Effect of the methods of obtaining silicon carbide on the thermophysical properties of the materials based on it

1990 ◽  
Vol 47 (12) ◽  
pp. 473-476
Author(s):  
L. M. Silich ◽  
A. A. Sitnov ◽  
U. A. Tsielen ◽  
I. V. Kavrus ◽  
S. A. Lobzov
Keyword(s):  
Silicon Carbide ◽  
Thermophysical Properties

The Thermal Expansion Behaviors of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 237-240
Author(s):  
K. Azmi ◽  
M.N. Derman ◽  
Mohd Mustafa Al Bakri Abdullah
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Matrix ◽  
Experimental Results ◽  
High Thermal Conductivity ◽  
Coating Process ◽  
Electroless Coating

The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases.

Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging

2005 ◽  
Vol 475-479 ◽  
pp. 1755-1758 ◽  
Author(s):  
J.F. Liang ◽  
J.K. Yu ◽  
Y.Q. Quan
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Significant Influence ◽  
Thermophysical Properties ◽  
Electronic Packaging ◽  
Packaging Materials ◽  
Model And Simulation ◽  
Schapery Model ◽  
Simulation Results

The effects of interfacial thickness and temperature on thermal conductivity and CTEs of Al/SiC packaging materials were investigated. The interfacial thermal conductivity and thickness have significant influence on the thermal conductivity of the Al/SiC packaging materials, while the SiC size has slight influence on that of the Al/SiC packaging materials. The experiment results of thermal conductivity are similar to Hassleman model and simulation results. Schapery model can be used to calculate the CTEs of composites when temperatures are lower(50~100°C) and Kerner model can be used when temperatures are higher(300~450°C). The CTEs of composites will increase more quickly than that by three models when temperatures are between 100°C and 300°C.

Irradiation behavior of pyrolytic silicon carbide

1983 ◽  
Vol 41 ◽  
pp. 72-73
Author(s):  
R. J. Lauf
Keyword(s):  
Silicon Carbide ◽  
Fission Products ◽  
Thermodynamics And Kinetics ◽  
Neutron Fluences ◽  
Fuel Particles ◽  
Sic Coatings ◽  
Irradiation Behavior ◽  
Kinetics Of ◽  
Htgr Fuel

Fuel particles for the High-Temperature Gas-Cooled Reactor (HTGR) contain a layer of pyrolytic silicon carbide to act as a miniature pressure vessel and primary fission product barrier. Optimization of the SiC with respect to fuel performance involves four areas of study: (a) characterization of as-deposited SiC coatings; (b) thermodynamics and kinetics of chemical reactions between SiC and fission products; (c) irradiation behavior of SiC in the absence of fission products; and (d) combined effects of irradiation and fission products. This paper reports the behavior of SiC deposited on inert microspheres and irradiated to fast neutron fluences typical of HTGR fuel at end-of-life.

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