The influence of visible light on the gate bias instability of In–Ga–Zn–O thin film transistors

2011 ◽  
Vol 62 (1) ◽  
pp. 77-81 ◽  
Author(s):  
Sangwook Kim ◽  
Sunil Kim ◽  
Changjung Kim ◽  
JaeChul Park ◽  
Ihun Song ◽  
...  
2013 ◽  
Vol 62 (8) ◽  
pp. 1183-1187 ◽  
Author(s):  
Ho Sik Jeon ◽  
Yang Wook Heo ◽  
Byung Seong Bae ◽  
Sang Youn Han ◽  
Junho Song

2015 ◽  
Vol 48 (47) ◽  
pp. 475107 ◽  
Author(s):  
GongTan Li ◽  
Bo-Ru Yang ◽  
Chuan Liu ◽  
Chia-Yu Lee ◽  
Chih-Yuan Tseng ◽  
...  

2010 ◽  
Vol 13 (11) ◽  
pp. H376 ◽  
Author(s):  
Ji Sim Jung ◽  
Kwang-Hee Lee ◽  
Kyoung Seok Son ◽  
Joon Seok Park ◽  
Tae Sang Kim ◽  
...  

2021 ◽  
Author(s):  
Om Kumar Prasad ◽  
Srikant Kumar Mohanty ◽  
ChienHung Wu ◽  
Tsung Ying Yu ◽  
K-M Chang

2006 ◽  
Vol 910 ◽  
Author(s):  
Andew Flewitt ◽  
Shufan Lin ◽  
William I Milne ◽  
Ralf B Wehrspohn ◽  
Martin J Powell

AbstractIt has been widely observed that thin film transistors (TFTs) incorporating an hydrogenated amorphous silicon (a-Si:H) channel exhibit a progressive shift in their threshold voltage with time upon application of a gate bias. This is attributed to the creation of metastable defects in the a-Si:H which can be removed by annealing the device at elevated temperatures with no bias applied to the gate, causing the threshold voltage to return to its original value. In this work, the defect creation and removal process has been investigated using both fully hydrogenated and fully deuterated amorphous silicon (a-Si:D) TFTs. In both cases, material was deposited by rf plasma enhanced chemical vapour deposition over a range of gas pressures to cover the a-g transition. The variation in threshold voltage as a function of gate bias stressing time, and annealing time with no gate bias, was measured. Using the thermalisation energy concept, it has been possible to quantitatively determine the distribution of energies required for defect creation and removal as well as the associated attempt-to-escape frequencies. The defect creation and removal process in a-Si:H is then discussed in the light of these results.


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