Electroless Deposition of Cu on Glass and Patterning with Microcontact Printing

Langmuir ◽  
2003 ◽  
Vol 19 (17) ◽  
pp. 6567-6569 ◽  
Author(s):  
Emmanuel Delamarche ◽  
James Vichiconti ◽  
Shawn A. Hall ◽  
Matthias Geissler ◽  
William Graham ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing

Direct Patterning of NiB on Glass Substrates Using Microcontact Printing and Electroless Deposition

Langmuir ◽  
2003 ◽  
Vol 19 (15) ◽  
pp. 6283-6296 ◽  
Author(s):  
Matthias Geissler ◽  
Hannes Kind ◽  
Patrick Schmidt-Winkel ◽  
Bruno Michel ◽  
Emmanuel Delamarche
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing ◽  
Glass Substrates ◽  
Direct Patterning

Microcontact Printing of Palladium Colloids:  Micron-Scale Patterning by Electroless Deposition of Copper

Langmuir ◽  
1996 ◽  
Vol 12 (5) ◽  
pp. 1375-1380 ◽  
Author(s):  
Pirmin C. Hidber ◽  
Wolfgang Helbig ◽  
Enoch Kim ◽  
George M. Whitesides
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing

New Pairs of Inks and Papers for Photolithography, Microcontact Printing, and Scanning Probe Nanolithography

2002 ◽  
Vol 737 ◽  
Author(s):  
Lon A. Porter ◽  
Hee Cheul Choi ◽  
J. M. Schmeltzer ◽  
Alexander E. Ribbe ◽  
Jillian M. Buriak
Keyword(s):  
Photoelectron Spectroscopy ◽  
Precious Metal ◽  
Large Scale ◽  
Electroless Deposition ◽  
Microcontact Printing ◽  
Device Fabrication ◽  
Scanning Probe ◽  
Nanoelectromechanical Systems ◽  
Ambient Conditions ◽  
Metal Thin Films

ABSTRACTCurrently, there is considerable interest in producing patterned metallic structures with reduced dimensions for use in technologies such as ultra large scale integration (ULSI) device fabrication, nanoelectromechanical systems (NEMS), and arrayed nanosensors, without sacrificing throughput or cost effectiveness. Research in our laboratory has focused on the preparation of precious metal thin films on semiconductor substrates via electroless deposition. This method provides for the facile interfacing of metal nanoparticles with a group (IV) and III-IV compound semiconductor surfaces. Morphologically complex films composed of gold, platinum, and palladium nanoparticles have been prepared as a result of the immersion of germanium and gallium arsenide substrates into dilute, aqueous solutions of tetrachloraurate (III), tetrachloroplatinate (II), and tetrachloropalladate (II), respectively. Continuous metallic films form spontaneously under ambient conditions, in the absence of a fluoride source or an externally applied current. This facile electroless deposition methodology provides an alternative to complex and expensive vacuum methods of metallization, yet allows for the preparation of both thin and thick nanostructured films with control over surface morphology and deposition rate. Furthermore, precious metal films prepared in this way exhibit excellent adhesion to the underlying semiconductor substrate. The resultant films were characterized utilizing scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and scanning probe microscopy (SPM). In order to apply this novel metallization method toward the development of useful technologies, patterning utilizing photolithography, microcontact printing (μCP), and scanning probe nanolithography (SPN) has been demonstrated.

Patterned Electroless Deposition of Copper by Microcontact Printing Palladium(II) Complexes on Titanium-Covered Surfaces

Langmuir ◽  
2000 ◽  
Vol 16 (16) ◽  
pp. 6367-6373 ◽  
Author(s):  
Hannes Kind ◽  
Matthias Geissler ◽  
Heinz Schmid ◽  
Bruno Michel ◽  
Klaus Kern ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing

Hybrid TiO2/metal nanoparticle microstructures made by microcontact printing, absorption and electroless deposition

2017 ◽  
Vol 5 (24) ◽  
pp. 5882-5886 ◽  
Author(s):  
Sebastian Lamping ◽  
Bart Jan Ravoo
Keyword(s):  
Electroless Deposition ◽  
Microcontact Printing ◽  
Metal Nanoparticle ◽  
Top Down ◽  
Bottom Up

TiO2/metal hybrid microstructures are obtained by a combination of “top-down” (printing) and “bottom-up” (absorption) assembly.

Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing

2014 ◽  
Vol 1038 ◽  
pp. 57-60 ◽  
Author(s):  
K. Cheval ◽  
J. Coulm ◽  
S. Gout ◽  
Y. Layouni ◽  
P. Lombard ◽  
...  
Keyword(s):  
Radio Frequency ◽  
Plasma Treatment ◽  
Protected Areas ◽  
Electroless Deposition ◽  
Microcontact Printing ◽  
Wet Etching ◽  
Rf Plasma ◽  
Direct Process ◽  
Key Points ◽  
3D Networks

The aim of this paper is to report on the use of Microcontact Printing (μCP) for the manufacturing of 3D Molded Interconnects Devices. Two different approaches are reported. A first one is based on the total metallization of the polymer, μCP of the 3D pattern followed by the wet etching of the non-protected areas of the part (the so-called indirect process). A second approach is based on the combination of radio-frequency (RF) plasma treatment, μCP of a pattern of catalysts on the polymer and metallization by electroless deposition (the so-called direct process). This second process allows metallization of bare polymer parts (free of catalytic species in the bulk) with conductive 3D networks ready for the assembly of SMD devices. Examples of MID devices made with both approaches are reported. Key points like thickness (up to 12-15 μm), conductivity and adhesion of the metallic network are also reviewed. Printing on slope surfaces is demonstrated. Advantages and drawbacks of both processes are discussed.

Sign in / Sign up

Export Citation Format

Share Document