Low leakage current characteristics of YMnO3 on Si(111) using an ultrathin buffer layer of silicon oxynitride

2000 ◽  
Vol 88 (11) ◽  
pp. 6598-6604 ◽  
Author(s):  
E. Rokuta ◽  
Y. Hotta ◽  
H. Tabata ◽  
H. Kobayashi ◽  
T. Kawai
Keyword(s):  
Buffer Layer ◽  
Leakage Current ◽  
Silicon Oxynitride ◽  
Low Leakage ◽  
Low Leakage Current ◽  
Current Characteristics

Low leakage current in AlGaN/GaN HFETs with preflow of Mg source before growth of u-GaN buffer layer

2011 ◽  
Vol 208 (7) ◽  
pp. 1607-1610 ◽  
Author(s):  
Yoshinori Oshimura ◽  
Takayuki Sugiyama ◽  
Kenichiro Takeda ◽  
Motoaki Iwaya ◽  
Tetsuya Takeuchi ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Leakage Current ◽  
Low Leakage ◽  
Low Leakage Current ◽  
Gan Buffer Layer

Compact Spice Modeling and Design Optimization of Low Leakage a-Si:H TFTs for Large-Area Imaging Systems

1998 ◽  
Vol 507 ◽  
Author(s):  
R.V.R. Murthy ◽  
D. Pereira ◽  
B. Park ◽  
A. Nathan ◽  
S.G. Chamberlain
Keyword(s):  
Leakage Current ◽  
Reverse Current ◽  
Contact Layer ◽  
Large Area ◽  
Thermal Generation ◽  
Low Leakage ◽  
Low Leakage Current ◽  
Trap Assisted Tunneling ◽  
Current Characteristics ◽  
Gap States

ABSTRACTWe present a SPICE model that takes into account the different mechanisms contributing to leakage current in hydrogenated amorphous silicon (a-Si:H) thin film transistors (TFTs). The main sources of leakage current in these devices have been identified to be the parasitic reverse-biased p-i-n diode at the vicinity of the drain as well as diffusion of phosphorous atoms from micro-crystalline (n+ μc-Si:H) contact layer into the intrinsic a-Si:H region. The latter gives rise to ohmic conduction which dominates at very low drain voltages (< I V) and very low gate voltages (< 5 V). At higher gate voltages (5V ≤ VG ≤ 20 V), the reverse current of the parasitic p-i-n diode can be attributed to thermal generation of electrons from the valence to conduction bands through the mid-gap states in the a-Si:H. At even higher gate voltages (> 20 V), the reverse current is due to trap-assisted tunneling, whereby the electrons tunnel to the conduction band via the mid-gap states. A systematic characterization of TFTs with different a-Si:H layer thicknesses shows that the optimal thickness for low leakage current is around 50 nm. The bias dependent leakage current behavior has been modeled and implemented in SPICE using simple circuit elements based on voltage controlled current sources (VCCS). Simulated and measured reverse leakage current characteristics are in reasonable agreement.

Formation of Silicon Oxynitride Films with Low Leakage Current Using N2/O2Plasma near Atmospheric Pressure

2004 ◽  
Vol 43 (11B) ◽  
pp. 7853-7856 ◽  
Author(s):  
Ryoma Hayakawa ◽  
Takeshi Yoshimura ◽  
Atushi Ashida ◽  
Hiroya Kitahata ◽  
Motokazu Yuasa ◽  
...  
Keyword(s):  
Leakage Current ◽  
Atmospheric Pressure ◽  
Silicon Oxynitride ◽  
Low Leakage ◽  
Low Leakage Current

High nonlinearity and low leakage current SnO2 varistor ceramics by co-doping with yttrium and tantalum

2021 ◽  
Vol 285 ◽  
pp. 129120
Author(s):  
Wenxin Liang ◽  
Hongfeng Zhao ◽  
Xiaoji Meng ◽  
Shaohua Fan ◽  
Qingyun Xie
Keyword(s):  
Leakage Current ◽  
Co Doping ◽  
High Nonlinearity ◽  
Low Leakage ◽  
Low Leakage Current

Development of high k/III-V (InGaAs, InAs, InSb) structures for future low power, high speed device applications

2013 ◽  
Vol 1538 ◽  
pp. 291-302
Author(s):  
Edward Yi Chang ◽  
Hai-Dang Trinh ◽  
Yueh-Chin Lin ◽  
Hiroshi Iwai ◽  
Yen-Ku Lin
Keyword(s):  
Low Power ◽  
Leakage Current ◽  
High Speed ◽  
High Performance ◽  
Gate Oxide ◽  
Chemical Cleaning ◽  
Low Leakage ◽  
Low Leakage Current ◽  
High K ◽  
Cleaning Methods

ABSTRACTIII-V compounds such as InGaAs, InAs, InSb have great potential for future low power high speed devices (such as MOSFETs, QWFETs, TFETs and NWFETs) application due to their high carrier mobility and drift velocity. The development of good quality high k gate oxide as well as high k/III-V interfaces is prerequisite to realize high performance working devices. Besides, the downscaling of the gate oxide into sub-nanometer while maintaining appropriate low gate leakage current is also needed. The lack of high quality III-V native oxides has obstructed the development of implementing III-V based devices on Si template. In this presentation, we will discuss our efforts to improve high k/III-V interfaces as well as high k oxide quality by using chemical cleaning methods including chemical solutions, precursors and high temperature gas treatments. The electrical properties of high k/InSb, InGaAs, InSb structures and their dependence on the thermal processes are also discussed. Finally, we will present the downscaling of the gate oxide into sub-nanometer scale while maintaining low leakage current and a good high k/III-V interface quality.

Barium Zirconate Nickelate as the Gate Dielectric for Low-Leakage Current Organic Transistors

2018 ◽  
Vol 65 (2) ◽  
pp. 680-686 ◽  
Author(s):  
Cheng-Jung Lee ◽  
Ke-Jing Lee ◽  
Yu-Chi Chang ◽  
Li-Wen Wang ◽  
Der-Wei Chou ◽  
...  
Keyword(s):  
Leakage Current ◽  
Gate Dielectric ◽  
Organic Transistors ◽  
Barium Zirconate ◽  
Low Leakage ◽  
Low Leakage Current

High k PVP titanium dioxide composite dielectric with low leakage current for thin film transistor

2021 ◽  
pp. 106413
Author(s):  
Yuexin Yang ◽  
Zhuohui Xu ◽  
Tian Qiu ◽  
Honglong Ning ◽  
Jinyao Zhong ◽  
...  
Keyword(s):  
Thin Film ◽  
Titanium Dioxide ◽  
Leakage Current ◽  
Thin Film Transistor ◽  
Low Leakage ◽  
Low Leakage Current ◽  
High K

Large-size (1.7 × 1.7 mm2) β-Ga2O3 field-plated trench MOS-type Schottky barrier diodes with 1.2 kV breakdown voltage and 109 high on/off current ratio

2021 ◽  
Vol 15 (1) ◽  
pp. 016501
Author(s):  
Fumio Otsuka ◽  
Hironobu Miyamoto ◽  
Akio Takatsuka ◽  
Shinji Kunori ◽  
Kohei Sasaki ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Leakage Current ◽  
Schottky Barrier Diodes ◽  
Wafer Level ◽  
Current Ratio ◽  
Field Plate ◽  
Low Leakage ◽  
Large Size ◽  
Forward Current ◽  
Low Leakage Current

Abstract We fabricated high forward and low leakage current trench MOS-type Schottky barrier diodes (MOSSBDs) in combination with a field plate on a 12 μm thick epitaxial layer grown by halide vapor phase epitaxy on β-Ga2O3 (001) substrate. The MOSSBDs, measuring 1.7 × 1.7 mm2, exhibited a forward current of 2 A (70 A cm−2) at 2 V forward voltage and a leakage current of 5.7 × 10–10 A at −1.2 kV reverse voltage (on/off current ratio of > 109) with an ideality factor of 1.05 and wafer-level specific on-resistance of 17.1 mΩ · cm2.

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