New Strategy for Controlling the Size and Shape of Metallic Features Formed by Electroless Deposition of Copper:  Microcontact Printing of Catalysts on Oriented Polymers, Followed by Thermal Shrinkage

Langmuir ◽  
1996 ◽  
Vol 12 (21) ◽  
pp. 5209-5215 ◽  
Author(s):  
Pirmin C. Hidber ◽  
Paul F. Nealey ◽  
Wolfgang Helbig ◽  
George M. Whitesides
Langmuir ◽  
2003 ◽  
Vol 19 (15) ◽  
pp. 6283-6296 ◽  
Author(s):  
Matthias Geissler ◽  
Hannes Kind ◽  
Patrick Schmidt-Winkel ◽  
Bruno Michel ◽  
Emmanuel Delamarche

Langmuir ◽  
1996 ◽  
Vol 12 (5) ◽  
pp. 1375-1380 ◽  
Author(s):  
Pirmin C. Hidber ◽  
Wolfgang Helbig ◽  
Enoch Kim ◽  
George M. Whitesides

2002 ◽  
Vol 737 ◽  
Author(s):  
Lon A. Porter ◽  
Hee Cheul Choi ◽  
J. M. Schmeltzer ◽  
Alexander E. Ribbe ◽  
Jillian M. Buriak

ABSTRACTCurrently, there is considerable interest in producing patterned metallic structures with reduced dimensions for use in technologies such as ultra large scale integration (ULSI) device fabrication, nanoelectromechanical systems (NEMS), and arrayed nanosensors, without sacrificing throughput or cost effectiveness. Research in our laboratory has focused on the preparation of precious metal thin films on semiconductor substrates via electroless deposition. This method provides for the facile interfacing of metal nanoparticles with a group (IV) and III-IV compound semiconductor surfaces. Morphologically complex films composed of gold, platinum, and palladium nanoparticles have been prepared as a result of the immersion of germanium and gallium arsenide substrates into dilute, aqueous solutions of tetrachloraurate (III), tetrachloroplatinate (II), and tetrachloropalladate (II), respectively. Continuous metallic films form spontaneously under ambient conditions, in the absence of a fluoride source or an externally applied current. This facile electroless deposition methodology provides an alternative to complex and expensive vacuum methods of metallization, yet allows for the preparation of both thin and thick nanostructured films with control over surface morphology and deposition rate. Furthermore, precious metal films prepared in this way exhibit excellent adhesion to the underlying semiconductor substrate. The resultant films were characterized utilizing scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and scanning probe microscopy (SPM). In order to apply this novel metallization method toward the development of useful technologies, patterning utilizing photolithography, microcontact printing (μCP), and scanning probe nanolithography (SPN) has been demonstrated.


1992 ◽  
Vol 32 (3-4) ◽  
pp. 259-300 ◽  
Author(s):  
M. Trznadel ◽  
M. Kryszewski

Langmuir ◽  
2000 ◽  
Vol 16 (16) ◽  
pp. 6367-6373 ◽  
Author(s):  
Hannes Kind ◽  
Matthias Geissler ◽  
Heinz Schmid ◽  
Bruno Michel ◽  
Klaus Kern ◽  
...  

1998 ◽  
Vol 39 (1) ◽  
pp. 140-142 ◽  
Author(s):  
G. V. Kozlov ◽  
V. A. Beloshenko ◽  
V. N. Varyukhin ◽  
M. A. Gazaev

1962 ◽  
Vol 32 (11) ◽  
pp. 960-962 ◽  
Author(s):  
Dusan C. Prevorsek ◽  
Arthur B. Coe ◽  
Arthur V. Tobolsky

Sign in / Sign up

Export Citation Format

Share Document