Raman spectroscopy of GaN nucleation and free-standing layers grown by hydride vapor phase epitaxy on oxidized silicon

2003 ◽  
Vol 83 (4) ◽  
pp. 629-631 ◽  
Author(s):  
E. V. Konenkova ◽  
Yu. V. Zhilyaev ◽  
V. A. Fedirko ◽  
D. R. T. Zahn
CrystEngComm ◽  
2016 ◽  
Vol 18 (40) ◽  
pp. 7690-7695
Author(s):  
Seohwi Woo ◽  
Sangil Lee ◽  
Uiho Choi ◽  
Hyunjae Lee ◽  
Minho Kim ◽  
...  

A 2 in.-diameter free-standing m-plane GaN wafer was fabricated through in situ self-separation from m-plane sapphire using HCl chemical reaction etching (HCRE) in hydride vapor-phase epitaxy (HVPE).


1999 ◽  
Vol 38 (Part 2, No. 3A) ◽  
pp. L217-L219 ◽  
Author(s):  
Michael K. Kelly ◽  
Robert P. Vaudo ◽  
Vivek M. Phanse ◽  
Lutz Görgens ◽  
Oliver Ambacher ◽  
...  

2007 ◽  
Vol 253 (18) ◽  
pp. 7423-7428 ◽  
Author(s):  
T.B. Wei ◽  
R.F. Duan ◽  
J.X. Wang ◽  
J.M. Li ◽  
Z.Q. Huo ◽  
...  

2006 ◽  
Vol 35 (4) ◽  
pp. 613-617 ◽  
Author(s):  
Z. -Q. Fang ◽  
D. C. Look ◽  
A. Krtschil ◽  
A. Krost ◽  
F. A. Khan ◽  
...  

2016 ◽  
Vol 6 (1) ◽  
Author(s):  
Tongbo Wei ◽  
Jiankun Yang ◽  
Yang Wei ◽  
Ziqiang Huo ◽  
Xiaoli Ji ◽  
...  

1999 ◽  
Vol 595 ◽  
Author(s):  
Andrey Nikolaev ◽  
Irina Nikitina ◽  
Andrey Zubrilov ◽  
Marina Mynbaeva ◽  
Yuriy Melnik ◽  
...  

AbstractWe report on AlN wafers fabricated by hydride vapor phase epitaxy (HVPE). AlN thick layers were grown on Si substrates by HVPE. Growth rate was up to 60 microns per hour. After the growth of AlN layers, initial substrates were removed resulting in free-standing AlN wafers. The maximum thickness of AlN layer was about 1 mm. AlN free-standing single crystal wafers with a thickness ranging from 0.05 to 0.8 mm were studied by x-ray diffraction, transmission electron microscopy, optical absorption, and cathodoluminescence.


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