Dynamic recrystallization in the shear bands of Fe–Cr–Ni monocrystal: Electron backscatter diffraction characterization

2008 ◽  
Vol 58 (8) ◽  
pp. 691-694 ◽  
Author(s):  
Yongbo Xu ◽  
H.J. Yang ◽  
Marc André Meyers
Keyword(s):  
Dynamic Recrystallization ◽  
Electron Backscatter Diffraction ◽  
Shear Bands ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Analysis and characterization by electron backscatter diffraction of microstructural evolution in the adiabatic shear bands in Fe–Cr–Ni alloys

2009 ◽  
Vol 24 (8) ◽  
pp. 2617-2627 ◽  
Author(s):  
Huajie Yang ◽  
Yongbo Xu ◽  
Yasuaki Seki ◽  
Vitali F. Nesterenko ◽  
Marc André Meyers
Keyword(s):  
Microstructural Evolution ◽  
Electron Backscatter Diffraction ◽  
Shear Bands ◽  
Adiabatic Shear ◽  
Adiabatic Shear Bands ◽  
Localized Deformation ◽  
Ni Alloys ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Equiaxed Grains

The microstructural evolution inside adiabatic shear bands in Fe–Cr–Ni alloys dynamically deformed (strain rates > 104 s−1) by the collapse of an explosively driven, thick-walled cylinder under prescribed strain conditions was examined by electron backscatter diffraction. The observed structure within the bands consisted of both equiaxed and elongated grains with a size of ∼200 nm. These fine microstructures can be attributed to recrystallization; it is proposed that the elongated grains may be developed simultaneously with localized deformation (dynamic recrystallization), and the equiaxed grains may be formed subsequently to deformation (static recrystallization). These recrystallized structures can be explained by a rotational recrystallization mechanism.

A 3D FIB Investigation of Dynamic Recrystallization in a Cu-Sn Bronze

2012 ◽  
Vol 715-716 ◽  
pp. 498-501 ◽  
Author(s):  
Ali Gholinia ◽  
Ian Brough ◽  
John F. Humphreys ◽  
Pete S. Bate
Keyword(s):  
Dynamic Recrystallization ◽  
Focused Ion Beam ◽  
Electron Backscatter Diffraction ◽  
Ion Beam ◽  
Bronze Alloy ◽  
Ebsd Data ◽  
Nucleation Sites ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Relationship Of

A combination of electron backscatter diffraction (EBSD) and focused ion beam (FIB) techniques were used to obtain 3D EBSD data in an investigation of dynamic recrystallization in a Cu-2%Sn bronze alloy. The results of this investigation show the origin of the nucleation sites for dynamic recrystallization and also elucidates the orientation relationship of the recrystallized grains to the deformed, prior grains and between the dynamically recrystallized grains.

Microstructure and Texture of Shear Bands in Cold Rolled Silicon Steel Single Crystals of Goss Orientation

2005 ◽  
Vol 105 ◽  
pp. 239-244 ◽  
Author(s):  
Dorothée Dorner ◽  
Stefan Zaefferer
Keyword(s):  
Deformation Mechanism ◽  
Crystal Orientation ◽  
Electron Backscatter Diffraction ◽  
Shear Bands ◽  
Silicon Steel ◽  
Crystallographic Slip ◽  
Electron Backscatter ◽  
Cold Rolled ◽  
Goss Orientation ◽  
Backscatter Diffraction

An initially Goss-oriented ({110}<001> preferred crystal orientation) FeSi single crystal was cold rolled up to 89 % reduction in thickness. The microstructure and texture of shear bands, which develop at strains higher than 70 %, were investigated by the EBSD (electron backscatter diffraction) technique. The texture components within and ouside of the shear bands are the two symmetrical {111}<112> orientations and the {110}<001> orientation. We conclude that crystallographic slip is the deformation mechanism that is active both within and outside of the shear bands.

scholarly journals Hot Deformation Characteristics and Processing Parameter Optimization of Al–6.32Zn–2.10Mg Alloy Using Constitutive Equation and Processing Map

Metals ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 360
Author(s):  
Zhengbing Xiao ◽  
Qiang Wang ◽  
Yuanchun Huang ◽  
Jiawei Hu ◽  
Ming Li
Keyword(s):  
Constitutive Equation ◽  
Dynamic Recrystallization ◽  
Hot Deformation ◽  
Processing Map ◽  
Electron Backscatter Diffraction ◽  
Flow Behavior ◽  
Processing Parameters ◽  
Z Parameter ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Hot compression tests over the temperature range from 350 °C to 500 °C and strain rates range from 0.001 s−1 to 1 s−1 for homogenized Al–6.32Zn–2.10Mg alloy were carried out on a Gleeble-3800 thermal simulation machine to characterize its hot deformation behavior. At the same time, a modified Arrhenius constitutive equation was established to describe the flow behavior of the alloy, whose average absolute error is 2.89%, which proved to have an excellent predictive effect on the flow stress of the alloy. The hot processing map of the alloy was established, and the stability processing parameters were 460–500 °C and 0.01–0.08 s−1. Then, the Z parameter processing map and activation energy processing (AEP) maps were established for further optimization. Eventually, the optimal processing parameters of the alloy was 460–500 °C (0.03–0.08 s−1). Then, the microstructure of specimens was observed using electron backscatter diffraction. Based on the findings the reasonability of the AEP map and Z parameter map was verified. Finally, electron backscatter diffraction (EBSD) techniques were used to analyze the evolution of the grain structure during the deformation process. It was found that dynamic recovery (DRV) was the main softening mechanism of Al–6.32Zn–2.10Mg. Continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX) operated together with the increase of strain, but CDRX was confirmed as the dominant DRX mechanism.

Nucleation and Texture Development during Dynamic Recrystallization of Copper

2005 ◽  
Vol 495-497 ◽  
pp. 1195-1200 ◽  
Author(s):  
D.T. McDonald ◽  
John F. Humphreys ◽  
Pete S. Bate
Keyword(s):  
Dynamic Recrystallization ◽  
Electron Backscatter Diffraction ◽  
Boundary Migration ◽  
Deformation Texture ◽  
Texture Development ◽  
Polycrystalline Copper ◽  
High Angle ◽  
Resolution Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction

Dynamic recrystallization and texture development in polycrystalline copper have been investigated. Specimens were deformed in channel-die plane strain compression to true strains from 0.1 to 0.7 within the temperature range 200°C to 600°C, and the resulting microstructures were investigated with the use of high resolution electron backscatter diffraction (EBSD). Dynamic recrystallization in copper was initiated by the bulging of pre-existing high angle grain boundaries (HAGB), and occurred primarily by strain induced boundary migration (SIBM). Increasing misorientations from parent to dynamically recrystallizing grains indicated the occurrence of lattice rotations within the bulges, leading, in some cases to the formation of a HAGB behind the bulge. Discrimination between recrystallized and deformed components in material which had partially undergone dynamic recrystallization was carried out, followed by texture analysis. This revealed most of the recrystallized material to have orientations close to that of the deformed material, however, some remote orientations were observed which could not be related to the deformation texture by twin or 40° <111> relationships.

Evolution of Recrystallization Texture in Non-Oriented Electrical Steel Containing Copper

2012 ◽  
Vol 502 ◽  
pp. 243-246
Author(s):  
Di Nan ◽  
Yan Ping Zeng ◽  
Guan Qiao Hu ◽  
Zi Yu Zhou
Keyword(s):  
Growth Rate ◽  
Annealing Time ◽  
Recrystallization Texture ◽  
Electrical Steel ◽  
Electron Backscatter Diffraction ◽  
Shear Bands ◽  
Electron Backscatter ◽  
Backscatter Diffraction

The evolution of recrystallization texture in the non-orientation electrical steel containing copper during annealing at 950°C for 3～180s have been studied by EBSD (Electron Backscatter Diffraction) measurements. Goss grains({011}) are nucleated within shear bands in deformed {111} and{111} grains. {111} grains nucleate in deformed {111} grains and new{111} grains nucleate in deformed {111}grains. {111} grains have an evident advantage both in number and growth rate over α grains, thus the controlling of annealing time can contribute to the increase of {011} texture.

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