A simple chemical etching technique for reproducible fabrication of robust scanning near-field fiber probes

1998 ◽  
Vol 69 (2) ◽  
pp. 437-439 ◽  
Author(s):  
Yung-Hui Chuang ◽  
Kuo-Gung Sun ◽  
Chia-Jen Wang ◽  
J. Y. Huang ◽  
Ci-Ling Pan
Keyword(s):  
Chemical Etching ◽  
Near Field ◽  
Etching Technique ◽  
Simple Chemical ◽  
Fiber Probes

Controllable end shape modification of ZnO nano-arrays/rods by a simple wet chemical etching technique

2015 ◽  
Vol 48 (36) ◽  
pp. 365303 ◽  
Author(s):  
Jingchang Sun ◽  
Ting Zhao ◽  
Zhangwei Ma ◽  
Ming Li ◽  
Cheng Chang ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Shape Modification ◽  
Etching Technique ◽  
Wet Chemical ◽  
Wet Chemical Etching

Microfabricated Fiber Probe by Combination of Electric Arc Discharge and Chemical Etching Techniques

2012 ◽  
Vol 462 ◽  
pp. 38-41 ◽  
Author(s):  
Wan Maisarah Mukhtar ◽  
P. Susthitha Menon ◽  
Sahbudin Shaari
Keyword(s):  
Optical Fibers ◽  
Chemical Etching ◽  
Arc Discharge ◽  
Etching Rate ◽  
Electric Arc ◽  
Buffer Solution ◽  
Fiber Probe ◽  
Optical Fiber Probes ◽  
Electric Arc Discharge ◽  
Fiber Probes

In this study, optical fiber probes were fabricated by combination of electric arc discharge and chemical etching techniques. Size of tips diameters fabricated using different etching solutions were observed. When the optical fibers were pulled and heated by the electric arc discharge using a fusion splicer, fiber tips with few microns in diameter were obtained. To minimize the tips diameter, the pulled fiber probes were etched vertically for 10 minutes using two different etching solutions namely 49% HF and HF buffer solution (49% HF and 40% NH4F) with ratio of 2:1. A thick overlayer was added on top of the HF solution to prevent dangerous vapors escape to the environment. When the tapered part of the pulled fiber (FP1) was dipped into 49% HF solution, the diameter of tip was slightly decreased from 4.41μm to 1.31μm with etching rate of 5.17x10-3 μms-1. When the pulled fiber (FP2) was etched into HF buffer solution, the etching rate was increased up to 52.35% with the etching rate of 10.85x10-3μms-1. The tip diameter was reduced from 7.01μm to 468.9 nm in diameter. Combination of “heat and pull” technique with chemical etching by using HF buffer solution produced fiber probe with small tip diameter.

scholarly journals The Art of Tungsten Etching in Semiconductor Chips

1999 ◽  
Vol 7 (2) ◽  
pp. 24-25
Author(s):  
Lisa Litz-Montanaro
Keyword(s):  
Manufacturing Process ◽  
Chemical Etching ◽  
Layer By Layer ◽  
Ion Milling ◽  
Etching Technique ◽  
Semiconductor Structures ◽  
Wet Chemical ◽  
Wet Chemical Etching ◽  
Semiconductor Chips ◽  
Complex Semiconductor

In the course of both physical and failure analysis of semiconductor chips (i.e., verifying what you actually deposited as a layer, vs, what caused the circuit to fail), it is essential to have appropriate deprocessing tools at your disposal in order to evaluate complex semiconductor structures, Deprocessing techniques are developed for each product manufactured and involve multi-step procedures that reveal the layer-by-layer secrets of the chip, These techniques require constant tweaking in duration and procedure as the manufacturing process imposes changes and as the architecture of the semiconductor changes. While there are many tools that assist in these analytical pursuits, such as RIE (reactive ion etching - a dry etching technique), ion milling, and microcleaving, the wet chemical etching of tungsten is sometimes more reproducible than RIE techniques.

Luminescent small-diameter 3C-SiC nanocrystals fabricated via a simple chemical etching method

2007 ◽  
Vol 18 (36) ◽  
pp. 365603 ◽  
Author(s):  
J Zhu ◽  
Z Liu ◽  
X L Wu ◽  
L L Xu ◽  
W C Zhang ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Small Diameter ◽  
Etching Method ◽  
Simple Chemical

scholarly journals Restoration of Obliterated Stamped Marks on Aluminium Surfaces by Metallographic Etching Technique

2020 ◽  
Vol 36 (6) ◽  
pp. 1212-1217
Author(s):  
Amit Kumar ◽  
Ankit Srivastava ◽  
Tanurup Das ◽  
Abhimanyu Harshey ◽  
Veer Raj Saini ◽  
...  
Keyword(s):  
Forensic Science ◽  
Ferric Chloride ◽  
Present Experiment ◽  
Chemical Etching ◽  
Simple Technique ◽  
Distilled Water ◽  
Metallic Surfaces ◽  
Etching Technique ◽  
Restoration Process ◽  
Science Laboratories

Serial number restoration is a frequently encountered problem in forensic science laboratories for the investigation of theft and burglary cases. These identification marks are generally introduced over metallic surfaces of different vehicle parts and firearms by various means. Chemical etching is one of the most effective and simple technique to restore obliterated, erased, over-stamped and over-engraved marks on metallic surfaces. Several significant studies on restoration of engraved markings on aluminium surfaces were previously reported. The present study attempts to find out an efficient and fast etching reagent to restore obliterated stamped marks on aluminium surfaces. Ten effective etching reagents previously reported by various researchers in their restoration studies were assessed in the present experiment. Etching reagents were individually applied on obliterated surfaces by the cotton swabbing method. The Reagent 3 (ferric chloride 25 g, conc. HCl 25 mL, distilled water 100 mL) was found out to be the most sensitive and rapid (4–6 min) for the restoration on aluminium surfaces. The study also revealed that the absence of an alkaline compound in etching reagent potentially accelerates the speed of the restoration process.

Fabrication of Superhydrophobic Surfaces on Aluminum Alloy by Simple Chemical Etching Method

2011 ◽  
Vol 239-242 ◽  
pp. 2270-2273 ◽  
Author(s):  
Yong Feng Luo ◽  
Hai Yan Lang ◽  
Jin Liang ◽  
Guo Sheng Peng ◽  
You Hua Fan ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Chemical Etching ◽  
Optical Methods ◽  
Hydrophobic Surfaces ◽  
Sliding Angle ◽  
Water Contact ◽  
Binary Structure ◽  
Etching Method ◽  
Simple Chemical ◽  
Scanning Electron

A facial chemical etching method was developed for fabricating stable super-hydrophobic surfaces on aluminum alloy foils. The microstructure and wettability of super-hydrophobic surfaces were characterized by scanning electron microscopy, water contact angle (CA) measurement, and optical methods. The surfaces of the modified aluminum alloy substrates exhibit superhydrophobicity, with a CA of 164.8°±1.6° and a water sliding angle of about 5°. The etched surfaces have binary structure consisting of the irregular microscale plateaus and caves in which there are the nanoscale block-like convexes and hollows.

scholarly journals Surface improvement of organic photoresists using a near-field-dependent etching method

2017 ◽  
Vol 8 ◽  
pp. 784-788 ◽  
Author(s):  
Felix J Brandenburg ◽  
Tomohiro Okamoto ◽  
Hiroshi Saito ◽  
Benjamin Leuschel ◽  
Olivier Soppera ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Absorption Edge ◽  
Near Field ◽  
Light Sources ◽  
Etching Technique ◽  
Cross Sectional ◽  
Surface Flattening ◽  
Carrier Scattering ◽  
Atomically Flat ◽  
Scattering Losses

Surface flattening techniques are extremely important for the development of future electrical and/or optical devices because carrier-scattering losses due to surface roughness severely limit the performance of nanoscale devices. To address the problem, we have developed a near-field etching technique that provides selective etching of surface protrusions, resulting in an atomically flat surface. To achieve finer control, we examine the importance of the wavelength of the near-field etching laser. Using light sources at wavelengths of 325 and 405 nm, which are beyond the absorption edge of the photoresist (310 nm), we compare the resulting cross-sectional etching volumes. The volumes were larger when 325 nm light was employed, i.e., closer to the absorption edge. Although 405 nm light did not cause structural change in the photoresist, a higher reduction of the surface roughness was observed as compared to the 325 nm light. These results indicate that even wavelengths above 325 nm can cause surface roughness improvements without notably changing the structure of the photoresist.

Observation of tip-to-sample heat transfer in near-field optical microscopy using metal-coated fiber probes

2005 ◽  
Vol 86 (20) ◽  
pp. 203109 ◽  
Author(s):  
P. G. Gucciardi ◽  
S. Patanè ◽  
A. Ambrosio ◽  
M. Allegrini ◽  
A. D. Downes ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Optical Microscopy ◽  
Near Field ◽  
Sample Heat ◽  
Coated Fiber ◽  
Fiber Probes

Effect of Dynamic Chemical Etching on the Pore Structure, Permeability, and Mechanical Properties of Ti-Nb-Zr Scaffolds for Medical Applications

2020 ◽  
Vol 143 (5) ◽  
Author(s):  
V. Sheremetyev ◽  
S. Dubinskiy ◽  
M. A. Iqbal ◽  
K. Lukashevich ◽  
S. Prokoshkin ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Porous Structure ◽  
Chemical Etching ◽  
Etching Technique ◽  
Essential Step ◽  
Compressive Stresses ◽  
Structure Geometry ◽  
Structure Lead ◽  
New Generation ◽  
Potential Use

Abstract Improving the post-processing of metallic porous tissue scaffolds is an essential step to create a new generation of superelastic implants for the replacement of damaged bone tissue. In this study, the dynamic chemical etching technique is applied to improve the permeability and to optimize the porous structure of Ti-Nb-Zr scaffolds fabricated by the powder metallurgy-based space holder technique. The etched scaffolds are characterized in terms of their porous structure geometry, permeability, and mechanical properties. It is shown that an increase in porosity from 49% to 54% during the etching is mainly due to an increase in the number of 100 to 800 μm-diameter pores, from 30% to 50% of them measuring from 100 to 300 μm in size. These changes in the porous structure lead to a significant increase of its permeability, i.e., from (0.1–15) × 10−11 m2 before etching to (44–91) × 10−11 m2, after etching; these permeability ranges corresponding to those of bone tissues. Furthermore, the etched scaffolds show systematically higher yield compressive stresses as compared to the as-sintered scaffolds of equivalent porosities. Finally, the highly permeable etched Ti-Nb-Zr scaffolds with a porosity varying from 40% to 60% exhibit an apparent Young’s modulus ranging from 8.6 to 1.9 GPa and an ultimate compressive strength from 650 to 190 MPa, which can be considered as a promising balance of properties for the potential use of these scaffolds as bone implants.

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