High-Quality Nitrogen-Doped Fluorinated Silicon Oxide Films Prepared by Temperature-Difference-Based Liquid-Phase Deposition

2003 ◽  
Vol 107 (46) ◽  
pp. 12700-12704 ◽  
Author(s):  
M. K. Lee ◽  
W. H. Shieh ◽  
C. M. Shih ◽  
K. W. Tung
1998 ◽  
Vol 511 ◽  
Author(s):  
Ching-Fa Yeh ◽  
Yueh-Chuan Lee ◽  
Su-Chen Lee

ABSTRACTTo meet the requirements of low-K and low-stress intermetal dielectric (IMD) for future ULSI devices, a novel temperature-difference liquid-phase deposition (TD-LPD) method is proposed. The deposition solution of supersaturated silicic acid with high concentration of fluorine can be achieved by raising deposition temperature larger than 15 °C from dissolution temperature (0 °C). Because fluorine atoms can easily be incorporated with the technique, TDLPD fluorine-doped SiO2 (FSG) exhibits low-K (∼3.4) and low-stress (∼40MPa) property. In this paper, to study the interaction between TD-LPD FSG and moisture, the FSG is annealed and moisture stressed repeatedly as in a real process. Since K is sensitive to moisture absorption, and the stress is sensitive to the dehydration reaction between Si-OH's, the both are monitored as indices. A feasible mechanism is proposed to explain the variation in K/stress during annealing and boiling cycles.


2001 ◽  
Vol 392 (1) ◽  
pp. 107-112
Author(s):  
Tetsuya Homma ◽  
Hiroyasu Kondo ◽  
Kazuaki Inohara ◽  
Masahiro Nomoto ◽  
Masaya Sakamoto ◽  
...  

2008 ◽  
Vol 112 (35) ◽  
pp. 13535-13539 ◽  
Author(s):  
Shigehito Deki ◽  
Akiyoshi Nakata ◽  
Yasuyuki Sakakibara ◽  
Minoru Mizuhata

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