scholarly journals Transfer Printing of Semiconductor Nanowires with Lasing Emission for Controllable Nanophotonic Device Fabrication

ACS Nano ◽  
2016 ◽  
Vol 10 (4) ◽  
pp. 3951-3958 ◽  
Author(s):  
Benoit Guilhabert ◽  
Antonio Hurtado ◽  
Dimitars Jevtics ◽  
Qian Gao ◽  
Hark Hoe Tan ◽  
...  
Keyword(s):  
Semiconductor Nanowires ◽  
Device Fabrication ◽  
Transfer Printing ◽  
Nanophotonic Device

Transfer printing of semiconductor nanowires

2016 ◽  
Author(s):  
D. Jevtics ◽  
B. Guilhabert ◽  
A. Hurtado ◽  
Q. Gao ◽  
H. H. Tan ◽  
...  
Keyword(s):  
Semiconductor Nanowires ◽  
Transfer Printing

scholarly journals Pattern Transfer Printing by Controlling the Deposition Angle to Form Various Patterns

2020 ◽  
Vol 58 (2) ◽  
pp. 145-150
Author(s):  
Tae Wan Park ◽  
Woon Ik Park
Keyword(s):  
Electronic Device ◽  
Functional Materials ◽  
Practical Method ◽  
Optical Microscope ◽  
Device Fabrication ◽  
Transfer Printing ◽  
Si Substrates ◽  
Functional Patterns ◽  
Device Applications ◽  
Pattern Resolution

The nanofabrication of modern electronic devices requires advanced nanopatterning technologies. To fabricate desirable nanodevices with excellent device performance, controlling the shape and dimension of the pattern is very important. However, to achieve more facile and faster device fabrication, with better pattern resolution, pattern-tunability, process simplicity, and cost-effectiveness, some remaining challenges still need to be resolved. In this study, we introduce a simple and practical method to generate various patterns using a nanotransfer printing (nTP) process. To obtain functional materials with diverse shapes on a polymer replica pattern, in the nTP process we controlled the angle of deposition before transfer-printing. First, we obtained three different pattern shapes with a thickness of ~ 30 nm on polymethyl methacrylate (PMMA) replica patterns. Then, the deposited functional patterns on the PMMA patterns are successfully transfer-printed onto SiO<sub>2</sub>/Si substrates, showing line, L-shape line, and concavo-convex patterns. We observed the pattern shapes of the patterns by scanning electron microscope (SEM) and optical microscope. Moreover, we systemically analyzed how to form patterns of various shapes using one kind of master mold. We expect that this simple approach will be widely used to fabricate various useful patterns for electronic device applications.

Nanowires formed in anodic oxide nanotemplates

1994 ◽  
Vol 9 (4) ◽  
pp. 1014-1018 ◽  
Author(s):  
D. Al-Mawlawi ◽  
C. Z. Liu ◽  
Martin Moskovits
Keyword(s):  
Aluminum Oxide ◽  
Electrochemical Method ◽  
Anodic Oxide ◽  
Semiconductor Nanowires ◽  
Device Fabrication ◽  
Electrochemical Generation ◽  
Step Process ◽  
Oxide Matrix ◽  
Continuous Range

A simple electrochemical method is described for producing metal or semiconductor nanowires with diameters in the continuous range 10 to 200 nm. The technique involves a three-step process that begins with the electrochemical generation of an aluminum oxide template with uniform nanometer-sized pores, followed by the deposition of metal or semiconductor in them. The nanowires are then exposed for study or device fabrication by etching back the oxide matrix. Examples of cadmium nanowires fabricated by this technique are shown.

scholarly journals 3D Nanophotonic device fabrication using discrete components

Nanophotonics ◽  
2020 ◽  
Vol 9 (6) ◽  
pp. 1373-1390
Author(s):  
Jeffrey E. Melzer ◽  
Euan McLeod
Keyword(s):  
Hybrid Methods ◽  
Three Dimensional ◽  
Directed Assembly ◽  
Building Blocks ◽  
Single Step ◽  
Device Fabrication ◽  
Dimensional Structure ◽  
Nanophotonic Devices ◽  
Nanophotonic Device ◽  
Nanophotonic Structures

AbstractThree-dimensional structure fabrication using discrete building blocks provides a versatile pathway for the creation of complex nanophotonic devices. The processing of individual components can generally support high-resolution, multiple-material, and variegated structures that are not achievable in a single step using top-down or hybrid methods. In addition, these methods are additive in nature, using minimal reagent quantities and producing little to no material waste. In this article, we review the most promising technologies that build structures using the placement of discrete components, focusing on laser-induced transfer, light-directed assembly, and inkjet printing. We discuss the underlying principles and most recent advances for each technique, as well as existing and future applications. These methods serve as adaptable platforms for the next generation of functional three-dimensional nanophotonic structures.

Integration of ink jet and transfer printing for device fabrication using nanostructured materials

Carbon ◽  
2009 ◽  
Vol 47 (1) ◽  
pp. 321-324 ◽  
Author(s):  
B. Kumar ◽  
H.S. Tan ◽  
N. Ramalingam ◽  
S.G. Mhaisalkar
Keyword(s):  
Nanostructured Materials ◽  
Device Fabrication ◽  
Transfer Printing ◽  
Ink Jet

Electrical Contacts to Vertically Oriented Silicon Nano and Microdevices for Applications in Flexible Systems

2013 ◽  
Vol 1553 ◽  
Author(s):  
Mark Triplett ◽  
Hideki Nishimura ◽  
Matthew Ombaba ◽  
M. Saif Islam
Keyword(s):  
Large Scale ◽  
Electrical Contacts ◽  
Device Fabrication ◽  
Flexible Systems ◽  
Transfer Printing ◽  
Flexible Devices ◽  
Vertical Arrays ◽  
Contact Isolation ◽  
Crystalline Semiconductor ◽  
Printing Technique

ABSTRACTFlexible devices utilizing crystalline semiconductor nano or microstructures materials are attractive for many applications. However, these materials are fabricated or grown in unusable forms for flexible systems due to their rigid crystalline mother substrates. We demonstrate a transfer printing technique for transferring vertical arrays of one-dimensional (1D) materials from mother substrates to flexible substrates with subsequent device fabrication steps to create flexible devices from these arrays. The transfer printing technique is based on vertical embossing of arrays of 1D materials into thermoplastic (Poly (methyl methacrylate) (PMMA)) transfer layers, while the device fabrication steps rely on encapsulation with insulating polymers and contact deposition. We investigated the use of flexible insulating layers like polydimethylsiloxane (PDMS) and polyurethane (PU) which are shown to be effective for encapsulation and contact isolation. Representative flexible resistive devices were created from these transferred arrays and insulating layers which showed a reversible tactile characteristic. Electronic characterization and flexibility testing was carried out to show the potential of these methods for enabling large-scale integrations of nano and microstructures into vertical and flexible packages.

High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication

Nano Research ◽  
2014 ◽  
Vol 7 (7) ◽  
pp. 998-1006 ◽  
Author(s):  
Mark Triplett ◽  
Hideki Nishimura ◽  
Matthew Ombaba ◽  
V. J. Logeeswarren ◽  
Matthew Yee ◽  
...  
Keyword(s):  
High Precision ◽  
Device Fabrication ◽  
Transfer Printing ◽  
Flexible Device ◽  
Semiconductor Arrays
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