Interesting trends in direct current electrical conductivity of chemical vapor deposited diamond sheets

2001 ◽  
Vol 90 (3) ◽  
pp. 1642-1649 ◽  
Author(s):  
A. K. Sikder ◽  
D. S. Misra ◽  
Umesh Palnitkar ◽  
V. S. Shirodkar
Keyword(s):  
Electrical Conductivity ◽  
Direct Current ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

Effects of precursor additives on the stability of plasma enhanced chemical vapor deposited a-GeC(O):H films

2002 ◽  
Vol 17 (2) ◽  
pp. 367-375 ◽  
Author(s):  
A. Grill ◽  
S. Guilley ◽  
V. Patel ◽  
K. Babich
Keyword(s):  
Fourier Transform ◽  
Chemical Vapor Deposition ◽  
Direct Current ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Index Of Refraction ◽  
Negative Bias ◽  
Optical Gap ◽  
Chemical Vapor Deposited ◽  
The Stability

Germanium- and carbon-based films were deposited by plasma-enhanced chemical vapor deposition from tetramethylgermane (TMGe) with additions of oxygen, hydrogen, or argon. The index of refraction, extinction coefficient, and optical gap and Fourier transform infrared spectra of the films were measured as well as their stability in regular ambiance. It was found that the films deposited from pure TMGe were stable in time only if deposited at a negative bias above −250 V direct current. Films deposited at a bias of −150 V direct current could be stabilized by significant additions of oxygen to the plasma and complete stabilization was achieved at O2/TMGe ratios larger than 3 in the gas feed when GeOx films containing small amounts of C and H were obtained. Additions of hydrogen or argon to TMGe had only slight effects in improving the stability off the films.

Ion Beam Induced Interfacial Reactions in Molybdenum Thin Films on Silicon

1981 ◽  
Vol 39 ◽  
pp. 162-163
Author(s):  
L. J. Chen ◽  
L. S. Hung ◽  
J. W. Mayer
Keyword(s):  
Ion Beam ◽  
Chemical Vapor ◽  
Interfacial Reactions ◽  
Practical Applications ◽  
Microelectronic Devices ◽  
Recent Emergence ◽  
Chemical Vapor Deposited ◽  
Atomic Mixing ◽  
Silicon Interface ◽  
Kinetics Of

When an energetic ion penetrates through an interface between a thin film (of species A) and a substrate (of species B), ion induced atomic mixing may result in an intermixed region (which contains A and B) near the interface. Most ion beam mixing experiments have been directed toward metal-silicon systems, silicide phases are generally obtained, and they are the same as those formed by thermal treatment.Recent emergence of silicide compound as contact material in silicon microelectronic devices is mainly due to the superiority of the silicide-silicon interface in terms of uniformity and thermal stability. It is of great interest to understand the kinetics of the interfacial reactions to provide insights into the nature of ion beam-solid interactions as well as to explore its practical applications in device technology.About 500 Å thick molybdenum was chemical vapor deposited in hydrogen ambient on (001) n-type silicon wafer with substrate temperature maintained at 650-700°C. Samples were supplied by D. M. Brown of General Electric Research & Development Laboratory, Schenectady, NY.

Metal Microstructures in Advanced CMOS Devices

1996 ◽  
Vol 54 ◽  
pp. 358-359
Author(s):  
L. M. Gignac ◽  
K. P. Rodbell
Keyword(s):  
Grain Boundaries ◽  
Semiconductor Device ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Metal Films ◽  
Thin Metal ◽  
Electrical Performance ◽  
Thin Metal Films ◽  
Chemical Vapor Deposited ◽  
Boundary Properties

As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.

scholarly journals Grain boundaries in chemical-vapor-deposited atomically thin hexagonal boron nitride

2019 ◽  
Vol 3 (1) ◽  
Author(s):  
Xibiao Ren ◽  
Jichen Dong ◽  
Peng Yang ◽  
Jidong Li ◽  
Guangyuan Lu ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Grain Boundaries ◽  
Hexagonal Boron Nitride ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited
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