Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement
2016 ◽
Vol 59
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pp. 73-83
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2015 ◽
Vol 55
(12)
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pp. 2575-2581
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Keyword(s):
2016 ◽
Vol 63
(6)
◽
pp. 2431-2435
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2010 ◽
Vol 25
(6)
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pp. 1395-1405
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Keyword(s):
Keyword(s):