Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

2006 ◽  
Author(s):  
Mingyu Li ◽  
Hongjun Ji ◽  
Chunqing Wang
Keyword(s):  
Interface Reaction ◽  
Bond Interface ◽  
Wedge Bonding

Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process

2007 ◽  
Vol 182 (1-3) ◽  
pp. 202-206 ◽  
Author(s):  
Hongjun Ji ◽  
Mingyu Li ◽  
Chunqing Wang ◽  
Jingwei Guan ◽  
Han Sur Bang
Keyword(s):  
Bonding Process ◽  
Bond Interface ◽  
Wedge Bonding

Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method

2008 ◽  
Vol 580-582 ◽  
pp. 173-176
Author(s):  
Hee Seon Bang ◽  
Hong Jun Ji ◽  
Ming Yu Li ◽  
Chun Qing Wang ◽  
Han Sur Bang
Keyword(s):  
Copper Substrate ◽  
Bonding Mechanism ◽  
Aluminum Wire ◽  
X Ray ◽  
Interfacial Composition ◽  
Bond Center ◽  
Bond Interface ◽  
Fracture Study ◽  
Wedge Bonding ◽  
Peeling Off

In this paper, the characteristics of bond interface and bonding mechanism were investigated with peeling-off method. The fracture was observed and interfacial composition was certified by map scanning of EDX (Energy dispersive X-ray analysis). Based on the features of interfacial characters, the actual joining area mainly distributed at bond periphery; non-bonded at bond center. When the bonding time was lower, the ratio of the bond length to its width was larger and elemental aluminum distributed discontinuously on the bond fracture, primarily at the periphery. After aging, the fractures were also analyzed and Cu2Al3 intermetallic compound (IMC) was identified. The phenomena of bond interfacial tracings were analyzed, and the bonding mechanism was ascribed to plastic flow analyzed by finite element method based on the contact issues.

Copper to Aluminum Bonding: IMC Characterization through New Mechanical Sectioning Methods

2010 ◽  
Author(s):  
Lucas Copeland ◽  
Mukul Saran
Keyword(s):  
Intermetallic Compound ◽  
Imaging Study ◽  
Thermal Ageing ◽  
Initial Model ◽  
Growth Morphology ◽  
Intermetallic Formation ◽  
Imaging Parameters ◽  
Bonded Interface ◽  
Bond Interface ◽  
Sem Imaging

Abstract This paper presents a mechanical cross-sectioning approach that produces an image clarity not yet demonstrated in published literature. It demonstrates how a critical sequence of polishing, basic slurry optimization and staining, in conjunction with correct imaging parameters can be used to highlight the growth morphology of the intermetallic compound (IMCs). Utilizing this approach, the paper describes the results of a SEM imaging study of the intermetallic formation and growth at the Cu-Al bond interface during thermal ageing for up to 4000hrs at 150 deg C. The paper uses direct SEM imaging to catalog observations which are used to create an initial model for IMC and void growth at the wire bonded interface. It examines the effect of aluminum splash and concludes that growth of intermetallics at the Cu-Al interface is rapid into the bond-pad aluminum than into the Cu-ball, but the growth thickness uniformity is much higher into the Cu-ball.

scholarly journals Artificial dual solid-electrolyte interfaces based on in situ organothiol transformation in lithium sulfur battery

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Wei Guo ◽  
Wanying Zhang ◽  
Yubing Si ◽  
Donghai Wang ◽  
Yongzhu Fu ◽  
...  
Keyword(s):  
Solid Electrolyte ◽  
Interface Reaction ◽  
Interfacial Instability ◽  
Anode Surface ◽  
Commercial Application ◽  
Lithium Metal ◽  
Metal Anode ◽  
Lithium Metal Anode ◽  
Lithium Sulfur

AbstractThe interfacial instability of the lithium-metal anode and shuttling of lithium polysulfides in lithium-sulfur (Li-S) batteries hinder the commercial application. Herein, we report a bifunctional electrolyte additive, i.e., 1,3,5-benzenetrithiol (BTT), which is used to construct solid-electrolyte interfaces (SEIs) on both electrodes from in situ organothiol transformation. BTT reacts with lithium metal to form lithium 1,3,5-benzenetrithiolate depositing on the anode surface, enabling reversible lithium deposition/stripping. BTT also reacts with sulfur to form an oligomer/polymer SEI covering the cathode surface, reducing the dissolution and shuttling of lithium polysulfides. The Li–S cell with BTT delivers a specific discharge capacity of 1,239 mAh g−1 (based on sulfur), and high cycling stability of over 300 cycles at 1C rate. A Li–S pouch cell with BTT is also evaluated to prove the concept. This study constructs an ingenious interface reaction based on bond chemistry, aiming to solve the inherent problems of Li–S batteries.

scholarly journals Langmuir Adsorption Kinetics in Liquid Media: Interface Reaction Model

ACS Omega ◽  
2021 ◽  
Author(s):  
Md Akhtarul Islam ◽  
Myisha Ahmed Chowdhury ◽  
Md. Salatul Islam Mozumder ◽  
Md. Tamez Uddin
Keyword(s):  
Adsorption Kinetics ◽  
Interface Reaction ◽  
Reaction Model ◽  
Liquid Media ◽  
Langmuir Adsorption

scholarly journals Interface Behavior of Brazing between Zr-Cu Filler Metal and SiC Ceramic

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 727
Author(s):  
Bofang Zhou ◽  
Taohua Li ◽  
Hongxia Zhang ◽  
Junliang Hou
Keyword(s):  
Interfacial Reaction ◽  
Reaction Layer ◽  
Chemical Potential ◽  
Filler Metal ◽  
Diffusion Constant ◽  
Interface Reaction ◽  
Diffusion Path ◽  
Interface Behavior ◽  
Interfacial Reaction Layer ◽  
Sic Ceramic

The interface behavior of brazing between Zr-Cu filler metal and SiC ceramic was investigated. Based on the brazing experiment, the formation of brazing interface products was analyzed using OM, SEM, XRD and other methods. The stable chemical potential phase diagram was established to analyze the possible diffusion path of interface elements, and then the growth behavior of the interface reaction layer was studied by establishing relevant models. The results show that the interface reaction between the active element Zr and SiC ceramic is the main reason in the brazing process the interface products are mainly ZrC and Zr2Si and the possible diffusion path of elements in the product formation process is explained. The kinetic equation of interfacial reaction layer growth is established, and the diffusion constant (2.1479 μm·s1/2) and activation energy (42.65 kJ·mol−1) are obtained. The growth kinetics equation of interfacial reaction layer thickness with holding time at different brazing temperatures is obtained.

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