Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages

2006 ◽  
Vol 46 (8) ◽  
pp. 1357-1368 ◽  
Author(s):  
Yi-Shao Lai ◽  
Chin-Li Kao
Keyword(s):  
Joule Heating ◽  
Flip Chip ◽  
Current Crowding ◽  
Coupling Analysis

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

2012 ◽  
Vol 111 (4) ◽  
pp. 043705 ◽  
Author(s):  
Y. C. Liang ◽  
W. A. Tsao ◽  
Chih Chen ◽  
Da-Jeng Yao ◽  
Annie T. Huang ◽  
...  
Keyword(s):  
Joule Heating ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Heating Effects

Nanoscale Joule heating, Peltier cooling and current crowding at graphene–metal contacts

2011 ◽  
Vol 6 (5) ◽  
pp. 287-290 ◽  
Author(s):  
Kyle L. Grosse ◽  
Myung-Ho Bae ◽  
Feifei Lian ◽  
Eric Pop ◽  
William P. King
Keyword(s):  
Joule Heating ◽  
Current Crowding ◽  
Metal Contacts ◽  
Peltier Cooling

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

2009 ◽  
Vol 38 (12) ◽  
pp. 2443-2448 ◽  
Author(s):  
S. W. Liang ◽  
Hsiang-Yao Hsiao ◽  
Chih Chen ◽  
Luhua Xu ◽  
K. N. Tu ◽  
...  
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Negative Marker

Bump Electromigration and Back End Design Rules

2007 ◽  
Author(s):  
Vishal Nagaraj ◽  
Saket Karajgikar ◽  
Dereje Agonafer ◽  
Senol Pekin
Keyword(s):  
Flip Chip ◽  
Heat Dissipation ◽  
High Current Density ◽  
Electrical Performance ◽  
High Current ◽  
Current Crowding ◽  
Element Analysis ◽  
Chip Technology ◽  
Flip Chip Packaging ◽  
Current Densities

As there is continuous demand for miniaturization of electronic devices, flip chip technology is predominantly used for high density packaging. The technology offers several advantages like excellent electrical performance and better heat dissipation ability. Original invention of flip chip packaging utilized ceramic substrates and high lead bumps. Low cost commercialization of this packaging technology, however, required organic laminate substrates coupled with SnPb eutectic bumped interconnects on the die side. While organic laminate flip chip packaging may be a good option for many low power applications, current carrying capability of the eutectic bumped interconnect causes a catastrophic failure mechanism called electromigration. Previously, researchers have identified and addressed few issues regarding electromigration. Electomigration leads to the formation of metal voids in the conductors which eventually increases the resistance drop across the conductor causing electrical opens. Electromigration is very significant at high current densities. Temperature is the other parameter of concern for electromigration. High current density causes temperature to rise due to Joule heating, there by reducing the life of package. In order to determine the factors responsible for high current densities, we formed a full factorial design of experiments (DOE) that contained parameters such as passivation opening, UBM size, UBM thickness and trace width. Finite Element Analysis (FEA) was performed in order to study the effect of above parameters on current crowding and temperature in the bumped interconnects. Based on the results, hierarchy of the most important parameters to be considered while selecting the appropriate flip chip technology is proposed.

Effects of Current Crowding and Joule Heating on Reliability of Solder Joints

2007 ◽  
Author(s):  
S. W. Liang ◽  
S. H. Chiu ◽  
Chih Chen ◽  
Shinichi Ogawa ◽  
Paul S. Ho ◽  
...  
Keyword(s):  
Joule Heating ◽  
Solder Joints ◽  
Current Crowding ◽  
Reliability Of Solder Joints
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