scholarly journals Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement

2016 ◽  
Vol 59 ◽  
pp. 73-83 ◽  
Author(s):  
Mohd. Amir Eleffendi ◽  
Li Yang ◽  
Pearl Agyakwa ◽  
C. Mark Johnson
EPE Journal ◽  
2000 ◽  
Vol 9 (3-4) ◽  
pp. 7-16
Author(s):  
F. Profumo ◽  
A. Tenconi ◽  
S. Facelli ◽  
B. Passerini ◽  
A. Guerra

Author(s):  
Mathias Ziegler ◽  
Fritz Weik ◽  
Jens W. Tomm ◽  
Thomas Elsaesser ◽  
Wlodzimierz Nakwaski ◽  
...  

2016 ◽  
Vol 63 (6) ◽  
pp. 2431-2435 ◽  
Author(s):  
Vitaliy Ivanovich Smirnov ◽  
Viacheslav Anreevich Sergeev ◽  
Andrey Anatolievich Gavrikov

2012 ◽  
Vol 16 (2) ◽  
pp. 623-627 ◽  
Author(s):  
Jordan Hristov

Simple 1-D semi-infinite heat conduction problems enable to demonstrate the potential of the fractional calculus in determination of transient thermal impedances of two bodies with different initial temperatures contacting at the interface ( x = 0 ) at t = 0 . The approach is purely analytic and uses only semi-derivatives (half-time) and semi-integrals in the Riemann-Liouville sense. The example solved clearly reveals that the fractional calculus is more effective in calculation the thermal resistances than the entire domain solutions.


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