On the Low-Temperature Oxidation and Ultrathin Oxide Growth on Zirconium in the Presence of Atomic Oxygen: A Modeling Study

2008 ◽  
Vol 112 (46) ◽  
pp. 17877-17882 ◽  
Author(s):  
Subramanian K. R. S. Sankaranarayanan ◽  
Shriram Ramanathan
2018 ◽  
Vol 32 (8) ◽  
pp. 8781-8788 ◽  
Author(s):  
Bing-Yin Wang ◽  
Yue-Xi Liu ◽  
Jun-Jie Weng ◽  
Zhen-Yu Tian

2008 ◽  
Vol 22 (4) ◽  
pp. 2258-2269 ◽  
Author(s):  
Joffrey Biet ◽  
Mohammed Hichem Hakka ◽  
Valérie Warth ◽  
Pierre-Alexandre Glaude ◽  
Frédérique Battin-Leclerc

2018 ◽  
Vol 192 ◽  
pp. 507-516 ◽  
Author(s):  
Bing-Yin Wang ◽  
Dan Yu ◽  
Guan-Fu Pan ◽  
Yue-Xi Liu ◽  
Jun-Jie Weng ◽  
...  

1996 ◽  
Vol 448 ◽  
Author(s):  
Tomoyuki Sakoda ◽  
Mieko Matsumura ◽  
Yasushiro Nishioka

AbstractThe low temperature oxidation is effective for the atomically-controlled gate oxide growth. We focused the effects of post-oxidation annealing (POA) and attempted to improve the properties of the low-temperature-grown ultrathin oxides with a thickness of 3nm by POA. POA abruptly reduced the leakage current at a low gate voltage below 1.5V and the interface trap density. The correlation between the interface trap and the leakage current at a low applied voltage region were confirmed. We found that the stressing immunity of the ultrathin oxides grown at a low temperature, 650°C, is drastically improved by POA at 850°C.


1999 ◽  
Vol 592 ◽  
Author(s):  
T. Ueno ◽  
S. Chikamura ◽  
F. Sakuraba ◽  
Y Iwasaki

ABSTRACTLow temperature oxidation process of Si(100) substrates using atomic oxygen has been proposed. For the generation of atomic oxygen, microwave plasma remotely attached on the oxidation chamber was used. In the microwave plasma, the large amount of rare gas and a small amount of 02 gas mixture was supplied. The existence of the large amount of rare gas controls the plasma energy to some restricted values associated with the metastable states of the rare gas. Consequently, using Kr as mixed rare gas, atomic oxygen were efficiently generated instead of excited 02 molecules with any vibrational or ionized states. The oxidation kinetics of crystalline Si using this process was shown to be diffusion limiting, even if the oxide thickness was less than several nm. The activation energy of B, which is referred to as the parabolic rate constant, was found to be as low as 0.14eV In addition, lower interface trap density of 2.6 × 1011/cm2/eV at the mid gap could be achieved for the as-grown SiO2/Si(100) interface at the processing temperature of 500C.


2011 ◽  
Vol 33 (1) ◽  
pp. 391-398 ◽  
Author(s):  
Olivier Herbinet ◽  
Joffrey Biet ◽  
Mohammed Hichem Hakka ◽  
Valérie Warth ◽  
Pierre-Alexandre Glaude ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document