Recent status of fabrication technology development of water cooled ceramic breeder test blanket module in Japan

2011 ◽  
Vol 86 (9-11) ◽  
pp. 2265-2268 ◽  
Author(s):  
Takanori Hirose ◽  
Hisashi Tanigawa ◽  
Akira Yoshikawa ◽  
Yohji Seki ◽  
Daigo Tsuru ◽  
...  
Keyword(s):  
Technology Development ◽  
Fabrication Technology

Fabrication technology development and characterization of tritium permeation barriers by a liquid phase method

2018 ◽  
Vol 136 ◽  
pp. 215-218 ◽  
Author(s):  
Takumi Chikada ◽  
Moeki Matsunaga ◽  
Seira Horikoshi ◽  
Jumpei Mochizuki ◽  
Hikari Fujita ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Technology Development ◽  
Phase Method ◽  
Fabrication Technology ◽  
Liquid Phase Method ◽  
Tritium Permeation

Advancements in Through Glass Via (TGV) Technology

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001343-001363
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Scott Pollard ◽  
Ekatarina Kuksenkova ◽  
Gene Smith
Keyword(s):  
Technology Development ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Mechanical Reliability ◽  
Fabrication Technology ◽  
High Frequencies ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The material properties give many opportunities. As an insulator, glass provides advantages in providing low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks. Forming processes allow the potential to both form in panel format as well as to form at thicknesses as low as 100 um, giving opportunities to provide cost-effective solutions for the industry. Via fabrication technology development continues to advance providing via diameters < 20 um in size in production ready environment. [1–5] As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. There also continues to be increasing amounts of data showing the ability to achieve electrical and thermo-mechanical reliability of substrates with TGV and latest data here will also be provided.

Recent Development of Microceramic Reactors for Advanced Ceramic Reactor System

2010 ◽  
Vol 7 (3) ◽  
Author(s):  
Toshio Suzuki ◽  
Toshiaki Yamaguchi ◽  
Yoshinobu Fujishiro ◽  
Masanobu Awano ◽  
Yoshihiro Funahashi
Keyword(s):  
High Performance ◽  
Technology Development ◽  
Fabrication Technology ◽  
Power Sources ◽  
Power Generators ◽  
Development Organization ◽  
Advanced Ceramic ◽  
New Energy ◽  
Auxiliary Power Units ◽  
Ceramic Reactors

Ceramic reactors, which convert materials and energy electrochemically, are expected to solve various environmental problems, and the use of a microreactor design was shown to realize a high performance reactor with high thermal durability, operable at lower temperatures. Our research project, “Advanced Ceramic Reactor,” supported by the New Energy and Industrial Technology Development Organization, targets to develop new fabrication technology for such microreactors and modules using conventional, commercially available materials. In this study, fabrication technology of microtubular ceramic reactors have been investigated for aiming solid oxide fuel cell (SOFC) applications such as small distributed power generators, auxiliary power units for vehicles, and portable power sources. So far, microtubular SOFCs under a diameter of 1 mm using doped ceria electrolyte, and Ni–ceria based cermet for tubular support has been successfully developed and evaluated. The single microtubular SOFC showed a cell performance of 0.46 W/cm2 (at 0.7 V) at 550°C with H2 fuel. The bundle design for such tubular cell was also proposed and fabricated. The discussion will cover the fabrication technology of a single tubular SOFC and bundle, and the optimization of the cell and bundle design by considering gas pressure loss and current collecting loss.

Some applications of electron beam microanalysis techniques in VLSI process evaluation

1983 ◽  
Vol 41 ◽  
pp. 160-161
Author(s):  
Simon Thomas
Keyword(s):  
Integrated Circuits ◽  
Process Evaluation ◽  
Large Scale ◽  
Technology Development ◽  
Analytical Techniques ◽  
Successful Implementation ◽  
Analysis Of Failures ◽  
Characterization Of Materials ◽  
Circuits Vlsi

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.

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