scholarly journals Dynamic recrystallization by subgrain rotation in olivine revealed by high-spatial resolution electron backscatter diffraction

2021 ◽  
Author(s):  
Marco Lopez-Sanchez ◽  
Andrea Tommasi ◽  
Walid Ben Ismail ◽  
Fabrice Barou
Keyword(s):  
Dynamic Recrystallization ◽  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Electron Backscatter Diffraction ◽  
Subgrain Rotation ◽  
Resolution Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Crystallography of craniid brachiopods by electron backscatter diffraction (EBSD)

2007 ◽  
Vol 98 (3-4) ◽  
pp. 437-442 ◽  
Author(s):  
Alberto Pérez-Huerta ◽  
Jennifer England ◽  
Maggie Cusack
Keyword(s):  
Spatial Resolution ◽  
Crystallographic Orientation ◽  
High Spatial Resolution ◽  
Electron Backscatter Diffraction ◽  
Electron Backscatter ◽  
Secondary Layer ◽  
Recent Species ◽  
Oriented Parallel ◽  
Backscatter Diffraction

ABSTRACTElectron backscatter diffraction (EBSD) is used to determine the detailed crystallographic orientation of calcite crystals of craniid brachiopods in the context of shell ultrastructure. Sections of shells of two Recent species, Novocrania anomala and Novocrania huttoni, are analysed to provide 3D crystallographic patterns at high spatial resolution. The c-axis of semi-nacre calcite crystals is oriented parallel to the laminae that define the ultrastructure of the secondary layer. This orientation differs from that of rhynchonelliform calcitic brachiopods where the c-axis is perpendicular to the length of morphological fibres and to the shell exterior.

Nucleation and Texture Development during Dynamic Recrystallization of Copper

2005 ◽  
Vol 495-497 ◽  
pp. 1195-1200 ◽  
Author(s):  
D.T. McDonald ◽  
John F. Humphreys ◽  
Pete S. Bate
Keyword(s):  
Dynamic Recrystallization ◽  
Electron Backscatter Diffraction ◽  
Boundary Migration ◽  
Deformation Texture ◽  
Texture Development ◽  
Polycrystalline Copper ◽  
High Angle ◽  
Resolution Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Dynamic recrystallization and texture development in polycrystalline copper have been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 0.7 within the temperature range 200°C to 600°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization in copper was initiated by the bulging of pre-existing high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM). Increasing misorientations from parent to dynamically recrystallizing grains indicated the occurrence of lattice rotations within the bulges, leading, in some cases to the formation of a HAGB behind the bulge. Discrimination between recrystallized and deformed components in material which had partially undergone dynamic recrystallization was carried out, followed by texture analysis. This revealed most of the recrystallized material to have orientations close to that of the deformed material, however, some remote orientations were observed which could not be related to the deformation texture by twin or 40° <111> relationships.

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