Microcontact printing of catalytic nanoparticles for selective electroless deposition of metals on nonplanar polymeric substrates

2002 ◽  
Vol 81 (16) ◽  
pp. 3097-3099 ◽  
Author(s):  
W. K. Ng ◽  
L. Wu ◽  
P. M. Moran
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing ◽  
Catalytic Nanoparticles ◽  
Polymeric Substrates

Direct Patterning of NiB on Glass Substrates Using Microcontact Printing and Electroless Deposition

Langmuir ◽  
2003 ◽  
Vol 19 (15) ◽  
pp. 6283-6296 ◽  
Author(s):  
Matthias Geissler ◽  
Hannes Kind ◽  
Patrick Schmidt-Winkel ◽  
Bruno Michel ◽  
Emmanuel Delamarche
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing ◽  
Glass Substrates ◽  
Direct Patterning

Three-Dimensional Metallized Features on Polymeric Substrates by Microcontact Printing

Langmuir ◽  
2006 ◽  
Vol 22 (6) ◽  
pp. 2430-2432 ◽  
Author(s):  
Vinalia Tjong ◽  
Lei Wu ◽  
Peter M. Moran
Keyword(s):  
Microcontact Printing ◽  
Three Dimensional ◽  
Polymeric Substrates

Microcontact Printing of Palladium Colloids:  Micron-Scale Patterning by Electroless Deposition of Copper

Langmuir ◽  
1996 ◽  
Vol 12 (5) ◽  
pp. 1375-1380 ◽  
Author(s):  
Pirmin C. Hidber ◽  
Wolfgang Helbig ◽  
Enoch Kim ◽  
George M. Whitesides
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing

New Pairs of Inks and Papers for Photolithography, Microcontact Printing, and Scanning Probe Nanolithography

2002 ◽  
Vol 737 ◽  
Author(s):  
Lon A. Porter ◽  
Hee Cheul Choi ◽  
J. M. Schmeltzer ◽  
Alexander E. Ribbe ◽  
Jillian M. Buriak
Keyword(s):  
Photoelectron Spectroscopy ◽  
Precious Metal ◽  
Large Scale ◽  
Electroless Deposition ◽  
Microcontact Printing ◽  
Device Fabrication ◽  
Scanning Probe ◽  
Nanoelectromechanical Systems ◽  
Ambient Conditions ◽  
Metal Thin Films

ABSTRACTCurrently, there is considerable interest in producing patterned metallic structures with reduced dimensions for use in technologies such as ultra large scale integration (ULSI) device fabrication, nanoelectromechanical systems (NEMS), and arrayed nanosensors, without sacrificing throughput or cost effectiveness. Research in our laboratory has focused on the preparation of precious metal thin films on semiconductor substrates via electroless deposition. This method provides for the facile interfacing of metal nanoparticles with a group (IV) and III-IV compound semiconductor surfaces. Morphologically complex films composed of gold, platinum, and palladium nanoparticles have been prepared as a result of the immersion of germanium and gallium arsenide substrates into dilute, aqueous solutions of tetrachloraurate (III), tetrachloroplatinate (II), and tetrachloropalladate (II), respectively. Continuous metallic films form spontaneously under ambient conditions, in the absence of a fluoride source or an externally applied current. This facile electroless deposition methodology provides an alternative to complex and expensive vacuum methods of metallization, yet allows for the preparation of both thin and thick nanostructured films with control over surface morphology and deposition rate. Furthermore, precious metal films prepared in this way exhibit excellent adhesion to the underlying semiconductor substrate. The resultant films were characterized utilizing scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and scanning probe microscopy (SPM). In order to apply this novel metallization method toward the development of useful technologies, patterning utilizing photolithography, microcontact printing (μCP), and scanning probe nanolithography (SPN) has been demonstrated.

Patterned Electroless Deposition of Copper by Microcontact Printing Palladium(II) Complexes on Titanium-Covered Surfaces

Langmuir ◽  
2000 ◽  
Vol 16 (16) ◽  
pp. 6367-6373 ◽  
Author(s):  
Hannes Kind ◽  
Matthias Geissler ◽  
Heinz Schmid ◽  
Bruno Michel ◽  
Klaus Kern ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing
Sign in / Sign up

Export Citation Format

Share Document