Inference of Plasma Parameters from Measurement of E and B Fields in a Coaxial Accelerator

1964 ◽  
Vol 7 (11) ◽  
pp. S57 ◽  
Author(s):  
R. Lovberg
Keyword(s):  
Plasma Parameters ◽  
Coaxial Accelerator

scholarly journals Enhanced Wetting and Adhesive Properties by Atmospheric Pressure Plasma Surface Treatment Methods and Investigation Processes on the Influencing Parameters on HIPS Polymer

Polymers ◽  
2021 ◽  
Vol 13 (6) ◽  
pp. 901
Author(s):  
Miklós Berczeli ◽  
Zoltán Weltsch
Keyword(s):  
Surface Treatment ◽  
Plasma Treatment ◽  
Atmospheric Pressure ◽  
High Impact ◽  
Plasma Parameters ◽  
Plasma Surface ◽  
Wetting Properties ◽  
High Impact Polystyrene ◽  
Process Modification ◽  
Plasma Surface Treatment

The development of bonding technology and coating technologies require the use of modern materials and topologies for the demanding effect and modification of their wetting properties. For the industry, a process modification process that can be integrated into a process is the atmospheric pressure of air operation plasma surface treatment. This can be classified and evaluated based on the wettability, which has a significant impact on the adhesive force. The aim is to improve the wetting properties and to find the relationship between plasma treatment parameters, wetting, and adhesion. High Impact PolyStyrene (HIPS) was used as an experimental material, and then the plasma treatment can be treated with various adjustable parameters. The effect of plasma parameters on surface roughness, wetting contact angle, and using Fowkes theory of the surface energy have been investigated. Seven different plasma jet treatment distances were tested, combined with 5 scan speeds. Samples with the best plasma parameters were prepared from 25 mm × 25 mm overlapping adhesive joints using acrylic/cyanoacrylate. The possibility of creating a completely hydrophilic surface was achieved, where the untreated wetting edge angle decreased from 88.2° to 0° for distilled water and from 62.7° to 0° in the case of ethylene glycol. The bonding strength of High Impact PolyStyrene was increased by plasma treatment by 297%.

scholarly journals Dry Etching Performance and Gas-Phase Parameters of C6F12O + Ar Plasma in Comparison with CF4 + Ar

Materials ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1595
Author(s):  
Nomin Lim ◽  
Yeon Sik Choi ◽  
Alexander Efremov ◽  
Kwang-Ho Kwon
Keyword(s):  
Gas Phase ◽  
Photoelectron Spectroscopy ◽  
Reactive Ion Etching ◽  
Research Work ◽  
Optical Emission ◽  
Plasma Parameters ◽  
Ion Etching ◽  
Ar Plasma ◽  
Ar Gas ◽  
Etching Selectivity

This research work deals with the comparative study of C6F12O + Ar and CF4 + Ar gas chemistries in respect to Si and SiO2 reactive-ion etching processes in a low power regime. Despite uncertain applicability of C6F12O as the fluorine-containing etchant gas, it is interesting because of the liquid (at room temperature) nature and weaker environmental impact (lower global warming potential). The combination of several experimental techniques (double Langmuir probe, optical emission spectroscopy, X-ray photoelectron spectroscopy) allowed one (a) to compare performances of given gas systems in respect to the reactive-ion etching of Si and SiO2; and (b) to associate the features of corresponding etching kinetics with those for gas-phase plasma parameters. It was found that both gas systems exhibit (a) similar changes in ion energy flux and F atom flux with variations on input RF power and gas pressure; (b) quite close polymerization abilities; and (c) identical behaviors of Si and SiO2 etching rates, as determined by the neutral-flux-limited regime of ion-assisted chemical reaction. Principal features of C6F12O + Ar plasma are only lower absolute etching rates (mainly due to the lower density and flux of F atoms) as well as some limitations in SiO2/Si etching selectivity.

scholarly journals Effects of magnetic perturbations and radiation on the runaway avalanche

2021 ◽  
Vol 87 (2) ◽  
Author(s):  
P. Svensson ◽  
O. Embreus ◽  
S. L. Newton ◽  
K. Särkimäki ◽  
O. Vallhagen ◽  
...  
Keyword(s):  
Growth Rate ◽  
Runaway Electrons ◽  
Plasma Parameters ◽  
Perturbative Approach ◽  
Efficient Simulation ◽  
Strong Current ◽  
Magnetic Perturbations ◽  
Space Dynamics ◽  
Stochastic Magnetic Fields ◽  
Mitigation Methods

The electron runaway phenomenon in plasmas depends sensitively on the momentum- space dynamics. However, efficient simulation of the global evolution of systems involving runaway electrons typically requires a reduced fluid description. This is needed, for example, in the design of essential runaway mitigation methods for tokamaks. In this paper, we present a method to include the effect of momentum-dependent spatial transport in the runaway avalanche growth rate. We quantify the reduction of the growth rate in the presence of electron diffusion in stochastic magnetic fields and show that the spatial transport can raise the effective critical electric field. Using a perturbative approach, we derive a set of equations that allows treatment of the effect of spatial transport on runaway dynamics in the presence of radial variation in plasma parameters. This is then used to demonstrate the effect of spatial transport in current quench simulations for ITER-like plasmas with massive material injection. We find that in scenarios with sufficiently slow current quench, owing to moderate impurity and deuterium injection, the presence of magnetic perturbations reduces the final runaway current considerably. Perturbations localised at the edge are not effective in suppressing the runaways, unless the runaway generation is off-axis, in which case they may lead to formation of strong current sheets at the interface of the confined and perturbed regions.

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