Three-dimensional simulation on current-density distribution in flip-chip solder joints under electric current stressing

2005 ◽  
Vol 98 (4) ◽  
pp. 044509 ◽  
Author(s):  
T. L. Shao ◽  
S. W. Liang ◽  
T. C. Lin ◽  
Chih Chen
Keyword(s):  
Density Distribution ◽  
Electric Current ◽  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
Three Dimensional ◽  
Current Density Distribution ◽  
Current Stressing ◽  
Dimensional Simulation

Three-Dimensional Current Density Distribution Simulations for a Resistive Patterned Wafer

2004 ◽  
Vol 151 (9) ◽  
pp. D78 ◽  
Author(s):  
M. Purcar ◽  
B. Van den Bossche ◽  
L. Bortels ◽  
J. Deconinck ◽  
G. Nelissen
Keyword(s):  
Density Distribution ◽  
Current Density ◽  
Three Dimensional ◽  
Current Density Distribution

Transient Multi-Field FEA Model for Predicting Current Density Distribution When Deforming Sheet Metal Under a Direct Current

2008 ◽  
Author(s):  
John T. Roth ◽  
Amir Khalilollahi ◽  
Daniel J. Jageman
Keyword(s):  
Temperature Distribution ◽  
Density Distribution ◽  
Sheet Metal ◽  
Current Density ◽  
Three Dimensional ◽  
Current Density Distribution ◽  
Electrode Placement ◽  
Dome Height ◽  
Current Electrode ◽  
Fea Model

Previous investigations have been performed that involve developing new ways in which to deform a material while minimizing the energy required to do so. More recent research involves applying an electric current to the workpiece to achieve superplasticity. However, those investigations only utilized uniaxial workpieces and lack the ability to be used for more common geometries. The research presented herein, however, the effect is investigated under three-dimensional conditions so that the results could be projected to more realistic sheet metal geometries. A working finite element analysis (FEA) model has been developed to analyze these more complicated three-dimensional flow fields and will be presented as a part of this research. The model was used to solve for the temperature and current density distributions across the workpiece. The results from the FEA model are compared to results obtained from experimental tests. In the experimental setup, the two dome heights were separately tested under the same conditions that the FEA model simulated, however, only a temperature distribution was obtained here. The comparison of the FEA results and the experimental results related the temperature distribution to the current density distribution across the workpiece. From here, the individual effects of certain parameters on the distributions were found. The parameters included: duration of current, amount of current, electrode placement, and dome height geometry. The results showed that the current density distribution can be manipulated by varying the above parameters. This capability can be used to delay tearing/necking of a sheet metal workpiece under deformation.

Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Yi-Shao Lai ◽  
Ying-Ta Chiu
Keyword(s):  
Intermetallic Compound ◽  
Ambient Temperature ◽  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
Average Current Density ◽  
Current Stressing ◽  
Weight Content ◽  
Average Current ◽  
Better Than

This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn–3Ag–1.5Cu∕Sn–3Ag–0.5Cu composite flip-chip solder joints with Ti∕Ni(V)∕Cu under bump metallurgy (UBM), bonded on Au∕Ni∕Cu substrate pads. The solder joints were subjected to an average current density of 5kA∕cm2 under an ambient temperature of 150°C. Under the situation when electron charges flow from the UBM toward the substrate, Sn diffuses from the Cu–Ni–Sn intermetallic compound developed around the UBM toward the UBM and eventually causes the Ni(V) layer to deform. Electromigration reliability of Sn–3Ag–1.5Cu∕Sn–3Ag–0.5Cu composite flip-chip solder joints was found to be better than that of Sn–3Ag–0.5Cu solder joints. According to the morphological observations on cross-sectioned solder joints, a failure mechanism is proposed as follows. Since the deformation of the Ni(V) layer as a result of Sn diffusion toward the UBM is considered as the dominant failure, a greater Cu weight content in the solder joints would trap more Sn in the Sn–Cu interfacial reaction and would therefore retard the diffusion of Sn toward the UBM and hence enhance the electromigration reliability.

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