose response time to the AC voltage is longer than 1 µs. The side-effect of the implantation of phosphorus is generation of the very fast interface states, which are able to follow the frequencies over 1 MHz.

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