Defect generation in ultrathin silicon dioxide films produced by anode hole injection

2000 ◽  
Vol 77 (17) ◽  
pp. 2716-2718 ◽  
Author(s):  
D. J. DiMaria
1996 ◽  
Vol 80 (1) ◽  
pp. 304-317 ◽  
Author(s):  
D. J. DiMaria ◽  
E. Cartier ◽  
D. A. Buchanan

1994 ◽  
Vol 65 (14) ◽  
pp. 1820-1822 ◽  
Author(s):  
D. A. Buchanan ◽  
D. J. DiMaria ◽  
C‐A. Chang ◽  
Y. Taur

2018 ◽  
Vol 6 ◽  
pp. 803-807
Author(s):  
Jih-Chien Liao ◽  
Yu-Hsuan Chen ◽  
Chen-Hsin Lien ◽  
Osbert Cheng ◽  
Cheng-Tung Huang ◽  
...  

2001 ◽  
Vol 45 (10) ◽  
pp. 1773-1785 ◽  
Author(s):  
Mohammed T Quddus ◽  
Thomas A DeMassa ◽  
Dieter K Schroder ◽  
Julian J Sanchez

1999 ◽  
Vol 39 (6-7) ◽  
pp. 791-795 ◽  
Author(s):  
C. Jahan ◽  
S. Bruyère ◽  
G. Ghibaudo ◽  
E. Vincent ◽  
K. Barla

2001 ◽  
Vol 11 (03) ◽  
pp. 849-886 ◽  
Author(s):  
Yee-Chia Yeo ◽  
Qiang Lu ◽  
Chenming Hu

We review the development of the anode hole injection (AHI) model for reliability projection of the silicon dioxide gate dielectric. The experimental and theoretical foundation of the AHI model is presented. Recent development and implications for the reliability of ultra-thin oxides are discussed. AHI is used to illuminate the questions of E versus 1/E models and field-driven versus voltage-driven models. Building on the concept of effective thinning, the AHI model is applied for the interpretation of defect-induced breakdown data and for optimizing oxide screening conditions. Circuit level reliability projection as a function of operating time, temperature, and power supply voltage is also illustrated.


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