Three-Dimensional Metallized Features on Polymeric Substrates by Microcontact Printing

Langmuir ◽  
2006 ◽  
Vol 22 (6) ◽  
pp. 2430-2432 ◽  
Author(s):  
Vinalia Tjong ◽  
Lei Wu ◽  
Peter M. Moran
Keyword(s):  
Microcontact Printing ◽  
Three Dimensional ◽  
Polymeric Substrates

scholarly journals From 2D to 3D patches on multifunctional particles: how microcontact printing creates a new dimension of functionality

Soft Matter ◽  
2018 ◽  
Vol 14 (12) ◽  
pp. 2301-2309 ◽  
Author(s):  
Marc Zimmermann ◽  
Daniela John ◽  
Dmitry Grigoriev ◽  
Nikolay Puretskiy ◽  
Alexander Böker
Keyword(s):  
Surface Modification ◽  
Microcontact Printing ◽  
Three Dimensional ◽  
Silica Particles ◽  
Straightforward Approach ◽  
2D To 3D

A straightforward approach for the precise multifunctional surface modification of silica particles with three-dimensional patches using microcontact printing is presented.

Three-dimensional (3D) hierarchical oxygen plasma micro/nanostructured polymeric substrates for selective enrichment of cancer cells from mixtures with normal ones

2020 ◽  
Vol 187 ◽  
pp. 110675 ◽  
Author(s):  
Anastasia Kanioura ◽  
Panagiota Petrou ◽  
Dimitris Kletsas ◽  
Angeliki Tserepi ◽  
Margarita Chatzichristidi ◽  
...  
Keyword(s):  
Cancer Cells ◽  
Oxygen Plasma ◽  
Three Dimensional ◽  
Selective Enrichment ◽  
Polymeric Substrates

Techniques and Applications for Non-Planar Lithography

2002 ◽  
Vol 739 ◽  
Author(s):  
John A. Rogers
Keyword(s):  
High Resolution ◽  
Microcontact Printing ◽  
Three Dimensional ◽  
Contact Printing ◽  
Nanometer Resolution ◽  
Replica Molding ◽  
Flat Surfaces ◽  
Operational Characteristics ◽  
Printing Technique

ABSTRACTCertain classes of three dimensional nanostructures can be fabricated by contact printing patterns onto curved or non-flat surfaces. This paper reviews some of our work that demonstrates this approach by using microcontact printing to form a range of three dimensional structures with feature sizes as small as 1–2 microns and it demonstrates their use in a variety of functional devices. We also describe a nanotransfer printing technique with operational characteristics that are similar to those of microcontact printing but which enables nanometer resolution. High resolution replica molding techniques provide a method for producing copies of some of these printed structures.

Selectively Metallized Polymeric Substrates by Microcontact Printing an Aluminum(III) Porphyrin Complex

2010 ◽  
Vol 132 (2) ◽  
pp. 765-772 ◽  
Author(s):  
Michael S. Miller ◽  
Heather L. Filiatrault ◽  
Gregory J. E. Davidson ◽  
Minmin Luo ◽  
Tricia Breen Carmichael
Keyword(s):  
Microcontact Printing ◽  
Porphyrin Complex ◽  
Polymeric Substrates

Nanolithography using molecular films and processing

2017 ◽  
Author(s):  
C.L. McGuiness ◽  
R.K. Smith ◽  
M.E. Anderson ◽  
P.S. Weiss ◽  
D.L. Allara
Keyword(s):  
Self Assembly ◽  
Nanoimprint Lithography ◽  
Film Growth ◽  
Microcontact Printing ◽  
Three Dimensional ◽  
Building Blocks ◽  
Direct Write ◽  
Molecular Films ◽  
Molecular Assemblies ◽  
Molecular Rulers

This article focuses on the use of molecular films as building blocks for nanolithography. More specifically, it reviews efforts aimed at utilizing organic molecular assemblies in overcoming the limitations of lithography, including self-patterning and directed patterning. It considers the methods of patterning self-assembled organic monolayer films through soft-lithographic methods such as microcontact printing and nanoimprint lithography, through direct ‘write’ or ‘machine’ processes with a nanometer-sized tip and through exposure to electron or photon beams. It also discusses efforts to pattern the organic assemblies via the physicochemical self-assembling interactions, including patterning via phase separation of chemically different molecules and insertion of guest adsorbates into host matrices. Furthermore, it examines the efforts that have been made to couple patterned molecular assemblies with inorganic thin-film growth methods to form spatially constrained, three-dimensional thin films. Finally, it describes a hybrid self-assembly/conventional lithography (i.e. molecular rulers) approach to forming nanostructures.

scholarly journals Microtechnology-based methods for organoid models

2020 ◽  
Vol 6 (1) ◽  
Author(s):  
Vanessa Velasco ◽  
S. Ali Shariati ◽  
Rahim Esfandyarpour
Keyword(s):  
Lower Cost ◽  
Microcontact Printing ◽  
Three Dimensional ◽  
Rapid Progress ◽  
Stem Cell Technology ◽  
Nutrient Delivery ◽  
Production Methods ◽  
Production Techniques ◽  
Size Controlled

Abstract Innovations in biomaterials and stem cell technology have allowed for the emergence of novel three-dimensional (3D) tissue-like structures known as organoids and spheroids. As a result, compared to conventional 2D cell culture and animal models, these complex 3D structures have improved the accuracy and facilitated in vitro investigations of human diseases, human development, and personalized medical treatment. Due to the rapid progress of this field, numerous spheroid and organoid production methodologies have been published. However, many of the current spheroid and organoid production techniques are limited by complexity, throughput, and reproducibility. Microfabricated and microscale platforms (e.g., microfluidics and microprinting) have shown promise to address some of the current limitations in both organoid and spheroid generation. Microfabricated and microfluidic devices have been shown to improve nutrient delivery and exchange and have allowed for the arrayed production of size-controlled culture areas that yield more uniform organoids and spheroids for a higher throughput at a lower cost. In this review, we discuss the most recent production methods, challenges currently faced in organoid and spheroid production, and microfabricated and microfluidic applications for improving spheroid and organoid generation. Specifically, we focus on how microfabrication methods and devices such as lithography, microcontact printing, and microfluidic delivery systems can advance organoid and spheroid applications in medicine.

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
David A. Roberson ◽  
Ryan B. Wicker ◽  
Eric MacDonald
Keyword(s):  
Selection Process ◽  
Three Dimensional ◽  
Processing Parameters ◽  
Substrate Material ◽  
Direct Write ◽  
Conductive Inks ◽  
Structural Electronics ◽  
3D Structural Electronics ◽  
Substrate Resistance ◽  
Polymeric Substrates

Ohmic curing was utilized as a method to improve the conductivity of three-dimensional (3D) interconnects printed from silver-loaded conductive inks and pastes. The goal was to increase conductivity of the conductive path without inducing damage to the substrate. The 3D via/interconnect structure was routed within 3D polymeric substrates and had external and internal sections. The 3D structures were created by the additive manufacturing (AM) process of stereolithography (SL) and were designed to replicate manufacturing situations which are common in the fabrication of 3D structural electronics that involve a combination of AM and direct write (DW) processing steps. The photocurable resins the 3D substrates were made of possessed glass transition temperatures of 75 °C and 42 °C meaning that a nonthermal method to increase the conductivity of the printed traces was needed as the conductive inks tested in this study required oven cure temperatures greater than 100 °C to perform properly. Ohmic curing was shown to decrease the measured resistance of the via/interconnect structure without harming the substrate. Substrate damage was observed on thermally cured samples and was characterized by discoloration and scaling of the substrate. Resistance measurements of the via/interconnect structures revealed samples cured by the ohmic curing process performed equal or better than samples subjected to thermal curing. The work presented here demonstrates a method to overcome the thermal cure temperature limitations of polymeric substrates imposed on the processing parameters of conductive inks during the fabrication of 3D structural electronics and presents an example of overcoming a manufacturing process problem associated with this emerging technology. An ink selection process involving characterization of the compatibility of inks with the substrate material and the use of different inks for the via and interconnect sections was also discussed.

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