Dynamic recrystallization in the particle/particle interfacial region of cold-sprayed nickel coating: Electron backscatter diffraction characterization

2009 ◽  
Vol 61 (9) ◽  
pp. 899-902 ◽  
Author(s):  
Yu Zou ◽  
Wen Qin ◽  
Eric Irissou ◽  
Jean-Gabriel Legoux ◽  
Stephen Yue ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Electron Backscatter Diffraction ◽  
Nickel Coating ◽  
Interfacial Region ◽  
Electron Backscatter ◽  
Backscatter Diffraction

A 3D FIB Investigation of Dynamic Recrystallization in a Cu-Sn Bronze

2012 ◽  
Vol 715-716 ◽  
pp. 498-501 ◽  
Author(s):  
Ali Gholinia ◽  
Ian Brough ◽  
John F. Humphreys ◽  
Pete S. Bate
Keyword(s):  
Dynamic Recrystallization ◽  
Focused Ion Beam ◽  
Electron Backscatter Diffraction ◽  
Ion Beam ◽  
Bronze Alloy ◽  
Ebsd Data ◽  
Nucleation Sites ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Relationship Of

A combination of electron backscatter diffraction (EBSD) and focused ion beam (FIB) techniques were used to obtain 3D EBSD data in an investigation of dynamic recrystallization in a Cu-2%Sn bronze alloy. The results of this investigation show the origin of the nucleation sites for dynamic recrystallization and also elucidates the orientation relationship of the recrystallized grains to the deformed, prior grains and between the dynamically recrystallized grains.

scholarly journals Hot Deformation Characteristics and Processing Parameter Optimization of Al–6.32Zn–2.10Mg Alloy Using Constitutive Equation and Processing Map

Metals ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 360
Author(s):  
Zhengbing Xiao ◽  
Qiang Wang ◽  
Yuanchun Huang ◽  
Jiawei Hu ◽  
Ming Li
Keyword(s):  
Constitutive Equation ◽  
Dynamic Recrystallization ◽  
Hot Deformation ◽  
Processing Map ◽  
Electron Backscatter Diffraction ◽  
Flow Behavior ◽  
Processing Parameters ◽  
Z Parameter ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Hot compression tests over the temperature range from 350 °C to 500 °C and strain rates range from 0.001 s−1 to 1 s−1 for homogenized Al–6.32Zn–2.10Mg alloy were carried out on a Gleeble-3800 thermal simulation machine to characterize its hot deformation behavior. At the same time, a modified Arrhenius constitutive equation was established to describe the flow behavior of the alloy, whose average absolute error is 2.89%, which proved to have an excellent predictive effect on the flow stress of the alloy. The hot processing map of the alloy was established, and the stability processing parameters were 460–500 °C and 0.01–0.08 s−1. Then, the Z parameter processing map and activation energy processing (AEP) maps were established for further optimization. Eventually, the optimal processing parameters of the alloy was 460–500 °C (0.03–0.08 s−1). Then, the microstructure of specimens was observed using electron backscatter diffraction. Based on the findings the reasonability of the AEP map and Z parameter map was verified. Finally, electron backscatter diffraction (EBSD) techniques were used to analyze the evolution of the grain structure during the deformation process. It was found that dynamic recovery (DRV) was the main softening mechanism of Al–6.32Zn–2.10Mg. Continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX) operated together with the increase of strain, but CDRX was confirmed as the dominant DRX mechanism.

Nucleation and Texture Development during Dynamic Recrystallization of Copper

2005 ◽  
Vol 495-497 ◽  
pp. 1195-1200 ◽  
Author(s):  
D.T. McDonald ◽  
John F. Humphreys ◽  
Pete S. Bate
Keyword(s):  
Dynamic Recrystallization ◽  
Electron Backscatter Diffraction ◽  
Boundary Migration ◽  
Deformation Texture ◽  
Texture Development ◽  
Polycrystalline Copper ◽  
High Angle ◽  
Resolution Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Dynamic recrystallization and texture development in polycrystalline copper have been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 0.7 within the temperature range 200°C to 600°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization in copper was initiated by the bulging of pre-existing high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM). Increasing misorientations from parent to dynamically recrystallizing grains indicated the occurrence of lattice rotations within the bulges, leading, in some cases to the formation of a HAGB behind the bulge. Discrimination between recrystallized and deformed components in material which had partially undergone dynamic recrystallization was carried out, followed by texture analysis. This revealed most of the recrystallized material to have orientations close to that of the deformed material, however, some remote orientations were observed which could not be related to the deformation texture by twin or 40° <111> relationships.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

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