Electrical activation of implanted Be, Mg, Zn, and Cd in GaAs by rapid thermal annealing

1985 ◽  
Vol 58 (8) ◽  
pp. 3252-3254 ◽  
Author(s):  
S. J. Pearton ◽  
K. D. Cummings ◽  
G. P. Vella‐Coleiro
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Electrical Activation

The effects of point defects on the electrical activation of Si-implanted GaAs during rapid thermal annealing

1992 ◽  
Vol 39 (1) ◽  
pp. 176-183 ◽  
Author(s):  
J.-L. Lee ◽  
L. Wei ◽  
S. Tanigawa ◽  
T. Nakagawa ◽  
K. Ohta ◽  
...  
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Point Defects ◽  
Electrical Activation

The Ion Implanted Arsenic Tail in Silicon

1989 ◽  
Vol 147 ◽  
Author(s):  
S. E. Beck ◽  
R. J. Jaccodine ◽  
C. Clark
Keyword(s):  
Silicon Dioxide ◽  
Thermal Annealing ◽  
Anodic Oxidation ◽  
Rapid Thermal Annealing ◽  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Electrical Activation ◽  
Spreading Resistance ◽  
Transient Spectroscopy ◽  
And Diffusion

AbstractRapid thermal annealed tail regions of shallow junction arsenic implants into silicon have been investigated. Tail profiles have been roduced by an anodic oxidation and stripping technique after implantation to fluences of 1014 to 1016 cm−2 and by implanting through a layer of silicon dioxide. Electrical activation and diffusion have been achieved by rapid thermal annealing in the temperature range of 800 to 1100 °C. Electrically active defects remain after annealing. Spreading resistance and deep level transient spectroscopy results are presented. The diffusion of the arsenic tail is discussed and compared with currently accepted models.

Rapid Thermal Annealing of InP Implanted with Group IV Eleients

1993 ◽  
Vol 300 ◽  
Author(s):  
M.C. Ridgway ◽  
P Kringhoj
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Carrier Mobility ◽  
Annealing Temperature ◽  
Group Iv ◽  
Electrical Activation ◽  
Temperature Range ◽  
Group Iv Elements

ABSTRACTElectrical activation and carrier mobility have been studied as a function of ion dose and annealing temperature for InP implanted with Group IV elements (Si, Ge and Sn). In general, electrical activation increases with decreasing ion dose and/or increasing annealing temperature. Si and Sn exhibit comparable activation and mobility, superior to that of Ge, over the ion dose and temperature range examined. The relative influences of implantation-induced non-stoichiometry and the amphoteric behaviour of the group IV elements have been investigated. For the latter, the amphoteric behavior of Ge > Si > Sn.

Activation Mechanisms in Ion-Implanted GaAs

1988 ◽  
Vol 126 ◽  
Author(s):  
N. Morris ◽  
B. J. Sealy
Keyword(s):  
Electrical Properties ◽  
Electrical Activity ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Annealing Time ◽  
Electrical Activation ◽  
Annealing Stage ◽  
Activation Mechanisms ◽  
Ion Implanted

ABSTRACTRapid thermal annealing has been used to study the electrical activation mechanisms for magnesium and selenium implants in GaAs. By analysing the changes in electrical activity as a function of annealing time and temperature, a model has been developed which accurately predicts the electrical properties following the post-implant annealing stage. The model has been used to study the activation of other ions, particularly zinc, beryllium, tin and sulphur, the results of which will be compared with those of magnesium and selenium. The results suggest that the mechanism for electrical activation is dominated by the diffusion of gallium, arsenic or vacancies. The paper will present the model and discuss the activation mechanisms of the ions.

Effects of Vacancy-Type Defects on Electrical-Activation of P+ Implanted into Silicon

1996 ◽  
Vol 439 ◽  
Author(s):  
M. Watanabe ◽  
T. Kitano ◽  
S. Asada ◽  
A. Uedono ◽  
T. Moriya ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Positron Annihilation ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Mass Spectroscopy ◽  
Diffusion Length ◽  
Electrical Activation ◽  
Secondary Ion ◽  
Sr Method ◽  
Oxygen Complexes

AbstractThe effects of vacancy-type defects induced by ion implantation on the electricalactivation of implanted phosphorus by rapid thermal annealing (RTA) are investigated using the positron annihilation technique, secondary ion mass spectroscopy (SIMS) and the spreading resistance (SR) method. P÷ ions are implanted into bare Si wafers and into Si through Si02 films at 700 keV with doses of the order of l×1013 cm−2. After implantation, rapid thermal annealing (RTA) is performed at temperatures between 600 and 1100 °C for 20 sec. The result shows that vacancy-type defects compensate the electrical-activation of P implanted into Si and also recoiled- oxygen is affected on the electrical-activation of P. The species of main defects for compensating the electrical-activation is identified as a divacancy (V2) from the lifetime of positrons. Effects of recoiled oxygen on the electricalactivation are attributed to the formation of vacancy-oxygen complexes just below the SiO2/Si interface and a resultant decrease in the diffusion length of vacancy-type defects.

Rapid Thermal Annealing for Electrical Activation in the Fabrication of GaAs MESFET

1993 ◽  
Vol 300 ◽  
Author(s):  
S.W. Choi ◽  
J.W. Yang ◽  
B.H. Koak ◽  
K.I. Cho ◽  
H.M. Park
Keyword(s):  
Silicon Nitride ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Gaas Substrate ◽  
Electrical Activation ◽  
Gaas Mesfet ◽  
Channel Layer ◽  
Activation Efficiency ◽  
Maximum Activation ◽  
C 30

ABSTRACTRapid thermal annealing (RTA) has been employed for the electrical activation of shallow n-channel layer by Si+ implantation in the fabrication of GaAs MESFET. To prevent considerable outdiffusion of gallium and arsenic from GaAs substrate during annealing, encapsulating layers such as SiNx and SiNx/SiO2 are deposited. The SiNx/SiO2 double dielectric encapsulant is shown to be more effective to improve the electrical activation. Depending on RTA temperature between 900 and 950°C, the maximum activation efficiency exhibits 77% at the implanted energy of 70 keV and the dose of 5×1012 cm−2. SIMS analyses show the reduction of the hydrogen contained in the silicon nitride and no outdiffusion of Ga and As during RTA. It also shows the sharp Si-profile after RTA at 950°C, 30 sec. The MESFET fabricated using activaton with RTA provides better transconductance than that with furnace-annealed activation.

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