scholarly journals Thermal conductance between water and nm-thick WS2: extremely localized probing using nanosecond energy transport state-resolved Raman

2020 ◽  
Vol 2 (12) ◽  
pp. 5821-5832
Author(s):  
Hamidreza Zobeiri ◽  
Nicholas Hunter ◽  
Ridong Wang ◽  
Xinman Liu ◽  
Hong Tan ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Energy Transport ◽  
Thermal Conductance ◽  
Interface Resistance ◽  
Effect Of Water ◽  
Interfacial Thermal Conductance

Interfacial thermal conductance between a nm-thick suspended WS2 film and water is measured using a novel nET-Raman technique. By significantly reducing the effect of water thermal resistance, the interface resistance effect become more preeminent.

Interfacial thermal conductance in multilayer graphene/phosphorene heterostructure

2016 ◽  
Vol 49 (46) ◽  
pp. 465301 ◽  
Author(s):  
Ying-Yan Zhang ◽  
Qing-Xiang Pei ◽  
Yiu-Wing Mai ◽  
Siu-Kai Lai
Keyword(s):  
Thermal Conductance ◽  
Multilayer Graphene ◽  
Interfacial Thermal Conductance

Characterization of a Liquid-Metal Micro Droplets Thermal Interface Material

2010 ◽  
Author(s):  
Amer M. Hamdan ◽  
Aric R. McLanahan ◽  
Robert F. Richards ◽  
Cecilia D. Richards
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Applied Load ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance ◽  
Droplet Array

This work presents the characterization of a thermal interface material consisting of an array of mercury micro droplets deposited on a silicon die. Three arrays were tested, a 40 × 40 array (1600 grid) and two 20 × 20 arrays (400 grid). All arrays were assembled on a 4 × 4 mm2 silicon die. An experimental facility which measures the thermal resistance across the mercury array under steady state conditions is described. The thermal interface resistance of the arrays was characterized as a function of the applied load. A thermal interface resistance as low as 0.253 mm2 K W−1 was measured. A model to predict the thermal resistance of a liquid-metal micro droplet array was developed and compared to the experimental results. The model predicts the deformation of the droplet array under an applied load and then the geometry of the deformed droplets is used to predict the thermal resistance of the array. The contact resistance of the mercury arrays was estimated based on the experimental and model data. An average contact resistance was estimated to be 0.14 mm2 K W−1.

Manufacture and Evaluation of Light Emitting Diode Package Substrate Using Flexible Printed Circuit Board

2015 ◽  
Vol 15 (10) ◽  
pp. 7578-7581
Author(s):  
Jung-Kab Park ◽  
Jin-Ha Shin ◽  
Mun-Gi Jung ◽  
Tomabechi Shigehisa ◽  
Hwa-Sun Park ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Light Emitting Diode ◽  
Thermal Conductance ◽  
Polyimide Film ◽  
Luminous Efficiency ◽  
Circuit Board ◽  
Light Sources ◽  
Thermal Shock Test ◽  
Light Emitting ◽  
Au Electrode

Unlike other light sources such as fluorescent lamps and incandescent bulbs, light-emitting diodes (LED) convert 70∼80% of energy into heat. If the heat produced an LED chip is not effectively released, its luminous efficiency and lifespan are reduced. Therefore, as a method effectively release heat, an LED PKG substrate containing a heat-releasing material with excellent thermal conductance was fabricated, and its thermal resistance and luminous efficiency were analyzed. In this experiment, a thin polyimide film with excellent ductility was used to fabricate the LED PKG substrate. A 35-μm-thick Cu foil with excellent thermal conductance was subjected to high temperature and pressure and attached to both sides of the polyimide film. By electroplating Ag or Au, which has excellent thermal conductance, for us as the electrode and heat-releasing material, LED PKG substrate was fabricated with a thickness of approximately 170 μm. (−40 °C → RT → 120 °C). The results revealed that the LED PKG substrate having a Ag electrode with excellent thermal conductance had an excellent thermal resistance of approximately 4.2 °C/W (Au electrode: 5.6 °C/W). The luminous flux after 100 cycles in the thermal shock test was reduced by approximately 0.09% (Au electrode: 2.77%), indicating that the LED PKG substrate had excellent thermal resistance without any mechanical and material defects in a rapid-temperature-changing environment. The advantages and excellent thermal resistance can be exploited in cellular phones and LCD panels, and heat-releasing problems in thin panels be solved.

Tuning the interfacial thermal conductance via the anisotropic elastic properties of graphite

Carbon ◽  
2019 ◽  
Vol 144 ◽  
pp. 109-115 ◽  
Author(s):  
Zhiyong Wei ◽  
Fan Yang ◽  
Kedong Bi ◽  
Juekuan Yang ◽  
Yunfei Chen
Keyword(s):  
Elastic Properties ◽  
Thermal Conductance ◽  
Interfacial Thermal Conductance ◽  
Anisotropic Elastic

Molecular Dynamics Study of the Interfacial Thermal Conductance at the Graphene/Paraffin Interface in Solid and Liquid Phases

2013 ◽  
Author(s):  
Hasan Babaei ◽  
Pawel Keblinski ◽  
J. M. Khodadadi
Keyword(s):  
Molecular Dynamics ◽  
Solid Phase ◽  
Thermal Conductance ◽  
Md Simulations ◽  
Interfacial Thermal Conductance ◽  
A Value ◽  
Number Of Layers ◽  
Liquid Phases ◽  
Phase Systems ◽  
Parallel Configuration

By utilizing molecular dynamics (MD) simulations, we study the interfacial thermal conductance at the interface of graphene and paraffin. In doing so, we conduct non-equilibrium heat source and sink simulations on systems of parallel and perpendicular configurations in which the heat flow is parallel and perpendicular to the surface of graphene, respectively. For the perpendicular configuration, graphene with different number of layers are considered. The results show that the interfacial thermal conductance decreases with the number of layers and converges to a value which is equal to the obtained conductance by using the parallel configuration. We also study the conductance for the solid phase paraffin. The results indicate that solid paraffin-graphene interfaces have higher conductance values with respect to the corresponding liquid phase systems.

Thermal conductivity and interfacial Thermal Resistance Behavior for the Polyaniline (C3N)– boron carbide (BC3) Heterostructure

2021 ◽  
Author(s):  
Arian Mayelifartash ◽  
Mohammad Ali Abdol ◽  
Sadegh Sadeghzadeh
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Thermal Resistance ◽  
Boron Carbide ◽  
Molecular Dynamics Simulations ◽  
Thermal Conductance ◽  
Interfacial Thermal Resistance ◽  
Non Equilibrium Molecular Dynamics ◽  
Dynamics Simulations ◽  
Non Equilibrium

In this paper, by employing non-equilibrium molecular dynamics simulations (NEMD), the thermal conductance of hybrid formed by polyaniline (C3N) and boron carbide (BC3) in both armchair and zigzag configurations has...

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