Development of liquid-environment frequency modulation atomic force microscope with low noise deflection sensor for cantilevers of various dimensions

2006 ◽  
Vol 77 (4) ◽  
pp. 043701 ◽  
Author(s):  
Takeshi Fukuma ◽  
Suzanne P. Jarvis
Keyword(s):  
Atomic Force Microscope ◽  
Frequency Modulation ◽  
Low Noise ◽  
Liquid Environment ◽  
Atomic Force

Frequency modulation detection atomic force microscopy in the liquid environment

2001 ◽  
Vol 72 (S1) ◽  
pp. S129-S132 ◽  
Author(s):  
S.P. Jarvis ◽  
T. Ishida ◽  
T. Uchihashi ◽  
Y. Nakayama ◽  
H. Tokumoto
Keyword(s):  
Atomic Force Microscopy ◽  
Frequency Modulation ◽  
Liquid Environment ◽  
Force Microscopy ◽  
Atomic Force ◽  
Modulation Detection ◽  
Frequency Modulation Detection

Image Calculations with a Numerical Frequency-Modulation Atomic Force Microscope

2013 ◽  
Vol 117 (20) ◽  
pp. 10492-10501 ◽  
Author(s):  
F. Castanié ◽  
L. Nony ◽  
S. Gauthier ◽  
X. Bouju
Keyword(s):  
Atomic Force Microscope ◽  
Frequency Modulation ◽  
Atomic Force

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

2007 ◽  
Author(s):  
Joo Hoon Choi ◽  
Yangro Lee ◽  
Louis E. DeMarco ◽  
Richard T. Leveille ◽  
Joseph A. Levert ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Atomic Force Microscope ◽  
Chemical Mechanical Polishing ◽  
Surface Damage ◽  
Mechanical Polishing ◽  
Radius Of Curvature ◽  
Liquid Environment ◽  
Atomic Force ◽  
Friction Measurements ◽  
Circuit Components

The feature sizes on Integrated Circuits (ICs) continue to decrease to provide higher device densities and smaller chip designs. To accomplish this, current fabrication and processing technology must be advanced to achieve these goals. In particular, Chemical Mechanical Polishing (CMP), which is used for planarization of wafers and logic circuit components during IC fabrication, can cause severe surface damage to components in the form of delamination or distortion of surface features. CMP utilizes polishing particles suspended between a polymeric pad and the substrate to be polished. To control the process with higher precision the fundamentals of friction between CMP surfaces need to be analyzed. To investigate the friction contributions of the polishing particles in the CMP process, individual CMP abrasive particles are modeled by a silica atomic force microscope (AFM) probe with a radius of curvature on the order of 200 nm that is utilized in a scanning probe microscope (SPM). Lateral forces are measured that occur in simulated polishing of silica substrates and polyurethane pad material in a liquid environment. Results are obtained as a function of pH and environment and are compared with macroscopic friction results obtained using a high precision tribometer with a glass ball.

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