Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules

2015 ◽  
Vol 55 (12) ◽  
pp. 2575-2581 ◽  
Author(s):  
Hanguang Zheng ◽  
Khai D.T. Ngo ◽  
Guo-Quan Lu
Keyword(s):  
Impedance Measurement ◽  
Thermal Characterization ◽  
Thermal Impedance ◽  
Igbt Modules ◽  
Power Cycling ◽  
Transient Thermal

scholarly journals Thermal impedance at the interface of contacting bodies: 1-D examples solved by semi-derivatives

2012 ◽  
Vol 16 (2) ◽  
pp. 623-627 ◽  
Author(s):  
Jordan Hristov
Keyword(s):  
Heat Conduction ◽  
Fractional Calculus ◽  
Half Time ◽  
Thermal Impedance ◽  
Entire Domain ◽  
Transient Thermal ◽  
Two Bodies

Simple 1-D semi-infinite heat conduction problems enable to demonstrate the potential of the fractional calculus in determination of transient thermal impedances of two bodies with different initial temperatures contacting at the interface ( x = 0 ) at t = 0 . The approach is purely analytic and uses only semi-derivatives (half-time) and semi-integrals in the Riemann-Liouville sense. The example solved clearly reveals that the fractional calculus is more effective in calculation the thermal resistances than the entire domain solutions.

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