A new ultrasonic method for measuring elastic moduli in unsupported thin films: Application to Cu‐Pd superlattices

1990 ◽  
Vol 68 (4) ◽  
pp. 1622-1628 ◽  
Author(s):  
A. Moreau ◽  
J. B. Ketterson ◽  
B. Davis
Keyword(s):  
Thin Films ◽  
Elastic Moduli ◽  
Ultrasonic Method

Indentation Technique to Investigate Elastic Moduli of Thin Films on Substrates

1988 ◽  
Vol 130 ◽  
Author(s):  
D. S. Stone ◽  
T. W. Wu ◽  
P.-S. Alexopoulos ◽  
W. R. Lafontaine
Keyword(s):  
Thin Film ◽  
Experimental Data ◽  
Thin Films ◽  
Closed Form ◽  
Elastic Moduli ◽  
Depth Sensing ◽  
Indentation Technique ◽  
Average Displacement ◽  
Elasticity Solutions ◽  
Poor Adhesion

AbstractClosed-form elasticity solutions are introduced, that predict the average displacement beneath square and triangular, uniformly loaded areas at the surface of a bilayer. The solutions aid in the application of depth-sensing indentation techniques for measuring thin film elastic moduli. The elasticity solutions agree closely with experimental data of Al, Si, 1 μm Al on Si, and 2 μm Cr on Si. The case of poor adhesion between the film and substrate is briefly examined.

The Elastic Moduli of Silver Thin Films Measured with a New Microtensile Tester

1991 ◽  
Vol 239 ◽  
Author(s):  
J. Ruud ◽  
D. Josell ◽  
A. L. Greer ◽  
F. Spaepen
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Diffraction Grating ◽  
Strain Measurement ◽  
Elastic Moduli ◽  
Two Dimensional ◽  
Bulk Crystals ◽  
Free Standing ◽  
Tensile Direction ◽  
Silver Thin Films

ABSTRACTA new design for a thin film microtensile tester is presented. The strain is measured directly on the free-standing thin film from the displacement of laser spots diffracted from a thin grating applied to its surface by photolithography. The diffraction grating is two-dimensional, allowing strain measurement both along and transverse to the tensile direction. In principle, both Young's modulus and Poisson's ratio of a thin film can be determined. Ag thin films with strong <111> texture were tested. The measured Young moduli agreed with those measured on bulk crystals, but the measured Poisson ratios were low, most likely due to slight transverse folding of the film that developed during the test.

The hardnesses and elastic moduli of pulsed laser deposited multilayer AlN/TiN thin films

1999 ◽  
Vol 30 (7) ◽  
pp. 657-665 ◽  
Author(s):  
T.A. Rawdanowicz ◽  
V. Godbole ◽  
J. Narayan ◽  
J. Sankar ◽  
A. Sharma
Keyword(s):  
Thin Films ◽  
Elastic Moduli ◽  
Pulsed Laser ◽  
Tin Thin Films

Solid Solution Alloy Effects on Microstructure and Indentation Hardness in Pt-Ru Thin Films

2001 ◽  
Vol 673 ◽  
Author(s):  
Seungmin Hyun ◽  
Oliver Kraft ◽  
Richard P. Vinci
Keyword(s):  
Thin Films ◽  
Solid Solution ◽  
Elastic Moduli ◽  
Composition Range ◽  
Dislocation Motion ◽  
Solid Solution Alloy ◽  
Indentation Hardness ◽  
Solid Solution Strengthening ◽  
Si Substrates ◽  
Solution Strengthening

ABSTRACTThe elastic moduli and flow stresses of as-deposited Pt and Pt-Ru solid solution thin films were investigated by the nanoindentation method. The influence of solid solution alloying was explored by depositing Pt-Ru solid solution thin films with various compositions onto Si substrates. The 200 nm films were prepared by DC magnetron cosputtering with a Ru composition range from 0 to 20wt%. As expected, the modulus and the flow stress both increased significantly with an increase in Ru. The experimental results compare favorably to predictions based on a simple dislocation motion model consisting of three strengthening terms: substrate constraint, grain size strengthening and solid solution strengthening.

Sputtered WSix for micromechanical structures

1995 ◽  
Vol 10 (7) ◽  
pp. 1710-1720 ◽  
Author(s):  
Muh-Ling Ger ◽  
Richard B. Brown
Keyword(s):  
Thin Films ◽  
Integrated Circuit ◽  
Elastic Moduli ◽  
Stress Measurement ◽  
Rutherford Backscattering Spectrometry ◽  
Thermal Coefficient ◽  
Deposition Pressure ◽  
Sputtered Films ◽  
Effect Transistor ◽  
Micromechanical Structures

Tungsten silicide (WSix) thin tilms have been investigated for use as integrated circuit interconnect and self-aligned MESFET (metal-semiconductor field-effect transistor) gates because of their low resistivity and thermal and chemical stability. These same characteristics make them interesting materials for prospective use in micromechanical structures. However, little information on residual stresses, elastic moduli, or other micromechanical properties has been available for refractory metal silicide thin films. This paper presents the morphology and stress characteristics of cosputtered WSix thin films, including crystal structure variations and orientation-dependent stresses, as a function of the deposition pressure. The compositions of WSix thin films were analyzed by Rutherford backscattering spectrometry (RBS). The biaxial elastic modulus and thermal coefficient of expansion were found for the sputtered films. Stress-measurement methods and annealing are discussed. Released diaphragms of different sizes and shapes, having controlled residual stress, have been fabricated.

A Novel Technique to Determine Elastic Constants of Thin Films

2008 ◽  
Vol 1139 ◽  
Author(s):  
Klaus Martinschitz ◽  
Rostislav Daniel ◽  
Christian Mitterer ◽  
Keckes Jozef
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Elastic Moduli ◽  
Elastic Anisotropy ◽  
Interaction Model ◽  
X Ray Diffraction ◽  
X Ray ◽  
Anisotropic Factor ◽  
Polycrystalline Thin Films ◽  
Cu Thin Film

AbstractA new X-ray diffraction technique to determine elastic moduli of polycrystalline thin films deposited on monocrystalline substrates is demonstrated. The technique is based on the combination of sin2ψ and X-ray diffraction wafer curvature techniques which are used to characterize X-ray elastic strains and macroscopic stress in thin film. The strain measurements must be performed for various hkl reflections. The stresses are determined from the substrate curvature applying the Stoney's equation. The stress and strain values are used to calculate hkl reflection dependent X-ray elastic moduli. The mechanical elastic moduli can be then extrapolated from X-ray elastic moduli considering film macroscopic elastic anisotropy. The derived approach shows for which reflection and corresponding value of the X-ray anisotropic factor Γ the X-ray elastic moduli are equal to their mechanical counterparts in the case of fibre textured cubic polycrystalline aggregates. The approach is independent of the crystal elastic anisotropy and depends on the fibre texture type, the texture sharpness, the amount of randomly oriented crystallites and on the supposed grain interaction model. The new method is demonstrated on a fiber textured Cu thin film deposited on monocrystalline Si(100) substrate. The advantage of the new technique remains in the fact that moduli are determined non-destructively, using a static diffraction experiment and represent volume averaged quantities.

Elastic Properties of Artificially Layered Thin Films

1987 ◽  
Vol 103 ◽  
Author(s):  
Robert C. Cammarata
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Composite Materials ◽  
Elastic Properties ◽  
Elastic Moduli ◽  
Metallic Thin Films ◽  
Theoretical Understanding ◽  
Composition Modulation

ABSTRACTEnhancements in the elastic moduli by factors of two or more in compositionally modulated metallic thin films have been observed for a certain range of composition modulation wavelengths. The experimental and theoretical understanding of this phenomenon, known as the supermodulus effect, is reviewed. Also, the mechanical properties of other artificially layered and composite materials are discussed and compared with the behavior of metallic superlattice thin films.

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