Scanning Electrochemical Microscopy Investigations of Monolayers Bound to p-Type Silicon Substrates

2006 ◽  
Vol 78 (17) ◽  
pp. 6019-6025 ◽  
Author(s):  
Jalal Ghilane ◽  
Fanny Hauquier ◽  
Bruno Fabre ◽  
Philippe Hapiot
1999 ◽  
Vol 138-139 ◽  
pp. 29-34
Author(s):  
R.S Videira ◽  
R.M Gamboa ◽  
J.Maia Alves ◽  
J.M Serra ◽  
A.M Vallera

2013 ◽  
Vol 34 (6) ◽  
pp. 1845-1847 ◽  
Author(s):  
Seung-Hoon Lee ◽  
Muncheol Shin ◽  
Seongpil Hwang ◽  
Sung Heum Park ◽  
Jae-Won Jang

2006 ◽  
Vol 88 (9) ◽  
pp. 091911 ◽  
Author(s):  
J. W. Shin ◽  
J. Y. Lee ◽  
T. W. Kim ◽  
Y. S. No ◽  
W. J. Cho ◽  
...  

1982 ◽  
Vol 13 ◽  
Author(s):  
A. S. Wakita ◽  
T. W. Sigmon ◽  
J. F. Gibbons

ABSTRACT4He+ Backscattering and SIMS were used to study impurity redistribution during laser formation of refractory silicides. Thin films of Mo and W were evaporated on to <100> p-type silicon substrates, which were As or B implanted to doses of 1 ×1015 to 1 ×1016cm−2 . These samples were laser reacted with multiple or single laser scans at various powers. Analysis of these films indicate impurity movement into the forming silicide layer. Impurity concentrations in the films were observed to be as high as 7.8×1020 cm−3−> for As in WSi2 , however a reduction in this concentration occurred with subsequent thermal annealing.


2012 ◽  
Vol 1426 ◽  
pp. 353-358
Author(s):  
Toshiyuki Sameshima ◽  
Kochi Betsuin ◽  
Shinya Yoshidomi

ABSTRACTChange in the light-induced minority carrier effective lifetime τeff of crystalline silicon caused by rapid laser heating is reported. The top surface of n- and p-type silicon substrates with thicknesses of 520 μm coated with thermally grown SiO2 layers were heated by a 940 nm semiconductor laser for 4 ms. τeff was measured by a method of microwave absorption caused by carriers induced by 620 nm light illumination at 1.5 mW/cm2. τeff for light illumination of the top surfaces was decreased to 1.0x10-5 and 4.8x10-6 s by laser heating at 5.0x104 W/cm2 for n- and ptype 520-μm-thick silicon substrates, respectively. The decrease in τeff resulted from the generation of defect states associated with the carrier recombination velocity at the top surface region, Stop. Laser heating increased Stop to 6000 and 10000 cm/s for n- and p-type silicon samples, respectively. Heat treatment at 400oC for 4h markedly decreased Stop to 21 and 120 cm/s, respectively, for n- and p-type silicon samples heated at 5.0x104 W/cm2. Laser heating at 4.0x104 W/cm2 for 4 ms was also applied to samples treated with Ar plasma irradiation at 50 W for 60 s, which decreased τeff (top) to 2.0x10-5 s and 3.9x10-6 s for n- and p-type silicon samples, respectively. Laser heating successfully increased τeff (top) to 2.8x10-3 and 4.1x10-4 s for n- and p-type samples, respectively. Laser irradiation at 4x104 W/cm2played a role of curing recombination defect sites.


2014 ◽  
Vol 30 (8) ◽  
pp. 835-838 ◽  
Author(s):  
Yanghui Liu ◽  
Liqiang Zhu ◽  
Liqiang Guo ◽  
Hongliang Zhang ◽  
Hui Xiao

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