Laser-induced front side etching of fused silica with XeF excimer laser using thin metal layers

2012 ◽  
Vol 258 (23) ◽  
pp. 9138-9142 ◽  
Author(s):  
Pierre Lorenz ◽  
Martin Ehrhardt ◽  
Anja Wehrmann ◽  
Klaus Zimmer
Keyword(s):  
Excimer Laser ◽  
Fused Silica ◽  
Thin Metal ◽  
Front Side ◽  
Metal Layers

Laser-induced front side etching of fused silica with KrF excimer laser using thin chromium layers

2012 ◽  
Vol 209 (6) ◽  
pp. 1114-1118 ◽  
Author(s):  
Pierre Lorenz ◽  
Martin Ehrhardt ◽  
Klaus Zimmer
Keyword(s):  
Excimer Laser ◽  
Fused Silica ◽  
Front Side ◽  
Thin Chromium ◽  
Krf Excimer Laser

scholarly journals Textures of Au, Pt and Pd/PdO nanoparticles thermally dewetted from thin metal layers on fused silica

RSC Advances ◽  
2014 ◽  
Vol 4 (89) ◽  
pp. 48135-48143 ◽  
Author(s):  
Michael Kracker ◽  
Wolfgang Wisniewski ◽  
Christian Rüssel
Keyword(s):  
Fused Silica ◽  
Thin Metal ◽  
Nano Particles ◽  
Metal Nano Particles ◽  
Metal Layers

This article shows that multiple crystallographic textures coexist in thermally dewetted metal nano particles in contrast to the usually assumed or presented 111 texture.

Automatic Determination of Optimal FIB Operations for Improved Circuit Probing and Fast Reconfiguration

2000 ◽  
Author(s):  
Romain Desplats ◽  
Timothee Dargnies ◽  
Jean-Christophe Courrege ◽  
Philippe Perdu ◽  
Jean-Louis Noullet
Keyword(s):  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Semiconductor Devices ◽  
Front Side ◽  
Automatic Determination ◽  
Metal Line ◽  
New Approach ◽  
Metal Layers

Abstract Focused Ion Beam (FIB) tools are widely used for Integrated Circuit (IC) debug and repair. With the increasing density of recent semiconductor devices, FIB operations are increasingly challenged, requiring access through 4 or more metal layers to reach a metal line of interest. In some cases, accessibility from the front side, through these metal layers, is so limited that backside FIB operations appear to be the most appropriate approach. The questions to be resolved before starting frontside or backside FIB operations on a device are: 1. Is it do-able, are the metal lines accessible? 2. What is the optimal positioning (e.g. accessing a metal 2 line is much faster and easier than digging down to a metal 6 line)? (for the backside) 3. What risk, time and cost are involved in FIB operations? In this paper, we will present a new approach, which allows the FIB user or designer to calculate the optimal FIB operation for debug and IC repair. It automatically selects the fastest and easiest milling and deposition FIB operations.

A Novel Deprocessing Technique for Revealing Transistor-Level Damage on 7nm FinFET Devices

2020 ◽  
Author(s):  
Fei Long Xu ◽  
Phoumra Tan ◽  
Dan Nuez
Keyword(s):  
High Resolution ◽  
Flip Chip ◽  
Fault Localization ◽  
Wet Etching ◽  
Efficient Technique ◽  
Solid Immersion Lens ◽  
Front Side ◽  
Flip Chip Packaging ◽  
Metal Layers

Abstract Physical FA innovations in advanced flip-chip devices are essential, especially for die-level defects. Given the increasing number of metal layers, traditional front-side deprocessing requires a lot of work on parallel lapping and wet etching before reaching the transistor level. Therefore, backside deprocessing is often preferred for checking transistor-level defects, such as subtle ESD damage. This paper presents an efficient technique that involves precise, automated die thinning (from 760µm to 5µm), high-resolution fault localization using a solid immersion lens, and rigorous KOH etch. Using this technique, transistor-level damage was revealed on advanced 7nm FinFET devices with flip-chip packaging.

Application Study on Fused Silica Prisms in Excimer Laser Spectrum Control

2013 ◽  
Vol 40 (4) ◽  
pp. 0402008
Author(s):  
单耀莹 Shan Yaoying ◽  
赵江山 Zhao Jiangshan ◽  
李慧 Li Hui ◽  
王倩 Wang Qian ◽  
沙鹏飞 Sha Pengfei ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Fused Silica ◽  
Application Study ◽  
Laser Spectrum ◽  
Spectrum Control

Dependence of the damage and transmission properties of fused silica fibers on the excimer laser wavelength

1988 ◽  
Vol 27 (15) ◽  
pp. 3124 ◽  
Author(s):  
Rod S. Taylor ◽  
Kurt E. Leopold ◽  
Robert K. Brimacombe ◽  
Stephen Mihailov
Keyword(s):  
Excimer Laser ◽  
Laser Wavelength ◽  
Fused Silica ◽  
Transmission Properties ◽  
Silica Fibers
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