A new large area lanthanum hexaboride plasma source

2010 ◽  
Vol 81 (8) ◽  
pp. 083503 ◽  
Author(s):  
C. M. Cooper ◽  
W. Gekelman ◽  
P. Pribyl ◽  
Z. Lucky
Keyword(s):  
Plasma Source ◽  
Lanthanum Hexaboride ◽  
Large Area

Long-pulse plasma source for SMOLA helical mirror

2021 ◽  
Vol 87 (2) ◽  
Author(s):  
Ivan A. Ivanov ◽  
V. O. Ustyuzhanin ◽  
A. V. Sudnikov ◽  
A. Inzhevatkina
Keyword(s):  
Magnetic Field ◽  
Gas Flow ◽  
Supply Voltage ◽  
Hydrogen Plasma ◽  
Plasma Source ◽  
Lanthanum Hexaboride ◽  
Plasma Stream ◽  
Plasma Parameters ◽  
Plasma Properties ◽  
Plasma Gun

A plasma gun for forming a plasma stream in the open magnetic mirror trap with additional helicoidal field SMOLA is described. The plasma gun is an axisymmetric system with a planar circular hot cathode based on lanthanum hexaboride and a hollow copper anode. The two planar coils are located around the plasma source and create a magnetic field of up to 200 mT. The magnetic field forms the magnetron configuration of the discharge and provides a radial electric insulation. The source typically operates with a discharge current of up to 350 A in hydrogen. Plasma parameters in the SMOLA device are Ti ~ 5 eV, Te ~ 5–40 eV and ni ~ (0.1–1)  × 1019 m−3. Helium plasma can also be created. The plasma properties depend on the whole group of initial technical parameters: the cathode temperature, the feeding gas flow, the anode-cathode supply voltage and the magnitude of the cathode magnetic insulation.

Large‐area lanthanum hexaboride electron emitter

1985 ◽  
Vol 56 (9) ◽  
pp. 1717-1722 ◽  
Author(s):  
D. M. Goebel ◽  
Y. Hirooka ◽  
T. A. Sketchley
Keyword(s):  
Lanthanum Hexaboride ◽  
Large Area ◽  
Electron Emitter

Pattern Writing by Implantation in a Large-Scale PSII System With Planar Inductively Coupled Plasma Source

2000 ◽  
Vol 624 ◽  
Author(s):  
Lingling Wu ◽  
Hongjun Gao ◽  
Dennis M. Manos
Keyword(s):  
Inductively Coupled Plasma ◽  
Large Scale ◽  
Lateral Diffusion ◽  
Plasma Source ◽  
Direct Writing ◽  
Large Area ◽  
Depth Profiles ◽  
Geometric Patterns ◽  
Planar Coil ◽  
Rf Antenna

ABSTRACTA large-scale plasma source immersion ion implantation (PSII) system with planar coil RFI plasma source has been used to study an inkless, deposition-free, mask-based surface conversion patterning as an alternative to direct writing techniques on large-area substrates by implantation. The apparatus has a 0.61 m ID and 0.51 m tall chamber, with a base pressure in the 10−8 Torr range, making it one of the largest PSII presently available. The system uses a 0.43 m ID planar rf antenna to produce dense plasma capable of large-area, uniform materials treatment. Metallic and semiconductor samples have been implanted through masks to produce small geometric patterns of interest for device manufacturing. Si gratings were also implanted to study application to smaller features. Samples are characterized by AES, TEM and variable-angle spectroscopic ellipsometry. Composition depth profiles obtained by AES and VASE are compared. Measured lateral and depth profiles are compared to the mask features to assess lateral diffusion, pattern transfer fidelity, and wall-effects. The paper also presents the results of MAGIC calculations of the flux and angle of ion trajectories through the boundary layer predicting the magnitude of flux as a function of 3-D location on objects in the expanding sheath

Development of a large-area planar surface-wave plasma source with a cavity launcher driven by a 915 MHz UHF wave

2013 ◽  
Vol 22 (2) ◽  
pp. 025002 ◽  
Author(s):  
Xijiang Chang ◽  
Kazuki Kunii ◽  
Rongqing Liang ◽  
Masaaki Nagatsu
Keyword(s):  
Surface Wave ◽  
Plasma Source ◽  
Planar Surface ◽  
Large Area

Low Inductance Antenna (LIA) plasma source and plasma-enhanced dual rotatable magnetron sputter assisted with LIA

2015 ◽  
Vol 2015 (1) ◽  
pp. 000757-000760
Author(s):  
Y. Takaya ◽  
Y. Tanioka ◽  
H. Yoshino ◽  
A. Osawa
Keyword(s):  
Inductively Coupled Plasma ◽  
Low Voltage ◽  
Polymer Surface ◽  
Plasma Source ◽  
Large Area ◽  
Plasma Damage ◽  
Inductively Coupled ◽  
Temperature Deposition ◽  
Magnetron Sputter ◽  
Plasma Profile

In recent years, both low plasma damage and low temperature deposition technic for polymer substrates (e.g. PCB, films and etc.) are often required. We have developed a plasma enhanced dual rotatable magnetron sputter source assisted with inductively coupled plasma (ICP) using low inductance antenna (LIA). LIA has same unique characteristics, a)low voltage high density plasma, b)well controllability of plasma profile to ensure uniformity over large area, c)ionization of sputtered particle and etc. when in being used as a plasma assistant, and besides, LIA can be used as a ICP source for polymer surface modification. We introduce a variety of the possibilities of whether this sputter source is usable for the process of the fabrication of PCB.

Development of a large-area, multi-helicon rectangular plasma source for TFT-LCD processing

2003 ◽  
Vol 435 (1-2) ◽  
pp. 270-274 ◽  
Author(s):  
Yoon Jae Kim ◽  
Seung Ho Han ◽  
Won Hwang ◽  
Y.S. Hwang
Keyword(s):  
Plasma Source ◽  
Large Area

Large-area IAD with a new plasma source

1990 ◽  
Author(s):  
Alfons Zoeller ◽  
Rainer Goetzelmann ◽  
Reinhard Herrmann ◽  
K. Matl
Keyword(s):  
Plasma Source ◽  
Large Area

ICCD Imaging of Coexisting Arc Roots and Arc Column in a Large-Area Dispersed Arc-Plasma Source

2008 ◽  
Vol 36 (4) ◽  
pp. 1084-1085 ◽  
Author(s):  
He-Ling Zhou ◽  
Lin-Cun Li ◽  
Liang Cheng ◽  
Zhi-Peng Zhou ◽  
Bing Bai ◽  
...  
Keyword(s):  
Plasma Source ◽  
Arc Plasma ◽  
Large Area
Sign in / Sign up

Export Citation Format

Share Document