Structure and Thermal Expansion of Cu−90 vol. % Graphite Composites

Copper–graphite composites are promising functional materials exhibiting application potential in electrical equipment and heat exchangers, due to their lower expansion coefficient and high electrical and thermal conductivities. Here, copper–graphite composites with 10–90 vol. % graphite were prepared by hot isostatic pressing, and their microstructure and coefficient of thermal expansion (CTE) were experimentally examined. The CTE decreased with increasing graphite volume fraction, from 17.8 × 10−6 K−1 for HIPed pure copper to 4.9 × 10−6 K−1 for 90 vol. % graphite. In the HIPed pure copper, the presence of cuprous oxide was detected by SEM-EDS. In contrast, Cu–graphite composites contained only a very small amount of oxygen (OHN analysis). There was only one exception, the composite with 90 vol. % graphite contained around 1.8 wt. % water absorbed inside the structure. The internal stresses in the composites were released during the first heating cycle of the CTE measurement. The permanent prolongation and shape of CTE curves were strongly affected by composition. After the release of internal stresses, the CTE curves of composites did not change any further. Finally, the modified Schapery model, including anisotropy and the clustering of graphite, was used to model the dependence of CTE on graphite volume fraction. Modeling suggested that the clustering of graphite via van der Waals bonds (out of hexagonal plane) is the most critical parameter and significantly affects the microstructure and CTE of the Cu–graphite composites when more than 30 vol. % graphite is present.

Modeling of Nonlinear Viscoelastic Creep of Polycarbonate

The creep behavior of a commercial grade polycarbonate was investigated in this study. 10 different constant stresses ranging from 8 MPa to 50 MPa were applied to the specimen, and the resultant creep strains were measured at room temperature. It was found that the creep could be modeled linearly below 15 MPa, and nonlinearly above 15 MPa. Different nonlinear viscoelastic models have been briefly reviewed and used to fit the test data. It is shown that the Findley model is a special case of the Schapery model, and both the Findley model and the simplified multiple integral representation are suitable for properly describing the creep behavior of the polycarbonate investigated in this paper; however, the Findley model fit the data better than the simplified multiple integral with three terms.

Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging

The effects of interfacial thickness and temperature on thermal conductivity and CTEs of Al/SiC packaging materials were investigated. The interfacial thermal conductivity and thickness have significant influence on the thermal conductivity of the Al/SiC packaging materials, while the SiC size has slight influence on that of the Al/SiC packaging materials. The experiment results of thermal conductivity are similar to Hassleman model and simulation results. Schapery model can be used to calculate the CTEs of composites when temperatures are lower(50~100°C) and Kerner model can be used when temperatures are higher(300~450°C). The CTEs of composites will increase more quickly than that by three models when temperatures are between 100°C and 300°C.