High aspect ratio micro-hole filling employing emulsified supercritical CO2 electrolytes

2016 ◽  
Vol 109 ◽  
pp. 61-66 ◽  
Author(s):  
Cheng-Yu Li ◽  
Jun-Jie Yang ◽  
Wen-Ta Tsai ◽  
Chang-Jian Lin ◽  
Tso-Fu Mark Chang ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Supercritical Co2 ◽  
Hole Filling ◽  
Micro Hole

Numerical Simulation of High-Aspect-Ratio Micro-Hole Electroforming with External Magnetic Field

2010 ◽  
Vol 42 ◽  
pp. 13-16
Author(s):  
Wei Li ◽  
Ping Mei Ming ◽  
Wu Ji Jiang ◽  
Yin Ding Lv
Keyword(s):  
Magnetic Field ◽  
Numerical Simulation ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Flow State ◽  
Cathode Electrode ◽  
Micro Hole ◽  
Fluent Software ◽  
The Magnetic Field ◽  
Enhance Mass

In this paper, the influences of applied magnetic field on flow state during electroforming of the high-aspect-ratio (HAR) blind micro-hole were numerically analyzed using the Fluent software. The results showed that, when microelectroforming of nickel without external agitation, three vortexes could form due to the magnetohydrodynamic (MHD) effect within the HAR micro-hole with magnetic field in parallel to cathode-electrode surface, and the flow rate in the micro-hole increased with the increase of the magnetic field and current density. The MHD effect helped to enhance mass transfer during the microelectroforming of HAR microstructures.

High Aspect Ratio Hole Filling with CVD Tungsten for Multi-level Interconnection

1986 ◽  
Author(s):  
K. Suguro ◽  
Y. Nakasaki ◽  
S. Shima ◽  
T. Yoshii ◽  
T. Moriya ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Hole Filling ◽  
Multi Level

Measurement of micro-hole with high aspect ratio by double optical fibers coupling

2008 ◽  
Author(s):  
Jiwen Cui ◽  
Jiubin Tan ◽  
Fei Wang ◽  
Chuanxi Song
Keyword(s):  
Aspect Ratio ◽  
Optical Fibers ◽  
High Aspect Ratio ◽  
Micro Hole

Selective Aluminum CVD for Sub-Micron VIA Plug Filling

1992 ◽  
Vol 260 ◽  
Author(s):  
N. Zhu ◽  
S. K. Jo ◽  
M. B. Freiler ◽  
R. Scarmozzino ◽  
R. M. Osgood ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Aspect Ratio ◽  
Physical Vapor Deposition ◽  
Small Diameter ◽  
Chain Structure ◽  
Small Dimension ◽  
Process Window ◽  
Hole Filling ◽  
Custom Made

ABSTRACTWe present a novel technique to metallize high-aspect-ratio, small-dimension contact holes and via plugs for application to integrated circuits and packaging. The technique uses a laser-assisted process to deposit a thin film of aluminum from DMA1H, which forms a seed layer for subsequent selective CVD. The resistivity of the deposited aluminum is nearly that of the bulk metal, the contact resistivity is good (∼0.03 μΩ-cm2), and the morphology of the deposited film is comparable to that obtained with physical vapor deposition. This process has been used to fill via holes in a SiO2 substrate, and small-diameter (0.7 μm), high-aspect-ratio (3:1), aluminum plugs have been repeatedly formed without the incorporation of voids. A custom-made via chain structure was used to determine the via resistance (plug and contact), which was found to be 0.1 -0.3 Ω. Our technique opens a new process window for void-free high-aspect-ratio via and contact hole filling, and is particularly interesting in that it offers the potential to use aluminum or aluminum-copper in plug metallization.

High aspect ratio micro-hole drilling aided with ultrasonic vibration and planetary movement of electrode by micro-EDM

CIRP Annals ◽  
2009 ◽  
Vol 58 (1) ◽  
pp. 213-216 ◽  
Author(s):  
Z.Y. Yu ◽  
Y. Zhang ◽  
J. Li ◽  
J. Luan ◽  
F. Zhao ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Ultrasonic Vibration ◽  
High Aspect Ratio ◽  
Hole Drilling ◽  
Micro Edm ◽  
Micro Hole

Supercritical CO2 Treatments for Semiconductor Applications

2004 ◽  
Vol 812 ◽  
Author(s):  
S. Gangopadhyay ◽  
J.A. Lubguban ◽  
B. Lahlouh ◽  
G. Sivaraman ◽  
K. Biswas ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Supercritical Fluids ◽  
High Aspect Ratio ◽  
Supercritical Co2 ◽  
Semiconductor Industry ◽  
Industrial Processes ◽  
Porous Films ◽  
Analytical Waste ◽  
And Diffusion ◽  
Good Medium

Supercritical fluids (SF) have been used in a wide variety of applications: in industrial processes, analytical, waste detoxification, etc. Recently, its usefulness extends to the semiconductor industry. Researches have shown that supercritical CO2 (SCCO2) can be used to remove photoresists and significantly reduce the amount of waste from solvents in comparison to conventional stripping techniques. SF will also find its usefulness in cleaning high aspect ratio vias and deep trenches as semiconductor features shrink to submicron levels. We will report here the use of supercritical CO2 treatments in extraction of porogens from a nanohybrid film fabricated via templated-porogen approach. Its use as a medium to repair the damage in porous films from plasma ashing will also be presented. The ability to tune the solvation and diffusion power of SCCO2 and to swell the film matrix make it a good medium for silylation to restore hydrophobicity and functionalize the film.

Sign in / Sign up

Export Citation Format

Share Document