Temperature dependence of surface photovoltage of bulk semiconductors and the effect of surface passivation

2000 ◽  
Vol 77 (26) ◽  
pp. 4383-4385 ◽  
Author(s):  
Shouvik Datta ◽  
M. R. Gokhale ◽  
A. P. Shah ◽  
B. M. Arora ◽  
Shailendra Kumar
2019 ◽  
Vol 48 (10) ◽  
pp. 6437-6445
Author(s):  
Eduardo F. Barbosa ◽  
Jaqueline A. Coelho ◽  
Edna R. Spada ◽  
Daniel R. B. Amorim ◽  
Livia M. C. Souza ◽  
...  

2017 ◽  
Vol 71 (10) ◽  
pp. 707-710 ◽  
Author(s):  
In Ho Kang ◽  
Moon Kyong Na ◽  
Ogyun Seok ◽  
Jeong Hyun Moon ◽  
H. W. Kim ◽  
...  

1995 ◽  
Vol 379 ◽  
Author(s):  
J.C. Sturm ◽  
A. St. Amour ◽  
Y. Lacroix ◽  
M.L.W. Thewalt

ABSTRACTThis paper quickly reviews the structure of band-edge luminescence in Si/strained Si1−xGex heterostructures, and then focusses on two recent developments -- the origin of “deep” sub-bandgap luminescence which is sometimes observed in structures grown by Molecular Beam Epitaxy (MBE) and the understanding of the temperature dependence of the band-edge luminescence (up to room temperature). Strong evidence will be presented that the origin of the deep luminescence is radiation damage, and that generated defects are segregated or trapped in the SilxGex layers. The modelling of the temperature dependence by twocarrier numerical simulation is presented for the first time. The work and experimental data show convincingly that the strength of the luminescence at high temperature is controlled by recombination at the top silicon surface, which in turn can be controlled by surface passivation. At high pump powers and low temperatures, Auger recombination reduces the lifetime in the Si1−xGex layers, and leads to a luminescence vs. temperature which is flat up to 250 K and which is reduced only by a factor of three at room temperature.


2012 ◽  
Vol 55 (6) ◽  
pp. 1469-1474 ◽  
Author(s):  
Le Wang ◽  
Ke Wu ◽  
QianMin Dong ◽  
XiaoYan Li ◽  
SiYu Xiong ◽  
...  

2011 ◽  
Vol 25 (04) ◽  
pp. 531-542
Author(s):  
CABİR TEMİRCİ ◽  
BAHRI BATI

We have fabricated the Sn/p-Si Schottky barrier diodes with the interfacial layer metal–insulator–semiconductor (D-MIS) and the surface passivation metal–semiconductor MS (D-MS) by the anodization or chemical treatment method. The current–voltage (I–V) and capacitance–voltage (C–V) characteristics of the devices were measured at room temperature. We obtained that the excess capacitance (C0) value of the MIS Sn/p-Si diode with the anodic oxide layer of 16.88 pF and 0.12 pF for the MS Sn/p-Si ideal diode with the surface passivation by the anodization or chemical treatment method from reverse bias C–V characteristics. Thus, we have succeeded to diminish the excess capacitance value to the limit of 0.12 pF for the MS Sn/p-Si diode by using the anodization or chemical treatment method.


2015 ◽  
Vol 653 ◽  
pp. 624-628 ◽  
Author(s):  
Fikria Jabli ◽  
Mohamed Ali Zaidi ◽  
Nawfel Ben Hamadi ◽  
S. Althoyaib ◽  
Malek Gassoumi

Nanoscale ◽  
2015 ◽  
Vol 7 (13) ◽  
pp. 5706-5711 ◽  
Author(s):  
Victor Malgras ◽  
Andrew Nattestad ◽  
Yusuke Yamauchi ◽  
Shi Xue Dou ◽  
Jung Ho Kim

In-depth structural study of methanol treated S-rich PbS quantum dots undergoing hydroxylation under atmospheric conditions.


Sign in / Sign up

Export Citation Format

Share Document