Sensitivity analysis of simplified Printed Circuit Board finite element models

2009 ◽  
Vol 49 (7) ◽  
pp. 791-799 ◽  
Author(s):  
Robin Alastair Amy ◽  
G.S. Aglietti ◽  
Guy Richardson
Keyword(s):  
Sensitivity Analysis ◽  
Finite Element ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Finite Element Models ◽  
Printed Circuit

Accuracy of simplified printed circuit board finite element models

2010 ◽  
Vol 50 (1) ◽  
pp. 86-97 ◽  
Author(s):  
Robin Alastair Amy ◽  
Guglielmo S. Aglietti ◽  
Guy Richardson
Keyword(s):  
Finite Element ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Finite Element Models ◽  
Printed Circuit

Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test

2009 ◽  
Vol 419-420 ◽  
pp. 37-40
Author(s):  
Shiuh Chuan Her ◽  
Shien Chin Lan ◽  
Chun Yen Liu ◽  
Bo Ren Yao
Keyword(s):  
Finite Element ◽  
Experimental Measurement ◽  
Test Specimen ◽  
Printed Circuit Board ◽  
Drop Impact ◽  
Simulation Technique ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Impact

Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-DYNA is applied to compute the impact acceleration and dynamic strain on the test specimen during the drop impact. The finite element results are compared to the experimental measurement of acceleration with good correlation between simulation and drop testing. With the accurate simulation technique, one is capable of predicting the impact response and characterizing the failure mode prior to real reliability test.

Optimal Chip Layout on a Printed Circuit Board Using Design Sensitivity Analysis of Subdomain Configuration

1995 ◽  
Vol 117 (4) ◽  
pp. 275-280 ◽  
Author(s):  
Seo Jin Joo ◽  
Byung Man Kwak
Keyword(s):  
Sensitivity Analysis ◽  
Printed Circuit Board ◽  
Adjoint System ◽  
Design Sensitivity ◽  
Design Sensitivity Analysis ◽  
Circuit Board ◽  
Material Derivative ◽  
Printed Circuit ◽  
Shape Design Sensitivity ◽  
Design Velocity

A chip layout problem is formulated as a new class of shape optimal design called a subdomain optimization, where the chips correspond to subdomains whose configuration and location are to be decided. Shape design sensitivity analysis for a perturbed subdomain is made based on the concept of material derivative and adjoint system. Introducing a suitable category of design velocity fields, the change of the configuration is adequately describable. Sensitivities and optimal positions of chips on a printed circuit board are obtained and their accuracy discussed.

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