Strain induced changes in gate leakage current and dielectric constant of nitrided Hf-silicate metal oxide semiconductor capacitors

2008 ◽  
Vol 93 (15) ◽  
pp. 153505 ◽  
Author(s):  
S. Y. Son ◽  
Y. S. Choi ◽  
P. Kumar ◽  
H. W. Park ◽  
T. Nishida ◽  
...  
2016 ◽  
Vol 619 ◽  
pp. 48-52 ◽  
Author(s):  
Chengji Jin ◽  
Hongliang Lu ◽  
Yimen Zhang ◽  
He Guan ◽  
Zheng Li ◽  
...  

2003 ◽  
Vol 42 (Part 1, No. 5A) ◽  
pp. 2628-2632 ◽  
Author(s):  
Heng-Sheng Huang ◽  
Chia-Hung Huang ◽  
Yen-Ching Wu ◽  
Yao-Kai Hsu ◽  
Jeng-Kang Chen ◽  
...  

Author(s):  
Dong Gun Kim ◽  
Cheol Hyun An ◽  
Sanghyeon Kim ◽  
Dae Seon Kwon ◽  
Junil Lim ◽  
...  

Atomic layer deposited TiO2- and Al2O3-based high-k gate insulator (GI) were examined for the Ge-based metal-oxide-semiconductor capacitor application. The single-layer TiO2 film showed a too high leakage current to be...


2015 ◽  
Vol 821-823 ◽  
pp. 177-180 ◽  
Author(s):  
Chiaki Kudou ◽  
Hirokuni Asamizu ◽  
Kentaro Tamura ◽  
Johji Nishio ◽  
Keiko Masumoto ◽  
...  

Homoepitaxial layers with different growth pit density were grown on 4H-SiC Si-face substrates by changing C/Si ratio, and the influence of the growth pit density on Schottky barrier diodes and metal-oxide-semiconductor capacitors were investigated. Even though there were many growth pits on the epi-layer, growth pit density did not affect the leakage current of Schottky barrier diodes and lifetime of constant current time dependent dielectric breakdown. By analyzing the growth pit shape, the aspect ratio of the growth pit was considered to be the key factor to the leakage current of the Schottky barrier diodes and the lifetime of metal-oxide-semiconductor capacitors.


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