Learning the Hydrophobic, Hydrophilic, and Aromatic Character of Amino Acids from Thermal Relaxation and Interfacial Thermal Conductance

2022 ◽  
Author(s):  
Heydar Hamzi ◽  
Ali Rajabpour ◽  
Édgar Roldán ◽  
Ali Hassanali
Keyword(s):  
Amino Acids ◽  
Thermal Conductance ◽  
Thermal Relaxation ◽  
Aromatic Character ◽  
Interfacial Thermal Conductance

Interfacial thermal conductance in multilayer graphene/phosphorene heterostructure

2016 ◽  
Vol 49 (46) ◽  
pp. 465301 ◽  
Author(s):  
Ying-Yan Zhang ◽  
Qing-Xiang Pei ◽  
Yiu-Wing Mai ◽  
Siu-Kai Lai
Keyword(s):  
Thermal Conductance ◽  
Multilayer Graphene ◽  
Interfacial Thermal Conductance

Tuning the interfacial thermal conductance via the anisotropic elastic properties of graphite

Carbon ◽  
2019 ◽  
Vol 144 ◽  
pp. 109-115 ◽  
Author(s):  
Zhiyong Wei ◽  
Fan Yang ◽  
Kedong Bi ◽  
Juekuan Yang ◽  
Yunfei Chen
Keyword(s):  
Elastic Properties ◽  
Thermal Conductance ◽  
Interfacial Thermal Conductance ◽  
Anisotropic Elastic

Molecular Dynamics Study of the Interfacial Thermal Conductance at the Graphene/Paraffin Interface in Solid and Liquid Phases

2013 ◽  
Author(s):  
Hasan Babaei ◽  
Pawel Keblinski ◽  
J. M. Khodadadi
Keyword(s):  
Molecular Dynamics ◽  
Solid Phase ◽  
Thermal Conductance ◽  
Md Simulations ◽  
Interfacial Thermal Conductance ◽  
A Value ◽  
Number Of Layers ◽  
Liquid Phases ◽  
Phase Systems ◽  
Parallel Configuration

By utilizing molecular dynamics (MD) simulations, we study the interfacial thermal conductance at the interface of graphene and paraffin. In doing so, we conduct non-equilibrium heat source and sink simulations on systems of parallel and perpendicular configurations in which the heat flow is parallel and perpendicular to the surface of graphene, respectively. For the perpendicular configuration, graphene with different number of layers are considered. The results show that the interfacial thermal conductance decreases with the number of layers and converges to a value which is equal to the obtained conductance by using the parallel configuration. We also study the conductance for the solid phase paraffin. The results indicate that solid paraffin-graphene interfaces have higher conductance values with respect to the corresponding liquid phase systems.

scholarly journals Thermal conductance between water and nm-thick WS2: extremely localized probing using nanosecond energy transport state-resolved Raman

2020 ◽  
Vol 2 (12) ◽  
pp. 5821-5832
Author(s):  
Hamidreza Zobeiri ◽  
Nicholas Hunter ◽  
Ridong Wang ◽  
Xinman Liu ◽  
Hong Tan ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Energy Transport ◽  
Thermal Conductance ◽  
Interface Resistance ◽  
Effect Of Water ◽  
Interfacial Thermal Conductance

Interfacial thermal conductance between a nm-thick suspended WS2 film and water is measured using a novel nET-Raman technique. By significantly reducing the effect of water thermal resistance, the interface resistance effect become more preeminent.

Experimental Investigation of Interfacial Thermal Conductance for Molten Metal Solidification on a Substrate

1996 ◽  
Vol 118 (1) ◽  
pp. 157-163 ◽  
Author(s):  
G.-X. Wang ◽  
E. F. Matthys
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Thermal Conductance ◽  
Measured Temperature ◽  
Solid Contact ◽  
Metal Solidification ◽  
Model Calculations ◽  
Interfacial Thermal Conductance ◽  
Cooling Phase

Experiments have been conducted to quantify the interfacial thermal conductance between molten copper and a cold metallic substrate, and in particular to investigate the heat transfer variation as the initial liquid/solid contact becomes a solid/solid contact after nucleation. A high heat transfer coefficient during the earlier liquid cooling phase and a lower heat transfer coefficient during the subsequent solid splat cooling phase were estimated through matching of model calculations and measured temperature history of the sample. The dynamic variations in the interfacial heat transfer resulting from the solidification process were quantified for splat cooling and were found to be affected by the melt superheat, the substrate material, and the substrate surface finish.

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