Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

2003 ◽  
Vol 82 (7) ◽  
pp. 1045-1047 ◽  
Author(s):  
Hua Ye ◽  
Cemal Basaran ◽  
Douglas Hopkins
Keyword(s):  
Electric Current ◽  
Joule Heating ◽  
Solder Joints ◽  
Current Stressing

scholarly journals Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

Crystals ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 85
Author(s):  
Bo Wang ◽  
Wangyun Li ◽  
Kailin Pan
Keyword(s):  
Shear Strength ◽  
Critical Current Density ◽  
Joule Heating ◽  
Current Density ◽  
Solder Joints ◽  
Solder Matrix ◽  
Ball Grid Array ◽  
Current Stressing ◽  
Shear Performance ◽  
Array Structure

The shear performance and fracture behavior of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing electric current density (from 1.0 × 103 to 6.0 × 103 A/cm2) at various test temperatures (25 °C, 55 °C, 85 °C, 115 °C, 145 °C, and 175 °C) were investigated systematically. Shear strength increases initially, then decreases with increasing current density at a test temperature of no more than 85 °C; the enhancement effect of current stressing on shear strength decreases and finally diminishes with increasing test temperatures. These changes are mainly due to the counteraction of the athermal effect of current stressing and Joule heating. After decoupling and quantifying the contribution of the athermal effect to the shear strength of solder joints, the results show that the influence of the athermal effect presents a transition from an enhancement state to a deterioration state with increasing current density, and the critical current density for the transition decreases with increasing test temperatures. Joule heating is always in a deterioration state on the shear strength of solder joints, which gradually becomes the dominant factor with increasing test temperatures and current density. In addition, the fracture location changes from the solder matrix to the interface between the solder matrix and the intermetallic compound (IMC) layer (the solder/IMC layer interface) with increasing current density, showing a ductile-to-brittle transition. The interfacial fracture is triggered by current crowding at the groove of the IMC layer and driven by mismatch strain at the solder/IMC layer interface, and the critical current density for the occurrence of interfacial fracture decreases with increasing test temperatures.

Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints

2010 ◽  
Vol 26 (8) ◽  
pp. 737-742 ◽  
Author(s):  
X.J. Wang ◽  
Q.L. Zeng ◽  
Q.S. Zhu ◽  
Z.G. Wang ◽  
J.K. Shang
Keyword(s):  
Solder Joints ◽  
Shear Properties ◽  
Current Stressing

A competition between stress triaxiality and joule heating on microstructure evolution and degradation of SnAgCu solder joints

2020 ◽  
Vol 54 ◽  
pp. 221-227
Author(s):  
Waluyo Adi Siswanto ◽  
M. Arun ◽  
Irina V. Krasnopevtseva ◽  
A. Surendar ◽  
Andino Maseleno
Keyword(s):  
Joule Heating ◽  
Microstructure Evolution ◽  
Solder Joints ◽  
Stress Triaxiality ◽  
Snagcu Solder

Interaction of thermal cycling and electric current on reliability of solder joints in different solder balls

2019 ◽  
Vol 6 (10) ◽  
pp. 106302 ◽  
Author(s):  
Yufeng Jiao ◽  
Kittisak Jermsittiparsert ◽  
Aleksandr Yu Krasnopevtsev ◽  
Qahtan A Yousif ◽  
Mohammad Salmani
Keyword(s):  
Thermal Cycling ◽  
Electric Current ◽  
Solder Joints ◽  
Solder Balls ◽  
Reliability Of Solder Joints
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