Low temperature annealing of ion‐implantation‐induced defects in GaAs by minority carrier injection

1993 ◽  
Vol 63 (18) ◽  
pp. 2525-2527 ◽  
Author(s):  
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H. Nakanishi ◽  
K. Yamada
2004 ◽  
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Author(s):  
Antonio Castaldini ◽  
Anna Cavallini ◽  
Lorenzo Rigutti ◽  
Filippo Nava

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1968 ◽  
Vol 6 (12) ◽  
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A.W. Haberl ◽  
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Hae-seok Lee ◽  
Masafumi Yamaguchi ◽  
Nicholas J. Ekins-daukes ◽  
Aurangzeb Khan ◽  
Tatsuya Takamoto ◽  
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1997 ◽  
Vol 71 (2) ◽  
pp. 255-257 ◽  
Author(s):  
T. Nomachi ◽  
S. Muto ◽  
M. Hirata ◽  
H. Kohno ◽  
Jun Yamasaki ◽  
...  

MRS Advances ◽  
2016 ◽  
Vol 1 (48) ◽  
pp. 3295-3300 ◽  
Author(s):  
Jin-Kwon Park ◽  
Jae-Hoon Han ◽  
Mitsuru Takenaka ◽  
Shinichi Takagi

ABSTRACTIn this study, we successfully demonstrate a carrier-injection InGaAsP variable optical attenuator (VOA) with a lateral P-I-N junction formed by Ni-InGaAsP alloy and Zn diffusion on a III-V on insulator (III-V-OI) wafer. The Ni-InGaAsP alloy for the n+ junction is formed by direct reaction between Ni and InGaAsP after annealing at 350°C. The p+ junction is formed by the Zn diffusion at 500°C using Zn doped spin-on glass (SOG). By both techniques, we successfully reduce the sheet and contact resistivity in the lateral P-I-N junction even with the relatively low-temperature process as compared with the P-I-N junction formed by conventional Si and Be ion implantation. By injecting carriers into the InGaAsP waveguide through the lateral P-I-N junction, we achieve the optical attenuation of -40 dB/mm with an injection current density of 40 mA/mm at a 1.55 μm wavelength.


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