Dopant activation in ion implanted silicon by microwave annealing

2009 ◽  
Vol 106 (11) ◽  
pp. 114902 ◽  
Author(s):  
T. L. Alford ◽  
D. C. Thompson ◽  
J. W. Mayer ◽  
N. David Theodore
2013 ◽  
Vol 103 (19) ◽  
pp. 192103 ◽  
Author(s):  
Zhao Zhao ◽  
N. David Theodore ◽  
Rajitha N. P. Vemuri ◽  
Sayantan Das ◽  
Wei Lu ◽  
...  

1996 ◽  
Author(s):  
J.A. Gardner ◽  
M.V. Rao ◽  
Y.L. Tian ◽  
O.W. Holland ◽  
G. Kelner ◽  
...  

Author(s):  
Siddarth G. Sundaresan ◽  
Yong-lai Tian ◽  
Mark C. Ridgway ◽  
Nadeemullah A. Mahadik ◽  
Syed B. Qadri ◽  
...  

2010 ◽  
Vol 1245 ◽  
Author(s):  
Terry L. Alford ◽  
Karthik Sivaramakrishnan ◽  
Anil Indluru ◽  
Iftikhar Ahmad ◽  
Bob Hubbard ◽  
...  

AbstractVariable frequency microwaves (VFM) and rapid thermal annealing (RTA) were used to activate ion implanted dopants and re-grow implant-damaged silicon. Four-point-probe measurements were used to determine the extent of dopant activation and revealed comparable resistivities for 30 seconds of RTA annealing at 900 °C and 6-9 minutes of VFM annealing at 540 °C. Ion channeling analysis spectra revealed that microwave heating removes the Si damage that results from arsenic ion implantation to an extent comparable to RTA. Cross-section transmission electron microscopy demonstrates that the silicon lattice regains nearly all of its crystallinity after microwave processing of arsenic implanted silicon. Secondary ion mass spectroscopy reveals limited diffusion of dopants in VFM processed samples when compared to rapid thermal annealing. Our results establish that VFM is an effective means of low-temperature dopant activation in ion-implanted Si.


2011 ◽  
Vol 32 (2) ◽  
pp. 194-196 ◽  
Author(s):  
Yao-Jen Lee ◽  
Shang-Shiun Chuang ◽  
Fu-Kuo Hsueh ◽  
Ho-Ming Lin ◽  
Shich-Chuang Wu ◽  
...  

1982 ◽  
Vol 13 ◽  
Author(s):  
J.S. Williams

ABSTRACTThis paper provides a brief overview of the application of transient annealing to the removal of ion implantation damage and dopant activation in GaAs. It is shown that both the liquid phase and solid phase annealing processes are more complex in GaAs than those observed in Si. Particular attention is given to observations of damage removal, surface dissociation, dopant redistribution, solubility and the electrical properties of GaAs. The various annealing mechanisms are discussed and areas in need of further investigation are identified.


2009 ◽  
Author(s):  
K. Hara ◽  
Y. Tanushi ◽  
S. Kuroki ◽  
K. Kotani ◽  
T. Ito

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